| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/23/2002 | US6423154 Solder-coating method, and solder paste suitable for use therein |
| 07/23/2002 | US6423144 Coating apparatus and coating method |
| 07/23/2002 | US6423141 Method and apparatus for dispensing viscous material |
| 07/23/2002 | US6422923 Apparatus and methods for substantial planarization of solder bumps |
| 07/23/2002 | US6422919 Apparatus and methods for substantial planarization of solder bumps |
| 07/23/2002 | US6422901 Surface mount device and use thereof |
| 07/23/2002 | US6422877 Apparatus for coupling power to an electronics module |
| 07/23/2002 | US6422687 Electronically addressable microencapsulated ink and display thereof |
| 07/23/2002 | US6422452 Method and apparatus for lining up micro-balls |
| 07/23/2002 | US6421912 Method of making an electrical connector |
| 07/18/2002 | WO2002056655A1 Circuit board and production method therefor |
| 07/18/2002 | WO2002056654A1 Terminal for chip and fabricating method thereof |
| 07/18/2002 | WO2002056653A2 Antenna configuration in or on dielectric bodies |
| 07/18/2002 | WO2002056652A2 Method for the production of an electronic component |
| 07/18/2002 | WO2002056651A1 Circuit board and production method thereof |
| 07/18/2002 | WO2002056650A2 Forming a conducor circuit on a substrate |
| 07/18/2002 | WO2002056378A1 Circuit board and production method therefor |
| 07/18/2002 | WO2002056337A1 Chromium adhesion layer for copper vias in low-k technology |
| 07/18/2002 | WO2002056123A2 Incremental step drilling system and method |
| 07/18/2002 | WO2002055904A2 Method for assembling mechatronics sensor |
| 07/18/2002 | WO2002055762A2 Electrochemical co-deposition of metals for electronic device manufacture |
| 07/18/2002 | WO2002055255A1 Device for laser beam drilling of blind holes in multi-layer printed circuit boards |
| 07/18/2002 | WO2002038318B1 Method for defined mechanical drilling of electric printed circuit boards or printed circuit board stacks and drilling support for use in this method |
| 07/18/2002 | WO2002034017A3 Fine featured moldings of liquid crystalline polymers |
| 07/18/2002 | WO2002004703A3 Electroless rhodium plating |
| 07/18/2002 | WO2002004702A3 Electroless platinum-rhodium alloy plating |
| 07/18/2002 | WO2001077409A3 Method for the selective, metal-based activation of substrate surfaces for the wet-chemical metal deposition without external current and a means therefore |
| 07/18/2002 | US20020094940 Cleaning method to remove flux residue in electronic assembly |
| 07/18/2002 | US20020094721 Housing for plug-connected electrical component and method of mounting such a housing on a printed circuit board |
| 07/18/2002 | US20020094708 Zero insertion force compliant pin contact and assembly |
| 07/18/2002 | US20020094707 Electronic configuration with flexible bonding pads |
| 07/18/2002 | US20020094701 Stretchable interconnects using stress gradient films |
| 07/18/2002 | US20020094672 Integrated ball grid array-pin grid array-flex circuit interposing probe assembly |
| 07/18/2002 | US20020094606 Fabrication process of semiconductor package and semiconductor package |
| 07/18/2002 | US20020094604 Method for fabricating a multilayer ceramic substrate |
| 07/18/2002 | US20020094603 Three-dimensional memory stacking using anisotropic epoxy interconnections |
| 07/18/2002 | US20020094491 Laser ablatable material and its use |
| 07/18/2002 | US20020094488 Positive type photosensitive resin composition and method for forming resist pattern |
| 07/18/2002 | US20020094449 Laminated structure for electronic equipment and method of electroless gold plating |
| 07/18/2002 | US20020094423 Multilayer ceramic wiring board and process for producing same |
| 07/18/2002 | US20020094382 Method of forming conductive pattern |
| 07/18/2002 | US20020093803 Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
| 07/18/2002 | US20020093802 High-g mounting arrangement for electronic chip carrier |
| 07/18/2002 | US20020093801 Soldermask opening to prevent delamination |
| 07/18/2002 | US20020093412 Electronic packaging device with insertable leads and method of manufacturing |
| 07/18/2002 | US20020093361 Engagement probes |
| 07/18/2002 | US20020093351 Method for constructing a flex-rigid laminate probe |
| 07/18/2002 | US20020093259 Brushless motor |
| 07/18/2002 | US20020093109 Composition and method for containing metal ions in electronic devices |
| 07/18/2002 | US20020093104 Conductive adhesive interconnection with insulating polymer carrier |
| 07/18/2002 | US20020093095 Heat spreader hole pin 1 identifier |
| 07/18/2002 | US20020093091 Method of fabricating a ground-ball bonding structure without trapped air for tape ball grid array application |
| 07/18/2002 | US20020093089 Compliant mounting interface for electronic devices |
| 07/18/2002 | US20020093080 Process carrier for flexible substrates |
| 07/18/2002 | US20020093072 Method and article for filling apertures in a high performance electronic substrate |
| 07/18/2002 | US20020092895 Formation of a solder joint having a transient liquid phase by annealing and quenching |
| 07/18/2002 | US20020092894 One-step bumping/bonding method for forming semiconductor packages |
| 07/18/2002 | US20020092887 Bonding head and component mounting apparatus |
| 07/18/2002 | US20020092886 Method and apparatus for balling and assembling ball grid array and chip scale array packages |
| 07/18/2002 | US20020092833 Laser drill for use in electrical circuit fabrication |
| 07/18/2002 | US20020092677 Formation of multisegmented plated through holes |
| 07/18/2002 | US20020092676 Compliant layer for encapsulated cloumns |
| 07/18/2002 | US20020092675 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 07/18/2002 | US20020092674 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 07/18/2002 | US20020092672 Contact pads and circuit boards incorporating same |
| 07/18/2002 | US20020092610 Supporting substrate to be bonded with semiconductor bare chip and method of thermocompression-bonding the same |
| 07/18/2002 | US20020092600 Multi-level web structure in use for thin sheet processing |
| 07/18/2002 | US20020092392 Punching unit |
| 07/18/2002 | US20020092163 Mounting a flexible printed circuit to a heat sink |
| 07/18/2002 | US20020092159 Multi-layer interconnect |
| 07/18/2002 | DE10101957A1 Electromechanical part has stamped and/or molded electrically conducting conductor frame encased in plastic, conducting tracks applied to plastic body, IC(s) connected to frame/track(s) |
| 07/18/2002 | DE10065643A1 Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut Apparatus and method for electrochemical treatment of strip-shaped and board-shaped |
| 07/18/2002 | DE10043817C2 Anordnung und Verfahren für elektrochemisch zu behandelndes Gut Apparatus and method for electrochemically treated Good |
| 07/18/2002 | CA2770436A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/18/2002 | CA2660875A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/17/2002 | EP1223795A1 Wiring-connecting material and process for producing circuit board with the same |
| 07/17/2002 | EP1223794A1 Wiring board having connector and method of manufacturing the same |
| 07/17/2002 | EP1223615A1 A method for producing a structure using nanoparticles |
| 07/17/2002 | EP1223612A1 Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
| 07/17/2002 | EP1223471A1 Substrate positioning apparatus and exposure apparatus |
| 07/17/2002 | EP1222988A2 Nozzle for soldering apparatus |
| 07/17/2002 | EP1222972A1 Machine for washing industrial articles |
| 07/17/2002 | EP1222725A1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 07/17/2002 | EP1222715A1 Connecting device to be soldered to circuit boards for connection of electrical conductors, a method for production of the connecting device and a device for connecting conductors to the connecting device |
| 07/17/2002 | EP1222496A1 Resist ink composition |
| 07/17/2002 | EP1222321A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 07/17/2002 | EP1222034A1 Method of forming a thin metal layer on an insulating substrate |
| 07/17/2002 | EP1127287B1 Device for thermally, stably supporting a miniaturised component |
| 07/17/2002 | CN1359606A 印刷电路板 A printed circuit board |
| 07/17/2002 | CN1359538A Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 07/17/2002 | CN1359530A Electric component formed from sheet metal, provided with a welding abutment and that can be welded on the contact surfaces of a circuit substrate |
| 07/17/2002 | CN1359475A Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 07/17/2002 | CN1359410A Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same |
| 07/17/2002 | CN1359319A Device for the laser processing of flat workpieces |
| 07/17/2002 | CN1359259A Viscous fluid delivering equipment, electronic component installing equipment and method, and semiconductor device |
| 07/17/2002 | CN1359257A Resin board and use thereof |
| 07/17/2002 | CN1359256A Flexible wire distribution board and making method |
| 07/17/2002 | CN1359149A Packaged IC substrate and making method |
| 07/17/2002 | CN1359141A Method for forming buffer pad, semiconductor device and making method, circuit substrate and electronic equipment |
| 07/17/2002 | CN1358813A Conductive adhesion agent, assembling structure and method for making said assembling structure |