| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/17/2002 | CN1358613A 切割装置 Cutting device |
| 07/17/2002 | CN1358604A Method for preventing connected tin forming in wave soldering |
| 07/17/2002 | CN1087898C High-frequency electron device |
| 07/17/2002 | CN1087761C Process for increasing adhesive capacity of polyimide to active metal |
| 07/17/2002 | CN1087669C Nickel powder and preparation process thereof |
| 07/16/2002 | US6421783 Microprocessor and main board mounting arrangement |
| 07/16/2002 | US6421253 Durable laminated electronics assembly using epoxy preform |
| 07/16/2002 | US6421249 Electronic device with an enhanced attachment to surface mount lamps |
| 07/16/2002 | US6421248 Chip card module |
| 07/16/2002 | US6421225 Electric component |
| 07/16/2002 | US6421013 Tamper-resistant wireless article including an antenna |
| 07/16/2002 | US6420785 Bus line wiring structure in a semiconductor device and method of manufacturing the same |
| 07/16/2002 | US6420782 Vertical ball grid array integrated circuit package |
| 07/16/2002 | US6420681 Method and process of contact to a heat softened solder ball array |
| 07/16/2002 | US6420678 Method for separating non-metallic substrates |
| 07/16/2002 | US6420676 Method for machining wiring board with laser beam and device for same |
| 07/16/2002 | US6420675 Control system for ablating high-density array of vias or indentation in surface of object |
| 07/16/2002 | US6420664 Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate |
| 07/16/2002 | US6420660 Film used as a substrate for integrated circuits |
| 07/16/2002 | US6420659 Flexible wiring board pieces and wiring sheets |
| 07/16/2002 | US6420658 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 07/16/2002 | US6420450 Cationically hardening mass, the use thereof and process for preparing hardened polymer masses |
| 07/16/2002 | US6420441 Dispersing removable crosslinked polymer porogens in a polysiloxane, curing, and heating to remove porogen; low dielectric constant; high porosity; insulation materials |
| 07/16/2002 | US6420255 Mounting substrate with a solder resist layer and method of forming the same |
| 07/16/2002 | US6420213 Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive |
| 07/16/2002 | US6420210 Semiconductor device and method for manufacturing the same |
| 07/16/2002 | US6420207 Full body gold; improved electrical and mechanical connects; copper circuit on wire bond side is fully covered, solder mask applied directly to semiconductor to avoid contact with gold; ball area protected by metall or an organic solderable |
| 07/16/2002 | US6420195 Method of aligning and testing a semiconductor chip package |
| 07/16/2002 | US6420096 Less metal is required compared to other thin film methods; metallic base layer, photoresist layer, electroconductive layer on exposed regions; photoresist is removed and the metallic base layer is etched |
| 07/16/2002 | US6420093 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 07/16/2002 | US6420090 Liquid photocurable composition, water-based photocurable composition and resist pattern-forming method by use of the same |
| 07/16/2002 | US6420018 Low thermal expansion circuit board and multilayer wiring circuit board |
| 07/16/2002 | US6420017 Preventing the burst or void phenomenon of a copper paste, through hole copper clad laminates with a paper phenol or a paper epoxy used as a base; discharging out gas from the through hole |
| 07/16/2002 | US6419981 Impregnated glass fiber strands and products including the same |
| 07/16/2002 | US6419811 Roughening to deposit copper protrusions by subjecting foil near or above limiting current density in electrolytic bath with titanium and tungsten ions to cathodic electrolysis, and rust-proofing (chromates or silane coupling agents) |
| 07/16/2002 | US6419784 Process for improving the adhesion of polymeric materials to metal surfaces |
| 07/16/2002 | US6419550 Apparatus and methods for substantial planarization of solder bumps |
| 07/16/2002 | US6419523 Small form-factor pluggable transceiver cage |
| 07/16/2002 | US6419501 Connector for flexible printed circuit board |
| 07/16/2002 | US6419149 Vapor deposition of copper foil under vacuum; pressure welding |
| 07/16/2002 | US6418616 Full additive process with filled plated through holes |
| 07/16/2002 | US6418615 Method of making multilayered substrate for semiconductor device |
| 07/11/2002 | WO2002054845A2 Layered circuit boards and methods of production thereof |
| 07/11/2002 | WO2002054844A1 Method for making a multilevel circuitry comprising conductor tracks and micro-vias |
| 07/11/2002 | WO2002054843A1 Production method of circuit board module |
| 07/11/2002 | WO2002054842A1 Method for producing bond pads on a printed circuit |
| 07/11/2002 | WO2002054841A1 Production of antenna devices |
| 07/11/2002 | WO2002054840A1 Method for producing electroconductive structures |
| 07/11/2002 | WO2002054839A2 Layered circuit boards and methods of production thereof |
| 07/11/2002 | WO2002054838A1 Via-in-pad with off-center geometry and methods of manufacture |
