| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/20/2002 | US20020073538 Method for assembling a mechatronics sensor |
| 06/20/2002 | DE10148656A1 Schaltungskomponente Circuit component |
| 06/20/2002 | DE10137216A1 Aufschmelzlötvorrichtung Reflow |
| 06/20/2002 | DE10133660A1 Multilayer circuit module for wireless communication system has passive high frequency components and passive base component layer |
| 06/20/2002 | DE10127704A1 Harzformulierung, Verfahren zu ihrer Härtung und ihre Verwendung Resin formulation, method of curing and their use |
| 06/20/2002 | DE10125362A1 Method for mounting an electronic component e.g. microchip on carrier e.g. printed circuit board, involves making simultaneous contact between component's contacts and those of the printed circuit board. |
| 06/20/2002 | DE10062840A1 Durchkontaktierung von flexiblen Leiterplatten Through connection of flexible printed circuits |
| 06/20/2002 | DE10059139A1 Acid aqueous electrolyte, used for coating electronic components with a tin-copper alloy, comprises alkyl sulfonic acids and/or alkanol sulfonic acids, soluble tin (II) salts, soluble copper (II) salts, and organic sulfur compounds |
| 06/20/2002 | DE10058822A1 Process for treating a carrier film made from a plastic or polymer comprises applying a functional layer as conducting path on the film so that material parts enter recesses of the functional layer to anchor the layer in the foil |
| 06/19/2002 | EP1215948A2 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
| 06/19/2002 | EP1215755A1 Connecting structure of electrical component to electrial junction box |
| 06/19/2002 | EP1215726A2 Interconnection method and structure |
| 06/19/2002 | EP1215701A2 Substrate having fine line, electron source and image display apparatus |
| 06/19/2002 | EP1215700A2 Uer ces lignes |
| 06/19/2002 | EP1215087A2 Electrical connection box for a vehicle |
| 06/19/2002 | EP1214741A2 Control device, particularly for use in automotive engineering |
| 06/19/2002 | EP1214198A1 Silk-screen printing machine |
| 06/19/2002 | EP1214191A1 Treated copper foil and process for making treated copper foil |
| 06/19/2002 | EP1214171A1 Excimer laser ablation process control of multilaminate materials |
| 06/19/2002 | EP0778308B1 Aromatic polyamide film, process for producing the same, and magnetic recording medium and solar cell produced by using the same |
| 06/19/2002 | CN2495385Y Apparatus for washing electric circuit plate |
| 06/19/2002 | CN2495384Y Apparatus for washing electric circuit plate |
| 06/19/2002 | CN1354620A Quality maintenance and backtracking system in course of manufacturing printed circuit board |
| 06/19/2002 | CN1354510A Power semiconductor device |
| 06/19/2002 | CN1354280A Corrosion method of metal tin or tin alloy, and corrosion liquor of metal tin or tin alloy |
| 06/19/2002 | CN1354065A Solder or related to improvement of solder |
| 06/19/2002 | CN1086492C Detection tag |
| 06/18/2002 | US6408211 Microcurrent therapy device |
| 06/18/2002 | US6407931 DC to DC converter |
| 06/18/2002 | US6407930 Structure of printed circuit board with stacked daughter board |
| 06/18/2002 | US6407928 LED surface mount |
| 06/18/2002 | US6407927 Method and structure to increase reliability of input/output connections in electrical devices |
| 06/18/2002 | US6407906 Multiterminal-multilayer ceramic capacitor |
| 06/18/2002 | US6407796 Tape carrier package and display device using the same |
| 06/18/2002 | US6407795 Liquid crystal display and its inspecting method |
| 06/18/2002 | US6407652 Adapters for RF connectors |
| 06/18/2002 | US6407458 Moisture-resistant integrated circuit chip package and method |
| 06/18/2002 | US6407363 Laser system and method for single press micromachining of multilayer workpieces |
| 06/18/2002 | US6407345 Printed circuit board and method of production thereof |
| 06/18/2002 | US6407344 Multilayer circuit board |
| 06/18/2002 | US6407343 Multilayer wiring board |
| 06/18/2002 | US6407342 Printed circuit board capable of preventing electrical short during soldering process |
| 06/18/2002 | US6407341 Conductive substructures of a multilayered laminate |
| 06/18/2002 | US6406991 Method of manufacturing a contact element and a multi-layered wiring substrate, and wafer batch contact board |
| 06/18/2002 | US6406990 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
| 06/18/2002 | US6406988 Method of forming fine pitch interconnections employing magnetic masks |
| 06/18/2002 | US6406942 Flip chip type semiconductor device and method for manufacturing the same |
| 06/18/2002 | US6406791 Mixture of titanate and glass |
| 06/18/2002 | US6406778 Multi-thickness, multi-layer green sheet lamination and method thereof |
| 06/18/2002 | US6406774 Electrically conductive composition for use in through hole of electric component |
| 06/18/2002 | US6406746 Microcapsulating conductive metal particles with polymerized monomers |
