| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/01/2002 | US20020102495 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 08/01/2002 | US20020102494 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 08/01/2002 | US20020102432 Solder alloy particle scattered or mixed in the flux including Sn and Zn; metal particle scattered or mixed in the flux and including an element in the IB group |
| 08/01/2002 | US20020101724 Electrical junction box |
| 08/01/2002 | US20020101723 Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
| 08/01/2002 | US20020101460 Lithography apparatus, lithography method and method of manufacturing master print for transfer |
| 08/01/2002 | US20020100988 Semiconductor apparatus and a semiconductor device mounting method |
| 08/01/2002 | US20020100987 Semiconductor chip package and connection structure including a ground metal plane having blank patterns |
| 08/01/2002 | US20020100986 Electronic device |
| 08/01/2002 | US20020100982 Wafer level package and method for manufacturing the same |
| 08/01/2002 | US20020100973 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
| 08/01/2002 | US20020100972 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 08/01/2002 | US20020100971 Integrated circuit packages |
| 08/01/2002 | US20020100967 Semiconductor plastic package and process for the production thereof |
| 08/01/2002 | US20020100966 Method for fabricating a multilayer ceramic substrate |
| 08/01/2002 | US20020100965 Semiconductor module and electronic component |
| 08/01/2002 | US20020100963 Semiconductor package and semiconductor device |
| 08/01/2002 | US20020100962 Unmolded package for a semiconductor device |
| 08/01/2002 | US20020100955 Method and apparatus for extending fatigue life of solder joints semiconductor device |
| 08/01/2002 | US20020100913 Substrate having fine line, electron source and image display apparatus |
| 08/01/2002 | US20020100791 Soldering machine |
| 08/01/2002 | US20020100691 3-dimensional imprint tool |
| 08/01/2002 | US20020100613 Conductive substructures of a multilayered laminate |
| 08/01/2002 | US20020100612 Insertion of electrical component within a via of a printed circuit board |
| 08/01/2002 | US20020100611 Insertion of electrical component within a via of a printed circuit board |
| 08/01/2002 | US20020100610 Electronic component and method and structure for mounting semiconductor device |
| 08/01/2002 | US20020100609 Junction flexible wiring circuit board |
| 08/01/2002 | US20020100608 Multilayer printed wiring board and a process of producing same |
| 08/01/2002 | US20020100556 Method and apparatus having pin electrode for surface treatment using capillary discharge plasma |
| 08/01/2002 | US20020100164 Wiring substrate manufacturing method |
| 08/01/2002 | DE10104269A1 Verfahren und Vorrichtung zum Abgleichen eines an einer Leiterplatte anzubringenden Oszillators Method and apparatus for adjusting a to be attached to a printed circuit board oscillator |
| 08/01/2002 | DE10103193A1 Verfahren zur Herstellung von Leiterbahnstrukturen A process for the production of conductor track structures |
| 08/01/2002 | DE10103084A1 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation |
| 08/01/2002 | DE10050862C2 Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen Bath and method for electroless plating of silver onto metal surfaces |
| 07/31/2002 | EP1227710A1 Production method for copper-clad laminated sheet |
| 07/31/2002 | EP1227709A2 Process for manufacturing conductive track structures |
| 07/31/2002 | EP1226933A1 Releasing laminated film |
| 07/31/2002 | EP1226743A1 Method of fabricating a laminated printed circuit board |
| 07/31/2002 | EP1226627A1 Solder ball terminal |
| 07/31/2002 | EP1226470A2 Method of forming optical images, mask for use in this method, method of manufacturing a device using this method, and apparatus for carrying out this method |
| 07/31/2002 | EP1226289A1 An electrochemical method for forming an inorganic covering layer on a surface of a copper material |
| 07/31/2002 | EP1038421B1 Ground clip apparatus for circuit boards |
| 07/31/2002 | EP0997061B1 Method for metallization of a substrate containing electric non-conductive surface areas |
| 07/31/2002 | CN1361915A Aqueous carbon composition and method for coating a non conductive substrate |
| 07/31/2002 | CN1361656A Printing circuit board and method for producing printing circuit board |
| 07/31/2002 | CN1361655A Printing circuit board and method for producing printing circuit board |
