| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/11/2002 | US20020088304 Mechatronics sensor |
| 07/11/2002 | US20020088117 Chromium adhesion layer for copper vias in low-k technology |
| 07/11/2002 | US20020088116 Method of making a CTE compensated chip interposer |
| 07/11/2002 | DE10150507A1 Verbindungsverfahren und Verbindungsstruktur von Anschlussflächenelektroden und Prüfverfahren für den Verbindungszustand derselben Connection method and connection structure of pad electrodes and test methods for the connection state of the same |
| 07/11/2002 | DE10125476A1 Thermal safety cutout for use with a semiconductor switching element soldered to strip conductor connectors on a printed circuit board as an SMD component breaks a power feed in a strip conductor. |
| 07/11/2002 | DE10065856A1 Verfahren zur Herstellung von schaltungstragenden Kunststoffgehäusen elektronischer Bauteile Process for the preparation of circuitry supporting plastic packages electronic components |
| 07/11/2002 | DE10065649A1 Device for electrochemical treatment of electrically conducting flexible material includes electrode roller rotating in electrolyte container and having ion-permeable electrically insulating layer on electrochemically active casing surface |
| 07/11/2002 | DE10064577A1 Control arrangement in optical transmission/reception module, includes circuit board with radio frequency lines which are connected to package terminals in parallel to board plane |
| 07/11/2002 | DE10064221A1 Printed circuit board for improving cooling effect with an SMD component has holes near a component to be cooled with regard to contact/cooling surfaces of the component to be cooled. |
| 07/11/2002 | DE10062618A1 Straight-through air dryer for circuit boards or conduction paths, has blower unit for blowing part-air-flow in transport direction |
| 07/11/2002 | DE10060070A1 Kabelbaumanordnung, insbesondere für Fahrzeuge Cable harness assembly, in particular for vehicles |
| 07/11/2002 | DE10040303C2 Verfahren zum definierten Tiefenbohren von Sacklöchern (blind vias) in mehrlagigen Leiterplatten (Multilayer) Defined method for deep drilling blind holes (blind vias) in multilayer printed circuit boards (multilayer) |
| 07/11/2002 | DE10036900C2 Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner Method for contacting a flexible circuit board with a contact partner and assembly of flexible printed circuit board and Partners |
| 07/11/2002 | CA2433222A1 Method for making a multilevel circuitry comprising conductor tracks and micro-vias |
| 07/10/2002 | EP1221717A2 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| 07/10/2002 | EP1221134A2 Chip card and a method for producing a chip card |
| 07/10/2002 | EP1220876A2 Method of treating epoxy resin-cured product |
| 07/10/2002 | EP0738385B1 Measuring probe |
| 07/10/2002 | CN1358410A Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358409A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358408A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 07/10/2002 | CN1358407A Surface treated copper foil and method for preparing the same and copper-cload laminate using the same |
| 07/10/2002 | CN1358406A Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same |
| 07/10/2002 | CN1358134A Printing plate and printing method using the same |
| 07/10/2002 | CN1358131A Method for producing of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/10/2002 | CN1358123A Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method |
| 07/10/2002 | CN1358060A Electric connection method between coaxial cable and circuit board |
| 07/10/2002 | CN1357647A Wiring substrate and its making process and chemical copper plating solution therein |
| 07/10/2002 | CN1357585A Chemical and mechanical polishing paste for metal and dielectric structure |
| 07/10/2002 | CN1357454A Screen printing equipment and method |
| 07/10/2002 | CN1357428A Machinine planting method and equipment and machining data forming method and equipment |
| 07/09/2002 | US6418552 Method and apparatus for optimizing trace lengths to maximize the speed of a clocked bus |
| 07/09/2002 | US6418490 Electronic circuit interconnection system using a virtual mirror cross over package |
| 07/09/2002 | US6418032 Printed wiring board |
| 07/09/2002 | US6418030 Multi-chip module |
| 07/09/2002 | US6418029 Interconnect system having vertically mounted passive components on an underside of a substrate |
| 07/09/2002 | US6418023 Vertical surface mount apparatus with thermal carrier |
| 07/09/2002 | US6418021 Electronic circuit apparatus and method for assembling the same |
| 07/09/2002 | US6417997 Mechanically formed standoffs in a circuit interconnect |
| 07/09/2002 | US6417885 Solid-state image pickup device with a separable circuit board |
| 07/09/2002 | US6417747 Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards |
| 07/09/2002 | US6417744 Transition between asymmetric stripline and microstrip in cavity |
| 07/09/2002 | US6417486 Production of conductor tracks on plastics by means of laser energy |
| 07/09/2002 | US6417459 Printed circuit board, and prepreg for a printed circuit board |
| 07/09/2002 | US6416996 Hepatitis b virus genome |
| 07/09/2002 | US6416938 Forming a film with plasma deposition on photosensitive film on substrate and silicon donor with silane, disilane and nonsilicon exposure to ultraviolet radiation |
