| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/07/2002 | EP1229769A1 Carrier-foiled copper foil circuit, printed circuit board manufacturing method using the circuit, and printed circuit board |
| 08/07/2002 | EP1229768A1 Carrier-foiled composite copper foil, method for manufacturing printed circuit board with resistance circuit, and printed circuit board having resistance circuit |
| 08/07/2002 | EP1229608A2 Contact modul for a connector, in particular a card-edge connector |
| 08/07/2002 | EP1229607A1 High density connector system |
| 08/07/2002 | EP1229556A2 Electrical line |
| 08/07/2002 | EP1229389A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon |
| 08/07/2002 | EP1229387A2 Lithography apparatus, lithography method and method of manufacturing master print for transfer |
| 08/07/2002 | EP1229095A1 Adhesive agent, method for connecting wiring terminals and wiring structure |
| 08/07/2002 | EP1228676A2 Method and apparatus for holding a printed circuit board in a precise position during processing |
| 08/07/2002 | EP1228529A1 Dip formation of flip-chip solder bumps |
| 08/07/2002 | EP1228401A1 Step and flash imprint lithography |
| 08/07/2002 | EP1228285A1 Electronic control device for controlling electric units of motor vehicle doors which have different equipment |
| 08/07/2002 | EP1228266A1 Method for electrochemically metallising an insulating substrate |
| 08/07/2002 | EP1172025B1 Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
| 08/07/2002 | EP1080252B1 Method for electro copperplating substrates |
| 08/07/2002 | EP0956175B1 Drill or milling head |
| 08/07/2002 | CN2504869Y Anti-welding member for printed circuit board |
| 08/07/2002 | CN1363125A Ablative method for forming RF ceramic block filters |
| 08/07/2002 | CN1363042A Apparatus and method for inspection |
| 08/07/2002 | CN1362983A Cnductive adhesive, apparatus for mounting electronic component, and method for mounting the same |
| 08/07/2002 | CN1362904A Control method for copper content in solder dipping bath |
| 08/07/2002 | CN1362852A Conductor pin forming process |
| 08/07/2002 | CN1362851A Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate |
| 08/07/2002 | CN1362785A High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly |
| 08/07/2002 | CN1362739A Semiconductor baseplate and its fabrication process |
| 08/07/2002 | CN1362733A Semiconductor device and manufacture method thereof, circuit board and electronic apparatus |
| 08/07/2002 | CN1362712A Conducting metal particles, conducting composite metal particles and applied products using same |
| 08/07/2002 | CN1362538A Method for forming copper for chrome-plating of printed circuit board |
| 08/07/2002 | CN1088969C Master board assembly method and electronic card connector fixing device |
| 08/07/2002 | CN1088968C Method for manufacturing grain dimensional packaged circuit board |
| 08/06/2002 | US6430465 Abbe error correction system and method |
| 08/06/2002 | US6430059 Integrated circuit package substrate integrating with decoupling capacitor |
| 08/06/2002 | US6430058 Integrated circuit package |
| 08/06/2002 | US6430057 Device for interfacing an integrated circuit chip with a printed circuit board |
| 08/06/2002 | US6430054 Electrical junction box |
| 08/06/2002 | US6430047 Standardized test board for testing custom chips |
| 08/06/2002 | US6430029 Capacitor terminal |
| 08/06/2002 | US6430025 Multilayer capacitor |
| 08/06/2002 | US6429752 Electrical transmission line arrangement having displaced conductor sections |
| 08/06/2002 | US6429547 Time switch |
| 08/06/2002 | US6429527 Method and article for filling apertures in a high performance electronic substrate |
| 08/06/2002 | US6429401 Apparatus for verification of assembled printed circuit boards |
| 08/06/2002 | US6429389 Via-in-pad apparatus and methods |
| 08/06/2002 | US6429388 High density column grid array connections and method thereof |
| 08/06/2002 | US6429387 Electronic component and mounting method and device therefor |
| 08/06/2002 | US6429385 Non-continuous conductive layer for laminated substrates |
| 08/06/2002 | US6429384 Chip C4 assembly improvement using magnetic force and adhesive |
| 08/06/2002 | US6429383 Apparatus and method for improving circuit board solder |
| 08/06/2002 | US6429382 Electrical mounting structure having an elution preventive film |
| 08/06/2002 | US6429381 High density interconnect multichip module stack and fabrication method |
| 08/06/2002 | US6429114 Method for fabricating a multilayer ceramic substrate |
| 08/06/2002 | US6429113 Method for connecting an electrical device to a circuit substrate |
| 08/06/2002 | US6429112 Multi-layer substrates and fabrication processes |
