| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/04/2002 | US20020084312 Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias |
| 07/04/2002 | US20020084310 Heat bonding method and heat bonding device |
| 07/04/2002 | US20020084308 Method, apparatus and computer readable medium for evaluating configuration of solder external terminals of a semiconductor device |
| 07/04/2002 | US20020084306 Etched hole-fill stand-off |
| 07/04/2002 | US20020084305 Scavenging system |
| 07/04/2002 | US20020084300 Apparatus and method for separating circuit boards |
| 07/04/2002 | US20020084248 Wet etch process and composition for forming openings in a polymer substrate |
| 07/04/2002 | US20020084244 Method of making multilayer substrate |
| 07/04/2002 | US20020084191 Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
| 07/04/2002 | US20020084108 Printed circuit board with solder-filled via |
| 07/04/2002 | US20020084106 Hermetic multi-layered circuit assemblies and method of manufacture |
| 07/04/2002 | US20020084105 Via -in-pad with off-center geometry and methods of manufacture |
| 07/04/2002 | US20020084104 Multilayer circuit board having a capacitor and process for manufacturing same |
| 07/04/2002 | US20020084019 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A |
| 07/04/2002 | US20020083858 Spontaneous pattern formation of functional materials |
| 07/04/2002 | US20020083586 Process for producing multilayer circuit board |
| 07/04/2002 | US20020083570 Component mounting system and mounting method |
| 07/04/2002 | DE10164606A1 Flip chip semiconductor device for integrated circuit has signal connection surfaces arranged outside energy lead connection surfaces |
| 07/04/2002 | DE10156263A1 Schaltungseinheit und Verfahren zur Herstellung derselben Circuit unit and method of manufacturing the same |
| 07/04/2002 | CA2432936A1 Manufacture of printed circuits using single layer processing techniques |
| 07/03/2002 | EP1220597A1 Structure for inspecting electrical component alignment |
| 07/03/2002 | EP1220592A1 An apparatus and a method of providing a flexible electrical connection between two components |
| 07/03/2002 | EP1220591A2 Printed wiring board and method of manufacturing a printed wiring board |
| 07/03/2002 | EP1220590A1 A process for making multilayered cards for printed circuits |
| 07/03/2002 | EP1220589A2 Printed wiring board and method for manufacturing printed wiring board |
| 07/03/2002 | EP1220588A1 Method of manufacturing printed-circuit board |
| 07/03/2002 | EP1220587A2 Process for contemporaneous manufacture and interconnection between adjoining wiring boards |
| 07/03/2002 | EP1220586A2 Wiring board prepreg and manufacturing method thereof |
| 07/03/2002 | EP1220364A2 Connecting terminal and method of mounting the same onto a circuit board |
| 07/03/2002 | EP1220363A2 An electrical connector |
| 07/03/2002 | EP1220328A1 Photo-interrupter and semiconductor device using it |
| 07/03/2002 | EP1220316A2 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/03/2002 | EP1219729A1 Electrolytic copper plating solution and method for controlling the same |
| 07/03/2002 | EP1219693A1 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same |
| 07/03/2002 | EP1219150A1 Method and device for laser drilling laminates |
| 07/03/2002 | EP1219149A1 Method and article for the connection and repair of flex and other circuits |
| 07/03/2002 | EP1219148A1 Flex circuit having repairable connector tail |
| 07/03/2002 | EP1218896A1 Split inductor with fractional turn of each winding and pcb including same |
| 07/03/2002 | EP1218891A1 Conductor composition |
| 07/03/2002 | EP1218848A1 Registration control during workpiece processing |
| 07/03/2002 | EP1218765A2 Wafer-level burn-in and test cartridge and methods |
| 07/03/2002 | EP1218757A1 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 07/03/2002 | EP1218732A1 Patterned laminates and electrodes with laser defined features |
| 07/03/2002 | EP1218688A2 Method and apparatus for three dimensional inspection of electronic components |
| 07/03/2002 | EP1218566A2 Method for producing a conductor pattern on a dielectric substrate |
| 07/03/2002 | EP1218178A1 An adhesion promoting layer for use with epoxy prepregs |
