| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/20/2002 | US6434818 High-frequency circuit board and method of producing the same |
| 08/20/2002 | US6434817 Method for joining an integrated circuit |
| 08/20/2002 | CA2252866C Surface mount assembly for electronic components |
| 08/20/2002 | CA2218460C Mounting structure for a relay |
| 08/20/2002 | CA2115553C Plated compliant lead |
| 08/15/2002 | WO2002063934A1 Interconnect |
| 08/15/2002 | WO2002063688A1 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 08/15/2002 | WO2002063682A2 Lithographic type microelectronic spring structures with improved contours |
| 08/15/2002 | WO2002063674A1 Lead-free solder structure and method for high fatigue life |
| 08/15/2002 | WO2002063553A1 Coupling element for double-interface smart card |
| 08/15/2002 | WO2002063334A2 Integrated circuit for a radar device in a hermetically sealed housing comprising a patch antenna formed from a bent component from sheet metal |
| 08/15/2002 | WO2002063261A2 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 08/15/2002 | WO2002062520A1 A method of soldering and a preform therefor |
| 08/15/2002 | WO2002048432A3 Method for patterning metal using nanoparticle containing precursors |
| 08/15/2002 | WO2001078354A3 Hands-free communication device |
| 08/15/2002 | WO2001047016A9 Method and apparatus for encoding information in an ic package |
| 08/15/2002 | WO2001042533A9 Electroplating apparatus |
| 08/15/2002 | WO2001034335A9 Compact reflow and cleaning apparatus |
| 08/15/2002 | WO2001029288A9 Conveyorized electroplating device |
| 08/15/2002 | US20020111423 Method for manufacturing conductive adhesive for high frequency flip chip package application |
| 08/15/2002 | US20020111058 Locking assembly for securing semiconductor device to carrier substrate |
| 08/15/2002 | US20020111055 Anisotropic conductive film and production method thereof |
| 08/15/2002 | US20020111054 Ball grid array package and its fabricating process |
| 08/15/2002 | US20020111051 Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier |
| 08/15/2002 | US20020111029 Laser micromachining and electrical structures formed thereby |
| 08/15/2002 | US20020111003 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 08/15/2002 | US20020110957 Method of using a semiconductor chip package |
| 08/15/2002 | US20020110944 Method for patterning a multilayered conductor/substrate structure |
| 08/15/2002 | US20020110943 6699733 not granted per USPTO |
| 08/15/2002 | US20020110761 Photolithography patterns |
| 08/15/2002 | US20020110758 Overcoating elastic material onto substrate; forming stress profiles; photolithographical patterning |
| 08/15/2002 | US20020110757 Low cost integrated out-of-plane micro-device structures and method of making |
| 08/15/2002 | US20020110752 Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures |
| 08/15/2002 | US20020110697 Nonwarping at higher temperatures for use with lead-free solder to enable the reflow process in which lead-free solder is used to mount electronics |
| 08/15/2002 | US20020110674 Production of conductor tracks on plastics by means of laser energy |
| 08/15/2002 | US20020110665 Aperture fill |
| 08/15/2002 | US20020110645 Conductive polymer colloidal compositions with selectivity for non-conductive surfaces |
| 08/15/2002 | US20020110637 Substrate is coated with electroconductive film and subjected to baking; integrated circuits |
| 08/15/2002 | US20020110636 Nozzle for soldering apparatus |
| 08/15/2002 | US20020110178 Infrared temperature sensor |
| 08/15/2002 | US20020109974 Reduction of circuit board component exposure height |
| 08/15/2002 | US20020109775 Back-lighted fiducial recognition system and method of use |
| 08/15/2002 | US20020109634 Low cost antennas using conductive plastics or conductive composites |
| 08/15/2002 | US20020109573 Multilayer printed board with a double plane spiral interconnection structure |
| 08/15/2002 | US20020109426 Drive unit for a fan in a vehicle |
| 08/15/2002 | US20020109264 Method of embedding at least one flexible conductive track foil, a conductive track unit as well as an embedding unit therefor |
| 08/15/2002 | US20020109242 Semiconductor device and a method of manufacturing the same |
| 08/15/2002 | US20020109239 Semiconductor device capable of preventing solder balls from being removed in reinforcing pad |