| 07/11/2002 | WO2002054837A2 Direct pattern writer |
| 07/11/2002 | WO2002054477A1 A method and an arrangement for providing vias in printed circuit boards |
| 07/11/2002 | WO2002054476A1 Method of mounting chip |
| 07/11/2002 | WO2002054420A1 Laminated circuit board and production method for electronic part, and laminated electronic part |
| 07/11/2002 | WO2002054416A1 Method for patterning electroconductive tin oxide film |
| 07/11/2002 | WO2002054414A2 Fat conductor |
| 07/11/2002 | WO2002053807A1 Device and method for electrochemically treating a band-shaped product |
| 07/11/2002 | WO2002053338A1 Method of laminating green sheet |
| 07/11/2002 | WO2002047447A8 Method of forming electrically conductive elements and patterns of such elements |
| 07/11/2002 | WO2002033798B1 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 07/11/2002 | WO2002032665A9 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 07/11/2002 | WO2002030165A3 Apparatus for coupling power to electronics module |
| 07/11/2002 | WO2002029383A3 Optical inspection system having integrated component learning |
| 07/11/2002 | WO2002021592A3 Method for producing an electroconductive layer on the wall of through holes in a substrate |
| 07/11/2002 | WO2002014010A8 Solder ball delivery and reflow apparatus and method |
| 07/11/2002 | WO2001008187A9 Reconfiguragle multichip module stack interface |
| 07/11/2002 | US20020090842 Connector |
| 07/11/2002 | US20020090831 Thin-film circuit substrate and method of producing same |
| 07/11/2002 | US20020090805 Electroplating method of fabrication of the solder bumps which method does not damage air bridges, micro-electromechanical structures, or optical surfaces that can be otherwise damaged |
| 07/11/2002 | US20020090754 Interconnect assembly and z-connection method for fine pitch substrates |
| 07/11/2002 | US20020090573 Resin with radical polymerization groups and carboxyl groups obtained by reacting a cyclic ether vinyl monomer to addition copolymer with carboxylic groups; polyfunctional acrylate; cyclic ether (e.g., epoxide); photopolymerization initiator |
| 07/11/2002 | US20020090565 Methods and apparatus for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging |
| 07/11/2002 | US20020090501 Graphitized carbon fibers obtained by spinning, infusibilizing, carbonizing, pulverizing, then graphitizing mesophase pitch; for use in development of semiconductors, electronics, power/light sources |
| 07/11/2002 | US20020090497 Composite material used in making printed wiring boards |
| 07/11/2002 | US20020090289 Method for displacing an article during screening |
| 07/11/2002 | US20020089849 Led lamp assembly |
| 07/11/2002 | US20020089833 Dual-socket interposer and method of fabrication therefor |
| 07/11/2002 | US20020089830 Wiring pattern decision method considering electrical length and multi-layer wiring board |
| 07/11/2002 | US20020089828 Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material |
| 07/11/2002 | US20020089810 Integrated thin film capacitor/inductor/interconnect system and method |
| 07/11/2002 | US20020089798 Interlayer structure with multiple insulative layers with different frequency characteristics |
| 07/11/2002 | US20020089793 Magnetic head actuator having finely movable tracking device |
| 07/11/2002 | US20020089634 Wiring substrate, display device, semiconductor chip, and electronic equipment |
| 07/11/2002 | US20020089089 Process of shaping a printed circuit board |
| 07/11/2002 | US20020089086 Hole filling using an etched hole-fill stand-off |
| 07/11/2002 | US20020089074 Process for high shear gas-liquid reactions |
| 07/11/2002 | US20020089064 Flexible lead surface-mount semiconductor package |
| 07/11/2002 | US20020089057 Semiconductor device including a semiconductor pellet having bump electrodes to pad electrodes of an interconnect board and method for manufacturing same |
| 07/11/2002 | US20020089052 Semiconductor device and a method of manufacturing the same |
| 07/11/2002 | US20020088986 Display device, producing method of electronic apparatus and display device |
| 07/11/2002 | US20020088977 Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same |
| 07/11/2002 | US20020088844 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 07/11/2002 | US20020088843 Solder ball pitcher |
| 07/11/2002 | US20020088840 Heated filling device |
| 07/11/2002 | US20020088713 Providing metal seed layer substantially free of discontinuities disposed on substrate by contacting metal seed layer disposed on a substrate with electroplating bath comprising one or more sources of copper in electrolyte |
| 07/11/2002 | US20020088709 Method and apparatus for forming interconnects, and polishing liquid and polishing method |
| 07/11/2002 | US20020088555 Laminate press machine |
| 07/11/2002 | US20020088540 Method for joining large substrates |
| 07/11/2002 | US20020088355 Apparatus for displacing an article during screening |
| 07/11/2002 | US20020088354 Screen printing apparatus and method of screen printing |