| 06/18/2002 | US6406541 Method and apparatus for adhering and centering particles to the tacky areas on a surface containing an array of tacky and non-tacky areas |
| 06/18/2002 | US6406326 Wire holding structure |
| 06/18/2002 | US6405920 Enhanced mounting pads for printed circuit boards |
| 06/18/2002 | US6405431 Method for manufacturing build-up multi-layer printed circuit board by using yag laser |
| 06/18/2002 | CA2060563C Process for mounting miniature electronic components with weld connection tabs on a flexible substrate |
| 06/18/2002 | CA2055148C Method of forming an electrically conductive contact on a substrate |
| 06/13/2002 | WO2002047450A1 Circuit board producing method and circuit board producing device |
| 06/13/2002 | WO2002047449A1 Circuit board, electronic equipment using the circuit board, and method of sorting circuit board |
| 06/13/2002 | WO2002047448A2 Attaching devices using polymers |
| 06/13/2002 | WO2002047447A1 Method of forming electrically conductive elements and patterns of such elements |
| 06/13/2002 | WO2002047446A2 Process for selectively plating areas of a substrate |
| 06/13/2002 | WO2002047209A1 Contact structure and production method thereof and probe contact assembly using same |
| 06/13/2002 | WO2002047208A1 Connector |
| 06/13/2002 | WO2002047163A2 Semiconductor device having a ball grid array and method therefor |
| 06/13/2002 | WO2002047148A2 Electrically isolated via in a multilayer ceramic package |
| 06/13/2002 | WO2002046775A1 Conductive contact shoe |
| 06/13/2002 | WO2002046281A1 Resin composite material and method of forming the same |
| 06/13/2002 | WO2002046280A1 Etchant for thermoplastic polyimide resin |
| 06/13/2002 | WO2002046264A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 06/13/2002 | WO2002046263A1 Resin formulation, method for curing the same, and its use |
| 06/13/2002 | WO2002045474A2 Board integrated resilient contact elements array and method of fabrication |
| 06/13/2002 | WO2002032198A3 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device |
| 06/13/2002 | WO2002030166A3 Compliant attachment interface |
| 06/13/2002 | WO2002025797A3 Electronic transformer/inductor devices and methods for making same |
| 06/13/2002 | WO2002023962A3 Method for the formation of a pattern on an insulating substrate |
| 06/13/2002 | WO2000078105A9 Multi-connection via |
| 06/13/2002 | WO2000046877A3 Printed circuit boards with solid interconnect and method of producing the same |
| 06/13/2002 | WO2000045625A3 Method for the direct electroplating of through-holes in printed circuit boards |
| 06/13/2002 | US20020072482 Such as sodium polyacrylate in excess alkali; removal of conductive paste residue from screening masks used in ceramic semiconductor substrate manufacture |
| 06/13/2002 | US20020072257 Electrical connection box for a vehicle |
| 06/13/2002 | US20020072216 Polyimide substrate is formed with a solder bump, directly heating and compressing so the bump and solder pad are bound and connected electrically |
| 06/13/2002 | US20020072215 Method for forming barrier layers for solder bumps |
| 06/13/2002 | US20020072213 Method of fabricating soldering balls for semiconductor encapsulation |
| 06/13/2002 | US20020072205 Ultraviolet/electron beam forming process for multi-layer electronic components and products thereof |
| 06/13/2002 | US20020072151 Method of producing mounting structure and mounting structure produced by the same |
| 06/13/2002 | US20020072148 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 06/13/2002 | US20020072145 Semiconductor device |
| 06/13/2002 | US20020071961 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 06/13/2002 | US20020071940 Multi-layered structures and methods for manufacturing the multi-layered structures |
| 06/13/2002 | US20020071935 Provides contact surface between the solder pad and solder paste to produce wetting effect, for forming strong bonding force and enhancing conductivity |
| 06/13/2002 | US20020071901 Using a source of laser energy, a receiving substrate, and a target substrate |
| 06/13/2002 | US20020071772 Highly-viscous-fluid applying apparatus capable of controlling delivery amount of fluid |
| 06/13/2002 | US20020071642 Installation structure and method for optical parts and electric parts |
| 06/13/2002 | US20020071602 Component-mounting method and component-mounting apparatus |
| 06/13/2002 | US20020071263 Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout |
| 06/13/2002 | US20020071260 Electronic board assembly including two elementary boards each carrying connectors on an edge thereof |
| 06/13/2002 | US20020071259 Circuit board assembly |
| 06/13/2002 | US20020071258 High performance capacitor |
| 06/13/2002 | US20020071085 Method for interconnecting a flat panel display having a non-transparent substrate and devices formed |