| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/13/2002 | US20020071084 Lcd module |
| 06/13/2002 | US20020071082 Display device |
| 06/13/2002 | US20020071066 Compact display assembly |
| 06/13/2002 | US20020070834 Multi-layer and user-configurable micro-printed circuit board |
| 06/13/2002 | US20020070831 Electronic transformer/inductor devices and methods for making same |
| 06/13/2002 | US20020070742 Universal wafer carrier for wafer level die burn-in |
| 06/13/2002 | US20020070665 Wiring substrate and gas discharge display device |
| 06/13/2002 | US20020070460 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 06/13/2002 | US20020070451 Semiconductor device having a ball grid array and method therefor |
| 06/13/2002 | US20020070448 I/C package / thermal-solution retention mechanism with spring effect |
| 06/13/2002 | US20020070442 Chip-type electronic component |
| 06/13/2002 | US20020070437 Intermediate base for a semiconductor module, a semiconductor module using the intermediate base and a method for producing the intermediate base |
| 06/13/2002 | US20020070434 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 06/13/2002 | US20020070423 Thin-film electronic component and motherboard |
| 06/13/2002 | US20020070261 Reflow apparatus |
| 06/13/2002 | US20020070204 Method for making holes in a substrate |
| 06/13/2002 | US20020070120 Composite foil that facilitates handling of ultra-thin copper foil in the production of printed wiring boards |
| 06/13/2002 | US20020070048 Adhesives and adhesive films |
| 06/13/2002 | US20020069736 Cutting apparatus |
| 06/13/2002 | US20020069526 Apparatus for mounting electronic components |
| 06/13/2002 | US20020069523 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder and method of mounting the same |
| 06/13/2002 | US20020069518 Processing assembly and method |
| 06/13/2002 | US20020069510 Head gimbal assembly method |
| 06/13/2002 | DE10129482A1 Steckverbinder Connectors |
| 06/13/2002 | DE10112355C1 Temperature-sensitive electronic component mounting method uses removable protection device for protecting component during mounting process |
| 06/13/2002 | DE10061840A1 Device has connecting pin with essentially straight soldering surface perpendicular to end surface formed by stamping pin with cut surface oriented away from soldering surface |
| 06/13/2002 | DE10060407A1 Laser beam boring device e.g. for boring blind holes in multi layer circuit boards, uses frequency-sensitive plasma radiation detector for detecting radiation intensity during boring of holes |
| 06/13/2002 | DE10059419A1 Stanzgitter mit Befestigungselement Pressed screen with bracket |
| 06/13/2002 | DE10059176A1 Intermediate carrier for semiconductor module has its lower surface provided with recesses for defining outer terminals cooperating with printed circuit board |
| 06/13/2002 | DE10057494A1 Anordnung auf einem Schaltungsträger und einer Leiterplatte oder einer Leiterplattenanordnung Arrangement on a circuit board and a circuit board or a printed circuit board assembly |
| 06/12/2002 | EP1213953A1 Method and apparatus for manufacturing multilayer printed wiring board |
| 06/12/2002 | EP1213952A2 Circuit substrate and manufacturing method thereof |
| 06/12/2002 | EP1213951A2 Component-mounting method and component-mounting apparatus |
| 06/12/2002 | EP1213770A2 Moulded electronic component |
| 06/12/2002 | EP1213756A2 Fabrication process of semiconductor package and semiconductor package |
| 06/12/2002 | EP1213755A2 Fabrication process of semiconductor package and semiconductor package |
| 06/12/2002 | EP1213754A2 Fabrication process of semiconductor package and semiconductor package |
| 06/12/2002 | EP1213318A1 Fluororesin film of high mechanical strength |
| 06/12/2002 | EP1213089A1 Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| 06/12/2002 | EP1213083A2 Viscous fluid transfer apparatus and method |
| 06/12/2002 | EP1212927A1 A printed circuit board assembly |
| 06/12/2002 | EP1212759A2 Electrical devices and process for making such devices |
| 06/12/2002 | EP1212723A1 Carrier element for an electronic media apparatus |
| 06/12/2002 | EP1212583A1 Device for inspecting a three-dimensional surface structure |
| 06/12/2002 | EP1110277B1 Printed circuit board arrangement with a multipole plug-in connector |
| 06/12/2002 | EP0996523B1 Composition for preventing creeping of a flux for soldering |
| 06/12/2002 | CN1353569A Technology for making high-adhesion PCB without Pb-Sn paste |
| 06/12/2002 | CN1353483A 焊接设备 Welding Equipment |
| 06/11/2002 | USRE37740 Method and apparatus for optical inspection of substrates |