| 07/09/2002 | US6416883 Lead-free solder |
| 07/09/2002 | US6416863 Method for encapsulating solder metal powders and solder metal powders produced according to this method |
| 07/09/2002 | US6416849 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 07/09/2002 | US6416597 Alloying zinc and tin |
| 07/09/2002 | US6416590 Solder powder and method for preparing the same and solder paste |
| 07/09/2002 | US6416399 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416398 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416397 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416395 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416388 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416387 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416386 Apparatus and methods for substantial planarization of solder bumps |
| 07/09/2002 | US6416361 Small form-factor pluggable transceiver cage |
| 07/09/2002 | US6416350 Contact for conductor foil |
| 07/09/2002 | US6415974 Structure of solder bumps with improved coplanarity and method of forming solder bumps with improved coplanarity |
| 07/09/2002 | US6415504 Altering method of circuit pattern of printed-circuit board |
| 07/09/2002 | CA2195314C Solder pad for printed circuit boards |
| 07/04/2002 | WO2002052910A2 Manufacture of printed circuits using single layer processing techniques |
| 07/04/2002 | WO2002052908A1 Printed wiring board and method of manufacturing the same |
| 07/04/2002 | WO2002052627A1 Pattern forming method and device and semiconductor device, electric circuit, display element module and luminous element |
| 07/04/2002 | WO2002051580A1 Method of laser welding |
| 07/04/2002 | WO2002035289A3 Method and materials for printing particle-enhanced electrical contacts |
| 07/04/2002 | WO2002023592A3 Method and apparatus for reducing ic die mass and thickness while improving strength characteristics |
| 07/04/2002 | WO2001088958A3 Spontaneous pattern formation of functional materials |
| 07/04/2002 | WO2000070676A9 High-density electronic package, and method for making same |
| 07/04/2002 | US20020086963 Fluororesin film of high mechanical strength |
| 07/04/2002 | US20020086591 Connecting terminal and method of mounting the same onto a circuit board |
| 07/04/2002 | US20020086514 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device |
| 07/04/2002 | US20020086459 Circuit mounting method, circuit mounted board, and semiconductor device |
| 07/04/2002 | US20020086243 Method for constructing multilayer circuit boards having air bridges |
| 07/04/2002 | US20020086240 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching |
| 07/04/2002 | US20020086236 Suitable as electrically insulating protective layers for delicate, fragile conductive traces of the type produced by etching copper layers to form printed circuits |
| 07/04/2002 | US20020086232 Disposing active primer between receptor substrate and a thermal transfer donor; disposing transfer assist layer on active primer; selectively thermally transferring portion of transfer layer from donor to receptor |
| 07/04/2002 | US20020086171 Adhesive strength |
| 07/04/2002 | US20020086161 Radiation-curable compositions and cured articles |
| 07/04/2002 | US20020086146 Contacts in which the gold and nickel layers are replaced with a single layer of a conductive ink; efficiency, simplification |
| 07/04/2002 | US20020086145 Printed wiring board and method of manufacturing a printed wiring board |
| 07/04/2002 | US20020086144 Integrated circuits; dielectric packages; corrosion resistance |
| 07/04/2002 | US20020086102 Pre-heating the workpiece, prior to immersion thereof in electroless plating solution, to temperature approximately equal to or above operating temperature of electroless plating bath |
| 07/04/2002 | US20020085888 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 07/04/2002 | US20020085364 Electronic package with high density interconnect layer |
| 07/04/2002 | US20020085360 Layered circuit boards and methods of production thereof |
| 07/04/2002 | US20020085191 Device for exposure of a peripheral area of a film circuit board |
| 07/04/2002 | US20020085188 Apparatus and method for compensating for distortion of a printed circuit workpiece substrate |
| 07/04/2002 | US20020084868 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/04/2002 | US20020084722 Piezoelectric device having increased mechanical compliance |
| 07/04/2002 | US20020084556 Improving adhesion and increasing lubricity of ethylene homo-or copolymer by extruding, heating and treating with such as an ethylene oxide fatty amine adduct |
| 07/04/2002 | US20020084536 Interconnected circuit board assembly and method of manufacture therefor |
| 07/04/2002 | US20020084531 Chip thermistor |
| 07/04/2002 | US20020084528 Wafer level package and method for manufacturing the same |
| 07/04/2002 | US20020084456 Multilayered wiring board and production method thereof |
| 07/04/2002 | US20020084441 Method for roughening copper surfaces for bonding to substrates |
| 07/04/2002 | US20020084315 Ball bumping substrates, particuarly wafers |
| 07/04/2002 | US20020084314 Method for fabricating printed circuit board |