| 07/31/2002 | CN1361558A Connection terminal and method for mounting the same terminal on electric circuit board |
| 07/31/2002 | CN1361548A Base board lay-out method and structure to reduce cross-talk of adjacent signals |
| 07/31/2002 | CN1361465A Method for producing contact control screen linear pattern |
| 07/31/2002 | CN1088550C Installation structure for components with terminal |
| 07/31/2002 | CN1088526C Photo sensitive ink inhibitor composition |
| 07/31/2002 | CA2336283A1 Method of manufacturing resonant circuit devices |
| 07/30/2002 | US6426880 Surface mounted device with grooves on a termination lead |
| 07/30/2002 | US6426733 Electron source substrate and image-forming apparatus using the same |
| 07/30/2002 | US6426686 Microwave circuit packages having a reduced number of vias in the substrate |
| 07/30/2002 | US6426566 Anisotropic conductor film, semiconductor chip, and method of packaging |
| 07/30/2002 | US6426564 Recessed tape and method for forming a BGA assembly |
| 07/30/2002 | US6426552 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
| 07/30/2002 | US6426551 Composite monolithic electronic component |
| 07/30/2002 | US6426470 Formation of multisegmented plated through holes |
| 07/30/2002 | US6426469 Printed board with signal wiring patterns that can measure characteristic impedance |
| 07/30/2002 | US6426466 Peripheral power board structure |
| 07/30/2002 | US6426290 Electroplating both sides of a workpiece |
| 07/30/2002 | US6426241 Method for forming three-dimensional circuitization and circuits formed |
| 07/30/2002 | US6426154 Ceramic circuit board |
| 07/30/2002 | US6426146 Overcoated with zinc oxide |
| 07/30/2002 | US6426143 Moulded part and flexible film with a protected printed conductor, and method for producing the same |
| 07/30/2002 | US6426138 Adhesive film for electronic parts |
| 07/30/2002 | US6426021 Anisotropically electroconductive adhesive material and connecting method |
| 07/30/2002 | US6426020 Mixture of alkanolamine, copper, halide compound, acid and water |
| 07/30/2002 | US6426011 Overcoating with copper; filling aperture with dielectrics |
| 07/30/2002 | US6425772 Conductive adhesive having a palladium matrix interface between two metal surfaces |
| 07/30/2002 | US6425771 IC socket |
| 07/30/2002 | US6425518 Method and apparatus for applying solder to an element on a substrate |
| 07/30/2002 | US6425325 Offset printing method and offset printing apparatus |
| 07/25/2002 | WO2002058448A2 Apparatus and method for producing non-or lightly-embossed panels |
| 07/25/2002 | WO2002058445A1 Method of fixing electronic part |
| 07/25/2002 | WO2002058444A2 High-g mounting arrangement for electronic chip carrier |
| 07/25/2002 | WO2002058443A1 Contact pads and circuit boards incorporating same |
| 07/25/2002 | WO2002058442A1 Flexible printed wiring board |
| 07/25/2002 | WO2002058234A2 High frequency printed circuit board via |
| 07/25/2002 | WO2002058137A2 Composite microelectronic spring structure and method for making same |
| 07/25/2002 | WO2002057928A2 Signaling on an electromagnetically-coupled bus |
| 07/25/2002 | WO2002057659A2 Mechatronics sensor |
| 07/25/2002 | WO2002057100A2 Electric heating system for a motor vehicle |
| 07/25/2002 | WO2002057075A2 Multi-level web structure in use for thin sheet processing |
| 07/25/2002 | WO2002057047A1 Circuit board router apparatus and method thereof |
| 07/25/2002 | WO2002011500A3 Printed circuit board comprising embedded capacitor and method of forming same |
| 07/25/2002 | WO2002006371A3 Radiation-curable compositions and cured articles |
| 07/25/2002 | WO2001082362B1 Process for forming electrical/mechanical connections |
| 07/25/2002 | WO2001002468A9 Composites of powdered fillers and polymer matrix and process for preparing them |
| 07/25/2002 | US20020100010 Field programmable printed circuit board |
| 07/25/2002 | US20020099466 Circuit Production method |
| 07/25/2002 | US20020098727 Electrical connector |
| 07/25/2002 | US20020098723 Board connector and method of attaching board connector |
| 07/25/2002 | US20020098621 Method of mounting a passive component over an integrated circuit package substrate |
| 07/25/2002 | US20020098618 Method and apparatus for transferring a feature pattern from an inked surface to a substrate |
| 07/25/2002 | US20020098448 Module used in the milli-wave or micro-wave region. |
| 07/25/2002 | US20020098374 Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
| 07/25/2002 | US20020098364 Silicone elastomer stamp with hydrophilic surfaces and method of making same |