| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/25/2002 | US6410854 Wire and solder arrangement of ease of wave soldering |
| 06/25/2002 | US6410355 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 06/25/2002 | US6410201 Thermal transfer element and process for forming organic electroluminescent devices |
| 06/25/2002 | US6410178 Separator of fuel cell and method for producing same |
| 06/25/2002 | US6410145 Thermosetting resin composition for build-up |
| 06/25/2002 | US6409930 Lamination of circuit sub-elements while assuring registration |
| 06/25/2002 | US6409869 Dehumidification |
| 06/25/2002 | US6409866 Process for mounting semiconductor device |
| 06/25/2002 | US6409540 Connector having a guide rib with a hollowed groove portion |
| 06/25/2002 | US6409523 Terminal legs of connectors |
| 06/25/2002 | US6409522 Circuit and busboard connection for an electrical connection box |
| 06/25/2002 | US6409520 Structure and method for interconnection of printed circuit boards |
| 06/25/2002 | US6409363 Control and signaling device or signaling device with a luminous element |
| 06/25/2002 | US6409347 Projector, circuit board, and electronic device provided with said circuit board |
| 06/25/2002 | US6409138 Supporting plate for flexible base supports for electronic circuits |
| 06/25/2002 | US6409073 Method for transfering solder to a device and/or testing the device |
| 06/25/2002 | US6409070 Minimizing flux residue by controlling amount of moisture during reflow |
| 06/25/2002 | US6408728 Punching apparatus for stamping and method for producing the same |
| 06/25/2002 | US6408511 Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate |
| 06/25/2002 | US6408509 Vertically mountable interposer, assembly and method |
| 06/25/2002 | US6408508 Method for making flexible trace surface circuit board |
| 06/25/2002 | CA2349690C Process and apparatus for the wave soldering of circuit boards |
| 06/25/2002 | CA2093673C Electrical connectors |
| 06/20/2002 | WO2002049405A2 Multi-layer circuits and methods of manufacture thereof |
| 06/20/2002 | WO2002049404A2 Liquid crystalline polymer bond plies and circuits formed therefrom |
| 06/20/2002 | WO2002049403A1 Interconnecting flexible printed boards |
| 06/20/2002 | WO2002049401A1 Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor |
| 06/20/2002 | WO2002049175A1 Method of connecting flat cable to connecting element |
| 06/20/2002 | WO2002049165A1 I-channel surface-mount connector |
| 06/20/2002 | WO2002049160A1 Circuit module with universal connectivity |
| 06/20/2002 | WO2002049139A1 Process for securing a microwave module to a support |
| 06/20/2002 | WO2002049109A1 Stacked die package |
| 06/20/2002 | WO2002049103A2 Microelectronic package having bumpless laminated interconnection layer |
| 06/20/2002 | WO2002049048A2 Multi-layer and user-configurable micro-printed circuit board |
| 06/20/2002 | WO2002048794A1 Solder resist ink |
| 06/20/2002 | WO2002048432A2 Method for patterning metal using nanoparticle containing precursors |
| 06/20/2002 | WO2002048430A2 Oxide-reducing agent composition, system and process |
| 06/20/2002 | WO2002048226A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 06/20/2002 | WO2002047899A1 Lightweight circuit board with conductive constraining cores |
| 06/20/2002 | WO2002047856A2 Irregular shaped copper particles and methods of use |
| 06/20/2002 | WO2001099480A3 Printed circuit board having inductive vias |
| 06/20/2002 | WO2001082362A3 Process for forming electrical/mechanical connections |
| 06/20/2002 | US20020076979 Method of surface mounting a connector and connector |
| 06/20/2002 | US20020076974 Spring-loaded heat sink assembly for a circuit assembly |
| 06/20/2002 | US20020076973 Configuration for forming a contact between a component of an engine or transmission and an electrical printed ciruit board |
| 06/20/2002 | US20020076967 Locking assembly for securing semiconductor device to carrier substrate |
| 06/20/2002 | US20020076958 Circuit module with universal connectivity |
| 06/20/2002 | US20020076957 Contact elements for surface mounting of burn-in socket |
| 06/20/2002 | US20020076955 Connecting structure of electrical component to electrical junction box |
| 06/20/2002 | US20020076952 I-channel surface-mount connector with extended flanges |
| 06/20/2002 | US20020076951 I-channel surface-mount connector |
| 06/20/2002 | US20020076948 Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 06/20/2002 | US20020076926 Method of manufacturing chip type electronic parts |
| 06/20/2002 | US20020076919 Composite interposer and method for producing a composite interposer |
| 06/20/2002 | US20020076912 Method form producing micro bump |
| 06/20/2002 | US20020076910 High density electronic interconnection |
| 06/20/2002 | US20020076909 Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment |
| 06/20/2002 | US20020076903 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
| 06/20/2002 | US20020076826 Agitating fluids with preferential apparatus; obtain liquids, draw into agitation apparatus, agitate, monitor fluid in apparatus |
| 06/20/2002 | US20020076660 Forming a resist pattern having a shrinkage-inhibiting effect on a substrate, baking pattern to release gas, film forming an electrode while keping the substrate below the baking temperature of the resist pattern, separating the resist |
| 06/20/2002 | US20020076657 Coating the photosensitive paste on a substrate to a thickness in consideration of the photocurable depth known beforehand, exposing, developing; rectangular cross-section and superior high-frequency transmission |
| 06/20/2002 | US20020076650 I-line photoresist compositions |
| 06/20/2002 | US20020076539 Process for producing a multi-layer printer wiring board |
| 06/20/2002 | US20020076538 Liquid crystalline polymer bond plies and circuits formed therefrom |
| 06/20/2002 | US20020076537 Laminated structure |
| 06/20/2002 | US20020076536 Electronic component and method of manufacturing the same |
| 06/20/2002 | US20020076535 Thermosetting fluorinated dielectrics and multilayer circuit boards |
| 06/20/2002 | US20020076497 Method of forming selective electroless plating on polymer surfaces |
| 06/20/2002 | US20020076095 Automatic optical inspection of printed circuit board packages with polarity |
| 06/20/2002 | US20020075664 Method and apparatus for providing electromagnetic shielding |
| 06/20/2002 | US20020075661 Parts replacing method and parts replacing apparatus |
| 06/20/2002 | US20020075660 Multilayered board comprising folded flexible circuits and methods of manufacture |
| 06/20/2002 | US20020075658 Module part and electronic device |
| 06/20/2002 | US20020075597 Method and apparatus for folding thin flexible parts that are used in a disc drive |
| 06/20/2002 | US20020075131 Cermet thin film resistors |
| 06/20/2002 | US20020075116 System, printed circuit board, charger device, user device, and apparatus |
| 06/20/2002 | US20020075107 Interconnection method and structure |
| 06/20/2002 | US20020075106 High frequency module device and method for its preparation |
| 06/20/2002 | US20020075105 Microwave circuit packages having a reduced number of vias in the substrate |
| 06/20/2002 | US20020075096 Component carrier |
| 06/20/2002 | US20020075084 High-frequency module |
| 06/20/2002 | US20020075008 Method of inspecting an electrical disconnection between circuits by calculating physical quantities thereof based on capacitances regarding the circuits measured twice |
| 06/20/2002 | US20020074686 Extruding and casting composition of resin solution containing poly(amic acid) varnish; electronics, mechanical properties |
| 06/20/2002 | US20020074667 Wiring board, semiconductor device, and process for production of wiring board |
| 06/20/2002 | US20020074662 Substrate for manufacturing a semiconductor device with three element alloy |
| 06/20/2002 | US20020074654 Wiring substrate, wiring board, and wiring substrate mounting structure |
| 06/20/2002 | US20020074644 Parallel plane substrate |
| 06/20/2002 | US20020074643 Semiconductor device and method for packaging same |
| 06/20/2002 | US20020074641 Microelectronic package having a bumpless laminated interconnection layer |
| 06/20/2002 | US20020074617 Adhesive material applying method and semiconductor device manufacturing method |
| 06/20/2002 | US20020074557 Substrate having fine lines, method for manufacturing the same, electron-source substrate, and image display apparatus |
| 06/20/2002 | US20020074385 Laminated structure |
| 06/20/2002 | US20020074326 Electrical, thin film termination |
| 06/20/2002 | US20020074231 Bottom-up fill of recesses increasing the rotation speed of a substrate and contacting with a soluble copper salt and electrolyte until a desired thickness is achieved |
| 06/20/2002 | US20020074164 Circuit board and electronic equipment using the same |
| 06/20/2002 | US20020074161 Interconnect |
| 06/20/2002 | US20020074159 Silicon standoff for fiber optic modules |
| 06/20/2002 | US20020074158 Multi-layer circuits and methods of manufacture thereof |
| 06/20/2002 | US20020074157 Apparatus and method for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member |
| 06/20/2002 | US20020073544 Manufacturing method of ink-jet haead |