| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/25/2002 | US20020098331 Composite laminate circuit structure and methods of interconnecting the same |
| 07/25/2002 | US20020098330 A glass-ceramic for a ceramic electronic part made from a borosilicate glass powder containing boron oxide, silica, atleast one oxide selected from calcium, barium and magnesium; a ceramic powder; and an additive powder |
| 07/25/2002 | US20020098319 Connection material |
| 07/25/2002 | US20020097566 Semiconductor module |
| 07/25/2002 | US20020097565 Radio apparatus unit and radio apparatus housing |
| 07/25/2002 | US20020097562 Electronic device and manufacturing same |
| 07/25/2002 | US20020097440 Procedure for photo engraving in high definition on metal |
| 07/25/2002 | US20020097366 Method for decreasing misalignment of a printed circuit board and a liquid crystal display device with the printed circuit board |
| 07/25/2002 | US20020097353 Liquid crystal display device and a method for manufacturing a grounding device |
| 07/25/2002 | US20020097134 Thick film circuit with fuse |
| 07/25/2002 | US20020096782 Package structure of an image sensor and method for packaging the same |
| 07/25/2002 | US20020096435 Causing a first impregnated member containing a plating solution in electrical contact with an anode to face the conductive layer on a substrate and moving it; preferentially forming a thin film in a depression, e.g. groove or hole |
| 07/25/2002 | US20020096361 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 07/25/2002 | US20020096358 Cable-enrolling conductive thin-film sheet and manufacturing method thereof |
| 07/25/2002 | US20020096348 Circuit encapsulation |
| 07/25/2002 | US20020096344 Shield structure for electronic circuit parts |
| 07/25/2002 | US20020096254 Optical device module and method of fabrication |
| 07/25/2002 | US20020095786 Vertically mountable interposer, assembly and method |
| 07/25/2002 | US20020095785 Methods of manufacturing wiring substrate and electron source substrate and image forming apparatus with the same |
| 07/25/2002 | US20020095784 Bumping process for chip scale packaging |
| 07/25/2002 | DE10201818A1 High-resolution photoengraving on metal, especially metal-coated ceramics |
| 07/25/2002 | DE10155829A1 Electronic circuits manufacturing assembly, has the printed circuit boards provided with integral transport frame |
| 07/25/2002 | DE10117239A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat, und zum Anordnen auf einem Substrat angepaßte Halbleitervorrichtung A method for disposing a semiconductor chip on a substrate, and for arranging on a substrate adapted semiconductor device |
| 07/25/2002 | DE10102459A1 Gehäuse für ein steckbar mit dem Gehäuse verbindbares elektrisches Bauteil und Verfahren zur Montage eines derartigen Gehäuses an einer Leiterplatte A housing for a plug-connectable with the housing electrical component and method for mounting of such a housing to a circuit board |
| 07/25/2002 | DE10102453A1 Casing for holding a component to plug into the casing has a contact pressure spring deflected during plugging-in of the component and tapered towards the interior of the casing. |
| 07/25/2002 | DE10101359A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
| 07/25/2002 | DE10101236A1 Method of joining flat cables by ultrasonic vibrations e.g. for motor vehicle electrical systems, involves placing cables on carrier designed partially as counter-electrode |
| 07/25/2002 | DE10062962A1 Holding device for fastening an electrical component like a capacitor on a supporting substrate has a holder for the component and wiring for making a connection between the component's connectors and contacts on the substrate. |
| 07/25/2002 | DE10060233C1 Manufacturing method for system carrier for IC chip has circuit board fitted in opening in system carrier with its conductor paths termination contacts coupled directly to electrical leads around opening periphery |
| 07/25/2002 | CA2434359A1 Circuit board router apparatus and method thereof |
| 07/25/2002 | CA2434150A1 High-g mounting arrangement for electronic chip carrier |
| 07/24/2002 | EP1225795A2 Method and apparatus for forming electric circuit |
| 07/24/2002 | EP1225664A2 Electrical component with conductive tracks |
| 07/24/2002 | EP1225629A2 Component built-in module and method of manufacturing the same |
| 07/24/2002 | EP1225248A1 Resin moldings for application in electronical components |
| 07/24/2002 | EP1225197A2 Heat-resistant film and thermal transfer recording medium |
| 07/24/2002 | EP1225056A1 Production processes of printed susbstrate, electron-emitting element, electron source and image-forming apparatus |
| 07/24/2002 | EP1224999A1 Laser drilling method and laser drilling device |
| 07/24/2002 | EP1224848A1 Flexible electronic circuitry and method of making same |
| 07/24/2002 | EP1224847A1 Flexible circuit board and method for making a flexible circuit board |
| 07/24/2002 | EP1224674A1 Capacitor component |
| 07/24/2002 | EP1224339A1 Process for selective deposition of copper substrates |
| 07/24/2002 | EP1123525B1 Device and method for the optical inspection of concealed soldered connections |
| 07/24/2002 | EP1053507A4 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 07/24/2002 | EP1029431A4 Via pad geometry supporting uniform transmission line structures |
| 07/24/2002 | EP1028818A4 Deposition of substances on a surface |
| 07/24/2002 | EP0892987B1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 07/24/2002 | EP0760809B1 Application of omega-hydrofluoroalkyl ethers |
| 07/24/2002 | CN1360815A Underfilling material for semiconductor package |
| 07/24/2002 | CN1360743A Antenna for contactless cards, hybrid cards and electronic labels |
| 07/24/2002 | CN1360531A Printhead for jetting hot liquid medium and method of producing joint that comprises metallic solder |
| 07/24/2002 | CN1360530A Print chip for printing head working according to ink printing principle |
| 07/24/2002 | CN1360465A Parts mounting baseplate and making method therefor |
| 07/24/2002 | CN1360464A Method for mfg. multilayer matrix and multilayer matrix made thereby |
| 07/24/2002 | CN1360463A Method for making printed circuit board with corrosion-resistant dry film |
| 07/24/2002 | CN1360462A Method for preparing printed circuit board (PCB) |
| 07/24/2002 | CN1360461A Heat radiator assembly and its assembling method |
| 07/24/2002 | CN1360460A Circuit base board and method for mfg. same |
| 07/24/2002 | CN1360086A Stack structure of electronic apparatus and method for electroless plating of gold |
| 07/24/2002 | CN1360072A Copper aloy foil for laminated board |
| 07/24/2002 | CN1088323C Method for forming protection layer on surface of cooper foil for mfg. printed circuit board |
| 07/24/2002 | CN1088322C Method for forming fiducial mark in resin stencil and stencil formed thereby |
| 07/24/2002 | CN1088321C Method of making circuitized substrate using two different metallization processes |
| 07/24/2002 | CN1088320C Device and method for perforating printed circuit board |
| 07/24/2002 | CN1088319C Thick-film conductor circuit and production method therefor |
| 07/24/2002 | CN1088264C Battery electrode of miniature electronic equipment and structure for fixing same |
| 07/24/2002 | CN1088248C Polar electronic component and mounting structure therefor |
| 07/24/2002 | CN1088074C 热塑性聚酰亚胺聚合物 Thermoplastic polyimide polymer |
| 07/24/2002 | CN1088006C Metallic body with vapor deposited treatment layer(s) and adhesion-promoting layer |
| 07/23/2002 | US6424541 Electronic device attachment methods and apparatus for forming an assembly |
| 07/23/2002 | US6424536 Circuit board protection method and apparatus |
| 07/23/2002 | US6424535 Hybrid circuit with contact surfaces (solder pads) |
| 07/23/2002 | US6424461 Apparatus for observing interior from an ultramicropore space |
| 07/23/2002 | US6424400 Display panel including a printed circuit board having a larger opening than the outside shape of the driving IC chip |
| 07/23/2002 | US6424301 Combination battery holder and antenna for keyfob |
| 07/23/2002 | US6424046 Substrate for manufacturing a semiconductor device with three element alloy |
| 07/23/2002 | US6424037 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
| 07/23/2002 | US6424030 Semiconductor memory module having double-sided stacked memory chip layout |
| 07/23/2002 | US6423982 Diamond interconnection substrate and a manufacturing method therefor |
| 07/23/2002 | US6423945 Device for heating printed-circuit board |
| 07/23/2002 | US6423939 Micro soldering method and apparatus |
| 07/23/2002 | US6423934 Method for forming through holes |
| 07/23/2002 | US6423929 Device for the laser processing of flat workpieces |
| 07/23/2002 | US6423910 Printed circuit device |
| 07/23/2002 | US6423908 Substrate for use in forming electronic package |
| 07/23/2002 | US6423907 Components with releasable leads |
| 07/23/2002 | US6423906 Surface mount package for long lead devices |
| 07/23/2002 | US6423905 Printed wiring board with improved plated through hole fatigue life |
| 07/23/2002 | US6423904 Laminate printed circuit board with leads for plating |
| 07/23/2002 | US6423643 Process of making carrier substrate and semiconductor device |
| 07/23/2002 | US6423622 Lead-bond type chip package and manufacturing method thereof |
| 07/23/2002 | US6423616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/23/2002 | US6423577 Method for reducing an electrical noise inside a ball grid array package |
| 07/23/2002 | US6423470 Photoimageable; flexibility |
| 07/23/2002 | US6423463 Novolac, polyvinyl lower alkyl ether, polyphenol derivative, and naphthoquinonediazide; positive tones, printed circuits |
| 07/23/2002 | US6423456 Method for manufacture of electronic parts |
| 07/23/2002 | US6423405 Light energy is irradiated onto the surface of the high polymer material in a desired area; improving wettability |
| 07/23/2002 | US6423367 Adhesives; coatings; encapsulation |
| 07/23/2002 | US6423207 Method and apparatus for etching |
| 07/23/2002 | US6423172 Use of curable ferrofluids; coating with interconnection material, such as solder, to give anisotropic conductive pathways and interconnections useful in electronics industry |