| 06/11/2002 | US6404660 Semiconductor package with a controlled impedance bus and method of forming same |
| 06/11/2002 | US6404643 Article having an embedded electronic device, and method of making same |
| 06/11/2002 | US6404611 Single-chip integrated circuit module |
| 06/11/2002 | US6404476 Device having an improved connective structure between two electrodes |
| 06/11/2002 | US6404315 Surface-mount air-core coil, electronic component having the same, and communication apparatus having the same |
| 06/11/2002 | US6404214 Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device |
| 06/11/2002 | US6404064 Flip-chip bonding structure on substrate for flip-chip package application |
| 06/11/2002 | US6404062 Semiconductor device and structure and method for mounting the same |
| 06/11/2002 | US6404052 Multi-layer flexible printed wiring board |
| 06/11/2002 | US6404047 Socketable BGA package |
| 06/11/2002 | US6404043 Panel stacking of BGA devices to form three-dimensional modules |
| 06/11/2002 | US6403924 Apparatus for and method of heat treatment and substrate processing apparatus |
| 06/11/2002 | US6403920 Laser processing apparatus and method |
| 06/11/2002 | US6403894 Printed wiring board with insect repellant |
| 06/11/2002 | US6403893 Circuit board and a method for making the same |
| 06/11/2002 | US6403892 Coated means for connecting a chip and a card |
| 06/11/2002 | US6403891 Metallization removal under the laser mark area for substrates |
| 06/11/2002 | US6403694 Borosilicate glass powder, crystalline sio2 powder dispersed with photopolymerization initiator, photocurable monomer, and binder comprising an acrylic/modified-cellulosic copolymer having carboxyl group and ethylenic unsaturated side chain |
| 06/11/2002 | US6403457 Selectively coating bond pads |
| 06/11/2002 | US6403401 Heat spreader hole pin 1 identifier |
| 06/11/2002 | US6403272 Circuit-forming charging powder and multilayer wiring board using the same |
| 06/11/2002 | US6403221 Epoxy resin containing phosphorus, phenolic curing agent, bisphenol s phenolic resin and accelerator; heat resistance; peeling strength |
| 06/11/2002 | US6403211 Liquid crystal polymer for flexible circuits |
| 06/11/2002 | US6403201 Substrate material for wiring and substrate material for printed circuit using the same |
| 06/11/2002 | US6403200 Insulator ceramic is composed of an magnesium oxide-magnesium aluminate (mgo-mgal2o4) ceramic powder, and a glass powder containing oxides of silicon, boron and with or without alumina, also contains oxides of 1a, 11a, zinc and copper |
| 06/11/2002 | US6403199 Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts |
| 06/11/2002 | US6403168 Electronics |
| 06/11/2002 | US6403146 Process for the manufacture of printed circuit boards |
| 06/11/2002 | US6403009 Circuit encapsulation |
| 06/11/2002 | US6402970 Method of making a support circuit for a semiconductor chip assembly |
| 06/11/2002 | US6402924 Programmed pulse electroplating process |
| 06/11/2002 | US6402876 Method of forming a monolayer of particles, and products formed thereby |
| 06/11/2002 | US6402866 Powdered metallic sheet method for deposition of substrate conductors |
| 06/11/2002 | US6402574 Solder-holding clips for applying solder to connectors or the like |
| 06/11/2002 | US6402570 Automotive lamp unit and method for manufacturing the same |
| 06/11/2002 | US6402531 Capillary action enhanced surface mount pin header |
| 06/11/2002 | US6402530 Junction box |
| 06/11/2002 | US6402527 Structure for connecting terminals on wiring board |
| 06/11/2002 | US6402526 Microelectronic contact assembly |
| 06/11/2002 | US6402014 Method of forming bumps |
| 06/11/2002 | US6402013 Thermosetting soldering flux and soldering process |
| 06/11/2002 | US6402012 Method for forming solder bumps using a solder jetting device |
| 06/11/2002 | US6402011 Reflow method and reflow device |
| 06/11/2002 | US6401580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 06/11/2002 | US6401332 Processing printed circuits and printed circuits thus obtained |
| 06/11/2002 | US6401330 Apparatus for mounting an integrated circuit onto a printed circuit board and then testing the integrated circuit |
| 06/11/2002 | CA2268294C Board to board interconnect |
| 06/11/2002 | CA2007608C Composition and method for stripping tin or tin-lead alloy from copper surfaces |
| 06/06/2002 | WO2002045471A1 Stamped grid comprising a fastening element |
| 06/06/2002 | WO2002045469A1 Electrical component, arrangement for said component and method for producing said arrangement |
| 06/06/2002 | WO2002045162A2 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer |