Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2002
06/27/2002WO2002049850A1 Direct printing apparatus and method
06/27/2002WO2002049797A1 Solder foil and semiconductor device and electronic device
06/27/2002WO2002023273A3 Photosensitive composition, cured article thereof, and printed circuit board using the same
06/27/2002WO2002021893A3 Method and device for testing printed circuit boards with a parallel tester
06/27/2002WO2002001635A3 Electronic component
06/27/2002WO2002001193A3 Optical system
06/27/2002WO2001084581A3 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
06/27/2002WO2001065344B1 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management
06/27/2002US20020082349 Resistance to heat and humidity, producing virtually no voluminal expansion even under the conditions of high temperature and high humidity
06/27/2002US20020081911 Apparatus for assembling elements on a printed circuit board
06/27/2002US20020081894 Flat flexible circuit interconnections
06/27/2002US20020081886 Locking assembly for securing semiconductor device to carrier substrate
06/27/2002US20020081819 Electronic component with shielding and method for its production
06/27/2002US20020081781 Connection component with peelable leads
06/27/2002US20020081779 Device comprising an electrical circuit carried by a carrier element and method for the manufacture of such a device
06/27/2002US20020081774 Flip-chip on flex for high performance packaging applications
06/27/2002US20020081768 Semiconductor device and method of fabricating semiconductor device
06/27/2002US20020081747 Mixing fluids; obtain holding apparatus, fill apparatus with fluids, agitate, recover mixture
06/27/2002US20020081530 Manufacturing process for printed wiring board
06/27/2002US20020081443 Laminating liquid crystalline polymer film to copper foil, wherein copper foil has surface concentration of zinc of 0.01-2 atomic %, based on surface atomic concentration
06/27/2002US20020081434 Thermosetting resin composition composed mainly of a polycarbodiimide obtained from organic polyisocyanates
06/27/2002US20020081166 High throughput hole forming system with multiple spindles per station
06/27/2002US20020081025 System and method for in-line inspection of stencil aperture blockage
06/27/2002US20020081017 Image registration using binned substrate parameters
06/27/2002US20020080590 Printed circuit board arrangement for printed circuits with electronic components
06/27/2002US20020080588 Probe card assembly and kit, and methods of making same
06/27/2002US20020080556 Multilayer capacitance structure and circuit board containing the same and method of forming the same
06/27/2002US20020080316 Liquid crystal display apparatus and method for checking the joining accuracy thereof
06/27/2002US20020080315 Liquid crystal display apparatus and method for checking the joining accuracy thereof
06/27/2002US20020079787 Method of mounting a piezoelectric device directly to a printed circuit board
06/27/2002US20020079595 Apparatus for connecting a semiconductor die to a substrate and method therefor
06/27/2002US20020079594 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
06/27/2002US20020079577 Advanced electronic package
06/27/2002US20020079353 Passive and active heat retention device for solder fountain rework
06/27/2002US20020079343 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
06/27/2002US20020079342 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
06/27/2002US20020079305 Soldering iron
06/27/2002US20020079298 Method for processing ceramic green sheet and laser beam machine used therefor
06/27/2002US20020079296 Method of laser welding
06/27/2002US20020079288 Manufacture of printed circuits using single layer processing techniques
06/27/2002US20020079276 Substrate positioning apparatus and exposure apparatus
06/27/2002US20020079232 Seed layer deposition
06/27/2002US20020079135 Printed wiring board and method for manufacturing printed wiring board
06/27/2002US20020079134 Processes for manufacturing multilayer flexible wiring boards
06/27/2002US20020079133 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
06/27/2002US20020079132 Structure for inspecting electrical component alignment
06/27/2002US20020079129 Cable harness arrangement
06/27/2002US20020079116 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
06/27/2002US20020079053 Using cushioning pad comprising two or more fiber material layers, layers comprising non-woven fabric, woven fabric, or paper, bonding material layer between each of fiber layers, rubber layers, releasing layer