| 08/15/2002 | US20020109238 Pitch compensation in flip-chip packaging |
| 08/15/2002 | US20020109227 Metal bump |
| 08/15/2002 | US20020109213 Methods of making microelectronic assemblies including compliant interfaces |
| 08/15/2002 | US20020109124 Anisotropic conductive adhesive |
| 08/15/2002 | US20020109000 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 08/15/2002 | US20020108781 Printed wiring board and production thereof |
| 08/15/2002 | US20020108780 Multilayered laminate |
| 08/15/2002 | US20020108779 Multi-layered printed wiring board |
| 08/15/2002 | US20020108778 Apparatus for shielding transmission line effects on a printed circuit board |
| 08/15/2002 | US20020108777 Method and apparatus for coupling integrated circuit packages to bonding pads having vias |
| 08/15/2002 | US20020108776 Multilayer printed circuit board and method of making the same |
| 08/15/2002 | US20020108775 Electric circuit interconnection system using a virtual mirror cross over package |
| 08/15/2002 | US20020108707 Bonding method and apparatus |
| 08/15/2002 | US20020108678 Forming a microroughened conversion coated metal surface with an adhesion promotor; wetting the surface with an aqueous wetting agent and applying the polymer; multilayer printed circuit; lamination; antipeeling agents; bonding strength |
| 08/15/2002 | US20020108513 Apparatus and method for printing solder paste |
| 08/15/2002 | CA2337290A1 Foil/ink composite inductor |
| 08/14/2002 | EP1231824A2 Process for embedding at least one conductive flexible printed circuit in plastic, conductive printed circuit device and embedding device |
| 08/14/2002 | EP1231682A2 Method and device for improving electrical contact of spring connectors |
| 08/14/2002 | EP1231637A2 High dielectric constant composite material and multilayer wiring board using the same |
| 08/14/2002 | EP1231617A1 Out-of-plane micro-device structures |
| 08/14/2002 | EP1231616A1 Out-of-plane micro-device structures |
| 08/14/2002 | EP1231500A2 Electronically addressable microencapsulated ink and display thereof |
| 08/14/2002 | EP1231248A1 Conductive and resistive materials with electrical stability for use in electronics devices |
| 08/14/2002 | EP1231240A1 Heat resistant composition |
| 08/14/2002 | EP1231182A2 Out-of-plane micro-device structures |
| 08/14/2002 | EP1231016A1 Soldering flux, solder paste and method of soldering |
| 08/14/2002 | EP1231015A1 Lead-free solder and solder joint |
| 08/14/2002 | EP1231013A1 Method and apparatus for laser drilling |
| 08/14/2002 | EP1230829A1 Apparatus and method for connecting printed circuit boards through soldered lap joints |
| 08/14/2002 | EP1230712A1 Connector |
| 08/14/2002 | EP1230446A2 Conveyorized electroplating device |
| 08/14/2002 | EP1230442A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 08/14/2002 | EP1230441A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 08/14/2002 | EP1230107A1 Control device for a motor vehicle and method for producing the same |
| 08/14/2002 | EP1230088A1 Method and apparatus for dispensing viscous material |
| 08/14/2002 | EP1230059A1 Compact reflow and cleaning apparatus |
| 08/14/2002 | EP1062383A4 Electrolyte and tin-silver electroplating process |
| 08/14/2002 | EP0823460B1 Water-base photosensitive resin composition |
| 08/14/2002 | DE10202107A1 Verfahren zum Herstellen einer geformten, gedruckten Schaltung A method for producing a molded printed circuit |
| 08/14/2002 | DE10105621A1 Elektrische Leiterplatte Electrical circuit board |
| 08/14/2002 | CN2505214Y Speical milling-cutter for printed circuit board |
| 08/14/2002 | CN1364402A Printed circuit board assembly with improved thermal performance |
| 08/14/2002 | CN1364247A 焊锡抗蚀剂油墨组合物 Solder resist ink composition |
| 08/14/2002 | CN1364114A Carrier foil-pasted metal foil and production method thereof |
| 08/14/2002 | CN1364051A Flexible distributing board and manufacture thereof |
| 08/14/2002 | CN1364049A Circuit substrate and manufacture thereof |
| 08/14/2002 | CN1363909A Connector |
| 08/14/2002 | CN1363427A Circuit products with welded parts and method for recovery of them for reuse |
| 08/14/2002 | CN1089120C Plating method |
| 08/13/2002 | US6434328 Fibrous supported polymer encapsulated electrical component |
| 08/13/2002 | US6433993 Multilayer; flexible metal layer, dielectrics, barrier; combustion vapor deposition |
| 08/13/2002 | US6433992 Monolithic capacitor |