| 08/06/2002 | US6429049 Laser method for forming vias |
| 08/06/2002 | US6429029 Concurrent design and subsequent partitioning of product and test die |
| 08/06/2002 | US6428942 Multilayer circuit structure build up method |
| 08/06/2002 | US6428914 Electrode layer embedded in substrate in such a manner that electrode layer and substrate are in one plane, insulating layer formed on surface of a composite of substrate and electrode layer; high quality displays |
| 08/06/2002 | US6428911 Using tin alloy |
| 08/06/2002 | US6428908 Substrate of narrow and flexible strip conductor with aperture extending to tower face; deformed bond head larger than through hole |
| 08/06/2002 | US6428903 Prevention of bacterial adhesion and biofilms on computers, semiconductors, integrated circuits, and microelectronics |
| 08/06/2002 | US6428745 A solder comprising 2.0 to 3.5 wt % of silver, 5 to 18 wt % of bismuth and rest is tin; used for soldering an electronic part to a circuit board |
| 08/06/2002 | US6428719 Etching process to selectively remove copper plating seed layer |
| 08/06/2002 | US6428644 Process and apparatus for producing a laminate for electronic parts |
| 08/06/2002 | US6428349 Method and apparatus for jumpering resistors and other components on a printed circuit board |
| 08/06/2002 | US6428332 Connector for use on board |
| 08/06/2002 | US6428329 Interposition structure between substrates |
| 08/06/2002 | US6428328 Method of making a connection to a microelectronic element |
| 08/06/2002 | US6428327 Flexible adapter for use between LGA device and printed circuit board |
| 08/06/2002 | US6428202 Method for inspecting connection state of electronic part and a substrate, and apparatus for the same |
| 08/06/2002 | US6427903 Solder ball placement apparatus |
| 08/06/2002 | US6427902 Machine for wave soldering of tinning |
| 08/06/2002 | US6427901 System and method for forming stable solder bonds |
| 08/06/2002 | US6427898 Solder bump forming method and apparatus |
| 08/06/2002 | US6427892 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards |
| 08/06/2002 | US6427676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 08/06/2002 | US6427587 Method and stencil for extruding material on a substrate |
| 08/06/2002 | US6427325 Flowable compositions and use in filling vias and plated through-holes |
| 08/06/2002 | US6427324 Inherently robust repair process for thin film circuitry using UV laser |
| 08/06/2002 | US6427323 Method for producing conductor interconnect with dendrites |
| 08/06/2002 | CA2211703C Test device for flat electronic assemblies |
| 08/01/2002 | WO2002060229A1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
| 08/01/2002 | WO2002060137A1 Electromagnetically-coupled bus system |
| 08/01/2002 | WO2002059397A1 Method for the continuous deposition of a nickel-containing coating on a metallic film |
| 08/01/2002 | WO2002059209A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
| 08/01/2002 | WO2002058933A2 Ink-jet printer having carriage and flexible circuit movably connected, method and apparatus |
| 08/01/2002 | WO2002041079A3 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 08/01/2002 | WO2002025702A3 Semiconductor product with a silver and gold alloy |
| 08/01/2002 | WO2002011505A3 Circuit board protection method and apparatus |
| 08/01/2002 | WO2001084581B1 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 08/01/2002 | WO2001029878A9 Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes |
| 08/01/2002 | US20020103555 Computer system and printed circuit board manufactured in accordance with a quasi-Monte Carlo simulation technique for multi-dimensional spaces |
| 08/01/2002 | US20020103270 Photo- or heat-curable resin composition and multilayer printed wiring board |
| 08/01/2002 | US20020102869 Surface mount atttachable land grid array connector and method of forming same |
| 08/01/2002 | US20020102829 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 08/01/2002 | US20020102772 Using an electrophotographic method; photoconductive layer whose chargeability is changed by light exposure, forming electrostatic latent image pattern with ultraviolet light and a resist forming step by toner development |
| 08/01/2002 | US20020102767 Ball grid array (BGA) to column grid array (CGA) conversion process |
| 08/01/2002 | US20020102765 Forming an electrical contact on an electronic component |
| 08/01/2002 | US20020102745 Process for modifying chip assembly substrates |
| 08/01/2002 | US20020102501 Photosensitive resin composition and method for formation of resist pattern by use thereof |
| 08/01/2002 | US20020102496 Thin film circuit substrate and manufacturing method therefor |