| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/13/2002 | US6433987 Protected and printed wiring board and method of making same |
| 08/13/2002 | US6433728 Integrally molded remote entry transmitter |
| 08/13/2002 | US6433650 Electrical transmission arrangement |
| 08/13/2002 | US6433425 Electronic package interconnect structure comprising lead-free solders |
| 08/13/2002 | US6433417 Electronic component having improved soldering performance and adhesion properties of the lead wires |
| 08/13/2002 | US6433319 Electrical, thin film termination |
| 08/13/2002 | US6433301 Beam shaping and projection imaging with solid state UV Gaussian beam to form vias |
| 08/13/2002 | US6433285 Printed wiring board, IC card module using the same, and method for producing IC card module |
| 08/13/2002 | US6433281 Bus bar wiring board and method of producing the same |
| 08/13/2002 | US6433276 Surface mount feedthrough |
| 08/13/2002 | US6433123 Hydrogenated polybutadiene polyol; polybutadiene polyblock isocyanate |
| 08/13/2002 | US6433057 Curable mixture of polysiloxane, polysilicate, electrically conductive filler (silver, gold, platinum, or palladium), and hydrosilation catalyst; good adhesion and excellent electrical properties; for use in gaskets and coatings |
| 08/13/2002 | US6432807 Method of forming solder bumps on a semiconductor device using bump transfer plate |
| 08/13/2002 | US6432806 Method of forming bumps and template used for forming bumps |
| 08/13/2002 | US6432748 Substrate structure for semiconductor package and manufacturing method thereof |
| 08/13/2002 | US6432745 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| 08/13/2002 | US6432744 Wafer-scale assembly of chip-size packages |
| 08/13/2002 | US6432612 Ultraviolet-curable type photo solder resist ink |
| 08/13/2002 | US6432564 Applying conformation layer of glass before metallization |
| 08/13/2002 | US6432541 Resin impregnated prepregs; metallic foils coated with adhesive |
| 08/13/2002 | US6432540 Flame retardant molding compositions |
| 08/13/2002 | US6432497 Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| 08/13/2002 | US6432291 Simultaneous electroplating of both sides of a dual-sided substrate |
| 08/13/2002 | US6432239 Method of producing ceramic multilayer substrate |
| 08/13/2002 | US6432182 Treatment solution for reducing adhesive resin bleed |
| 08/13/2002 | US6432000 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core |
| 08/13/2002 | US6431952 Apparatus and methods for substantial planarization of solder bumps |
| 08/13/2002 | US6431920 Apparatus for assembling elements on a printed circuit board |
| 08/13/2002 | US6431882 Connector with two rows of terminals having tail portions with similar impedance |
| 08/13/2002 | US6431432 Method for attaching solderballs by selectively oxidizing traces |
| 08/13/2002 | US6430810 Mechanical scribing methods of forming a patterned metal layer in an electronic device |
| 08/13/2002 | CA2178574C Dry fluxing of metal surfaces under water vapour containing atmosphere |
| 08/08/2002 | WO2002062117A1 Method for jointing electronic parts |
| 08/08/2002 | WO2002062116A1 It laminating double-side circuit board and production method therefor and multi-layer printed circuit board using |
| 08/08/2002 | WO2002061945A2 Method and device for equalisation of an oscillator for assembly on a circuit board |
| 08/08/2002 | WO2002061895A1 Method and device for connecting conductors |
| 08/08/2002 | WO2002061832A1 Unmolded package for a semiconductor device |
| 08/08/2002 | WO2002061827A1 Semiconductor device and its manufacturing method |
| 08/08/2002 | WO2002061787A2 Method and apparatus having pin electrode for surface treatment using capillary discharge plasma |
| 08/08/2002 | WO2002061766A1 Conductive powder and conductive composition |
| 08/08/2002 | WO2002061765A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 08/08/2002 | WO2002061010A2 Method for adhering substrates using light activatable adhesive film |
| 08/08/2002 | WO2002061000A1 Conductive coating composition |
| 08/08/2002 | WO2002003765A3 Method and apparatus for locating and securing a printed wire board on a screen printer |
| 08/08/2002 | WO2002001190A3 Method and apparatus for improved process control in combustion applications |
| 08/08/2002 | WO2001090442A9 Cathode for electrochemical regeneration of permanganate etching solutions |
| 08/08/2002 | WO2001054068A3 Method and system for detecting defects on a printed circuit board |
| 08/08/2002 | WO2001035051A9 X-ray tomography bga (ball grid array) inspections |
| 08/08/2002 | US20020107204 Protease-activated receptor-1 or 2 (PAR-1, PAR-2) |
| 08/08/2002 | US20020106939 Control device and soldering method |
| 08/08/2002 | US20020106930 Contact assembly for a plug connector, in particular for a PCB plug connector |