| 07/03/2002 | EP1218113A2 Nanostructure coatings |
| 07/03/2002 | CN1356864A Multi-layer ceramic substrate and its preparing process |
| 07/03/2002 | CN1356863A Multi-layer circuit board and its preparing process |
| 07/03/2002 | CN1356862A Substrate structure |
| 07/03/2002 | CN1356861A Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element |
| 07/03/2002 | CN1356579A Method for improving error of PCB and LCD with said PCB |
| 07/03/2002 | CN1356368A Adhesive |
| 07/03/2002 | CN1356288A Glass-ceramic composition for ceramic-type electromic element, ceramic-type electronic element and process for preparing malti-layer ceramic-type electronic element |
| 07/03/2002 | CN1087102C Semiconductor appts. |
| 07/03/2002 | CN1087080C Polymer and application thereof in compsn. capable of optical imaging |
| 07/02/2002 | US6414869 Quad in-line memory module |
| 07/02/2002 | US6414849 Low stress and low profile cavity down flip chip and wire bond BGA package |
| 07/02/2002 | US6414835 Capacitive filtered feedthrough array for an implantable medical device |
| 07/02/2002 | US6414506 Interconnect for testing semiconductor dice having raised bond pads |
| 07/02/2002 | US6414502 Loaded-board, guided-probe test fixture |
| 07/02/2002 | US6414397 Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device |
| 07/02/2002 | US6414382 Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument |
| 07/02/2002 | US6414263 Processing method of printed wiring board |
| 07/02/2002 | US6414250 Hermetic multi-layered circuit assemblies and method of manufacture |
| 07/02/2002 | US6414248 Compliant attachment interface |
| 07/02/2002 | US6414247 Glass ceramic board |
| 07/02/2002 | US6414246 Printed circuit board (PCB) |
| 07/02/2002 | US6413862 Use of palladium in IC manufacturing |
| 07/02/2002 | US6413850 Method of forming bumps |
| 07/02/2002 | US6413849 Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor |
| 07/02/2002 | US6413620 Ceramic wiring substrate and method of producing the same |
| 07/02/2002 | US6413589 Ceramic coating method |
| 07/02/2002 | US6413576 Coating uninsulated portion of copper circuit with layer of ceramic having thickness for soldering without fluxing; integrated circuits |
| 07/02/2002 | US6413404 Method of forming bumps by electroplating |
| 07/02/2002 | US6413117 Axisymmetric vibrator, vibrator connection, and mounting system |
| 07/02/2002 | US6413102 Center bond flip chip semiconductor carrier and a method of making and using it |
| 07/02/2002 | US6412768 Self-adjusting printed circuit board support and method of use |
| 07/02/2002 | US6412754 Pressure control device |
| 07/02/2002 | US6412702 Non-contact IC card having an antenna coil formed by a plating method |
| 07/02/2002 | US6412685 Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
| 07/02/2002 | US6412682 Wave soldering method and system used for the method |
| 07/02/2002 | US6412681 Soldering machine |
| 07/02/2002 | US6412680 Dual-in-line BGA ball mounter |
| 07/02/2002 | US6412408 Simplified screen printing machine having pressing member |
| 07/02/2002 | US6412168 Method of making an electrical circuit board |
| 07/02/2002 | CA2280322C System for modifying printed wiring connections after installation |
| 07/02/2002 | CA2275753C Compression connector |
| 07/02/2002 | CA2123610C A dispersion-based heat sealable coating |
| 06/29/2002 | CA2329888A1 Metal composite articles and method of manufacture |
| 06/27/2002 | WO2002051224A2 Multilayered hybrid electronic module |
| 06/27/2002 | WO2002051223A1 Method for producing interconnection in a multilayer printed circuits |
| 06/27/2002 | WO2002051222A2 Parallel plane substrate |
| 06/27/2002 | WO2002051221A1 Reflow soldering apparatus and reflow soldering method |
| 06/27/2002 | WO2002051218A2 Method/apparatus for folding thin flexible |
| 06/27/2002 | WO2002050955A1 Connector and method of mounting |
| 06/27/2002 | WO2002050949A1 Integrated dual function circuitry and antenna system |
| 06/27/2002 | WO2002050906A1 Method for programming a peripheral address and peripheral therefor |
| 06/27/2002 | WO2002050900A1 Electronic circuit device |
| 06/27/2002 | WO2002050887A1 Electronic device and method of manufacturing the electronic device |