06/27/2002US20020078793 Highly filled composites of powered fillers and polymer matrix
06/27/2002US20020078562 Process of fabricating a circuitzed structure
06/27/2002US20020078561 Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
06/27/2002US20020078560 Process for contemporaneous manufacture and interconnection between adjoining printed wiring boards
06/27/2002DE10157985A1 Fluoreszenzanzeigeeinrichtung Fluorescent display device
06/27/2002DE10063801A1 Printed circuit board arrangement has current rail between 2 partial printed circuit boards provided by complementary contact combs
06/27/2002DE10063619A1 Antriebseinheit für Gebläse in Fahrzeugen Drive unit for blower in vehicles
06/27/2002DE10059534C1 Elektrisches Bauelement, Anordnung des Bauelements und Verfahren zur Herstellung der Anordnung An electrical device, arrangement of the component and method of manufacturing the arrangement
06/27/2002CA2432149A1 Method for producing interconnection in a multilayer printed circuits
06/26/2002EP1217878A2 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
06/26/2002EP1217877A2 Method for making a plastic casing bearing an electronic circuit
06/26/2002EP1217807A1 A printed circuit board ( PCB) unit
06/26/2002EP1217715A1 Drive unit for a fan in vehicles
06/26/2002EP1217695A2 Flat flexible circuit interconnection
06/26/2002EP1217449A2 Device for exposure of a peripheral area of a film circuit board
06/26/2002EP1216496A1 Stamped grid with an integrated hall sensor for rotational speed pick-off
06/26/2002EP1216453A1 Method for producing a chip card and chip card produced according to said method
06/26/2002EP1116420B1 Printed circuit plate used for testing electric components
06/26/2002EP0977635A4 Multi-rail board transport system
06/26/2002CN2497511Y Soft circuit plate and PC plate connecting structure
06/26/2002CN2496587Y Supercharged hot-air circulation welding apparatus
06/26/2002CN1355935A Clad plate for forming interposer for seiconductor device interposer for semiconductor device, and method of manufacturing them
06/26/2002CN1355907A High-reliability touch panel
06/26/2002CN1355832A Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
06/26/2002CN1355670A Electromagnetic interference rejection body of low electromagnetic penetrability and reflectivity and its electronic device
06/26/2002CN1355669A Manufacturing method for ceramic sheet and used laser beam machine
06/26/2002CN1355667A Cancel circuit for suppressing electromagnetic interference of high-speed circuit
06/26/2002CN1355666A Cancel circuit using signal generator to suppress electromagnetic interference of high-speed circuit
06/26/2002CN1355665A Differential circuit structure of PCB and its preparing process
06/26/2002CN1355556A Semiconductor chip device and its package method
06/26/2002CN1355078A Cutting tool for making circuit substrate with flat bottom surface and concave cups
06/26/2002CN1086610C Sand-blast medium and method for cleaning electronic hardware components
06/25/2002USRE37765 Pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step.
06/25/2002US6411523 RF electronics assembly with shielded interconnect
06/25/2002US6411519 Package substrate
06/25/2002US6411518 High-density mounted device employing an adhesive sheet
06/25/2002US6411516 Copper slug pedestal for a printed circuit board
06/25/2002US6411194 Production method of thin film resistance element formed on printed circuit board, and thin film resistance element employing the method
06/25/2002US6411136 Differential line driver
06/25/2002US6411118 Method and apparatus for testing bumped die
06/25/2002US6411079 Printed circuit board testing apparatus with dedicated test head and versatile-use test head
06/25/2002US6410983 Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip
06/25/2002US6410980 Electronic part with groove in lead
06/25/2002US6410978 Semiconductor device
06/25/2002US6410937 Integrated circuit chip carrier
06/25/2002US6410881 Process for manufacturing electronic circuits
06/25/2002US6410861 Low profile interconnect structure
06/25/2002US6410860 Electronic circuit package assembly with solder interconnection sheet
06/25/2002US6410859 Electrical assembly for semiconductor dice
06/25/2002US6410858 Multilayered wiring board, a production process for, and semiconductor device using, the same
06/25/2002US6410857 Signal cross-over interconnect for a double-sided circuit card assembly