| 08/08/2002 | US20020106915 Assembly for mounting a bridge rectifier to a printed wiring board |
| 08/08/2002 | US20020106900 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
| 08/08/2002 | US20020106883 Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board |
| 08/08/2002 | US20020106833 Semiconductor device and method for fabricating same |
| 08/08/2002 | US20020106832 Method and apparatus for attaching solder members to a substrate |
| 08/08/2002 | US20020106822 Test coupon for measuring a dielectric constant of a memory module board and method of use |
| 08/08/2002 | US20020106577 Photosensitive copper paste and method of forming copper pattern using the same |
| 08/08/2002 | US20020106522 Methods for detaching a layer from a substrate |
| 08/08/2002 | US20020106521 Thermosetting low-dielectric resin composition and use thereof |
| 08/08/2002 | US20020106516 Free of halogen elements, flame retardancy, water resistance, heat resistance, peeling strength |
| 08/08/2002 | US20020106458 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer |
| 08/08/2002 | US20020106450 Wiring board |
| 08/08/2002 | US20020105791 Processor power delivery system |
| 08/08/2002 | US20020105790 Circuit component |
| 08/08/2002 | US20020105775 Electronic component and method for producing same |
| 08/08/2002 | US20020105774 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance |
| 08/08/2002 | US20020105358 Method and apparatus for forming electric circuit |
| 08/08/2002 | US20020105348 Electronically measuring pin-to-pad alignment using resistive pads |
| 08/08/2002 | US20020105094 Semiconductor device and method for producing the same, and method for mounting semiconductor device |
| 08/08/2002 | US20020105083 Multi-layer interconnect module and method of interconnection |
| 08/08/2002 | US20020105080 Method of forming an electronic device |
| 08/08/2002 | US20020105078 Semiconductor device, a method for making the same, and an LCD monitor comprising the same |
| 08/08/2002 | US20020105075 Semiconductor module and method for fabricating the semiconductor module |
| 08/08/2002 | US20020105074 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
| 08/08/2002 | US20020105069 Semiconductor device including stud bumps as external connection terminals |
| 08/08/2002 | US20020105068 Stacked semiconductor device structure |
| 08/08/2002 | US20020105042 Flexible circuit with two stiffeners for optical module packaging |
| 08/08/2002 | US20020104877 Method of mounting electronic part |
| 08/08/2002 | US20020104874 Semiconductor chip package comprising enhanced pads |
| 08/08/2002 | US20020104873 Multilayer interconnection and method |
| 08/08/2002 | US20020104755 Electroplating current supply system |
| 08/08/2002 | US20020104684 Tape circuit board and semiconductor chip package including the same |
| 08/08/2002 | US20020104683 Press-fit pin connection checking method and system |
| 08/08/2002 | US20020104681 Multilayer circuit board |
| 08/08/2002 | US20020104677 Electrical conductor |
| 08/08/2002 | US20020104676 Film composite, method for producing the same and its use |
| 08/08/2002 | US20020104671 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 08/08/2002 | US20020104669 Methods and apparatus for shielding printed circuit board circuits |
| 08/08/2002 | US20020104519 Resin sealed electronic device |
| 08/08/2002 | US20020104369 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 08/08/2002 | DE10163324A1 Verfahren und Vorrichtung zur thermischen Analyse, Verfahren und Vorrichtung zur Berechnung thermischer Bedingungen sowie Computerprodukt Method and apparatus for thermal analysis, Method and apparatus for calculating thermal conditions and computer product |
| 08/08/2002 | DE10105089A1 Elektrischer Leiter Electrical conductor |
| 08/08/2002 | DE10104862A1 Übergangsleitung Transition line |
| 08/08/2002 | DE10057460C1 Halteelement mit einer Halteklammer, Anordnung mit einer Trägerplatte und einem Halteelement und Anordnung mit Halteelement und Trägerstreifen Retaining member having a retaining clip arrangement with a carrier plate and a holding element and arrangement with a holding member and carrier strip |
| 08/08/2002 | DE10048489C1 Polymer Stud Grid Array und Verfahren zur Herstellung eines derartigen Polymer Stud Grid Arrays Polymer stud grid array and methods for producing such a polymer stud grid array |
| 08/08/2002 | DE10043815C2 Verfahren und Vorrichtung zur elektrischen Kontaktierung von zu behandelndem Gut in elektrolytischen Anlagen Method and apparatus for electrically contacting material to be treated in electrolytic plants |
| 08/07/2002 | EP1229772A1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 08/07/2002 | EP1229771A1 Method for manufacturing printed wiring board |
| 08/07/2002 | EP1229770A1 Method for manufacturing printed-circuit board |