| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/22/2002 | US20020114507 Saw alignment technique for array device singulation |
| 08/22/2002 | US20020114130 Portable electronic device with carrier plate |
| 08/22/2002 | US20020114129 Ultra-low impedance power interconnection system for electronic packages |
| 08/22/2002 | US20020113673 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
| 08/22/2002 | US20020113663 Energy conditioning circuit assembly |
| 08/22/2002 | US20020113330 Scavenging method |
| 08/22/2002 | US20020113324 Method for forming three-dimensional circuitization and circuits formed |
| 08/22/2002 | US20020113319 Flip chip semiconductor device having signal pads arranged outside of power supply pads |
| 08/22/2002 | US20020113312 Via plug adapter |
| 08/22/2002 | US20020113311 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two |
| 08/22/2002 | US20020113298 Electronic part and method of fabricating thereof |
| 08/22/2002 | US20020113216 Substrate treatment device using a dielectric barrier discharge lamp |
| 08/22/2002 | US20020113208 Process for precise arrangement of micro-bodies |
| 08/22/2002 | US20020113115 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
| 08/22/2002 | US20020113044 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 08/22/2002 | US20020112964 Plating solution of metal ions at a molar concentration of between about 0.4 M and about 0.9 M; an acid, a suppressor, an accelerator and a leveler; semiconductors; void- and defect-free; sub-micron scale and smaller features |
| 08/22/2002 | US20020112963 Methods for fabricating high-precision thermally stable electromagnetic coils |
| 08/22/2002 | US20020112885 Printed circuit board and method for manufacturing same |
| 08/22/2002 | US20020112884 Circuit board and method of manufacturing the same |
| 08/22/2002 | US20020112883 Structure and method for replacing an electrical net |
| 08/22/2002 | US20020112882 Ceramic circuit board |
| 08/22/2002 | US20020112881 Substrate of semiconductor package |
| 08/22/2002 | US20020112880 Flexible printed circuit board and manufacturing method |
| 08/22/2002 | US20020112879 Electronic parts mounting board and production method thereof |
| 08/22/2002 | US20020112822 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 08/22/2002 | US20020112821 Apparatus and method for applying viscous material |
| 08/22/2002 | US20020112815 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 08/22/2002 | US20020112632 Method for supporting sensitive workpieces during processing |
| 08/22/2002 | US20020112348 Component mounting method |
| 08/22/2002 | US20020112347 Methods for trimming electrical parameters in an electrical circuit |
| 08/22/2002 | DE10203353A1 Halbleitermodul und elektronische Komponente Semiconductor and electronic component module |
| 08/22/2002 | DE10154556A1 Gestapelte Halbleiterbauelementestruktur Stacked semiconductor device structure |
| 08/22/2002 | DE10111882C1 Verfahren und Vorrichtung zum Falten flexibler Trägerfolien Method and apparatus for folding flexible carrier films |
| 08/22/2002 | DE10105042C1 Kontaktmodul für einen Steckverbinder, insbesondere für einen Kartenrand-Steckverbinder Contact module for a connector, in particular for a card edge connector |
| 08/22/2002 | DE10103390A1 Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung A method and system for producing a substantially annular solder joint |
| 08/22/2002 | CA2428833A1 Energy pathway arrangements for energy conditioning |
| 08/22/2002 | CA2372757A1 Electronic parts and method producing the same |
| 08/21/2002 | EP1233663A2 Via fill compositions for direct attach of devices and methods for applying same |
| 08/21/2002 | EP1233662A1 Foil/ink composite inductor |
| 08/21/2002 | EP1233661A2 Methods for trimming electrical parameters in an electrical circuit |
| 08/21/2002 | EP1233474A2 Electrical connection system and method for flat circuits |
| 08/21/2002 | EP1233441A1 Arrangement and a method for reducing contamination with particles on a substrate in a process tool |
| 08/21/2002 | EP1233426A2 Antennas with conductive plastics or conductive composites |
| 08/21/2002 | EP1233370A1 Method of manufacturing resonant circuits |
| 08/21/2002 | EP1232802A2 Apparatus and method for applying viscous material |
| 08/21/2002 | EP1232677A2 Flip chip package, circuit board thereof and packaging method thereof |
| 08/21/2002 | EP1232540A1 Differential signal electrical connectors |
| 08/21/2002 | EP1232524A1 Method of protective coating bga solder alloy spheres |
| 08/21/2002 | EP1232294A2 Metallizing method for dielectrics |
| 08/21/2002 | EP1232201A1 Compositions for high-temperature resistant film coatings |
| 08/21/2002 | EP1232194A1 Radiation curable hot melt composition and a process for the application thereof |
| 08/21/2002 | EP1232039A1 Composition for preventing creeping of a flux for soldering and use thereof |
| 08/21/2002 | EP1123212B1 Method for manufacture of electronic parts |
| 08/21/2002 | EP1015247B1 Mini-stencil and device for using same |
| 08/21/2002 | EP0795262B1 Chemically grafted electrical devices |
| 08/21/2002 | CN1365525A RF switch |
| 08/21/2002 | CN1365521A Semiconductor device, method of manufacturing electronic device, electronic device and portable information terminal |
| 08/21/2002 | CN1365251A Thin film circuit board, its producing method and its use in producing thin film switch |
| 08/21/2002 | CN1365250A Method and device of preventing soldering tin from adhering in wave soldering |
| 08/21/2002 | CN1364677A Setting method of reflux furnace parameters for soldering surface mounted element |
| 08/21/2002 | CN1089543C Magnetic prepreg, its mfg. method and printed wiring board employing said prepreg |
| 08/21/2002 | CN1089356C Adhesive, adhesive film and adhesive-backed method foil |
| 08/20/2002 | US6438637 Dual solder-hole layout for expansion slots |
| 08/20/2002 | US6437991 Radioelectronic unit |
| 08/20/2002 | US6437990 Multi-chip ball grid array IC packages |
| 08/20/2002 | US6437989 Circuit board with an electronic component and a method for producing a connection between the circuit board and the component |
| 08/20/2002 | US6437986 Fuse relay junction block for use in automobiles |
| 08/20/2002 | US6437850 Method and device for exposing both sides of a sheet |
| 08/20/2002 | US6437673 Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit |
| 08/20/2002 | US6437669 Microwave to millimeter wave frequency substrate interface |
| 08/20/2002 | US6437591 Test interconnect for bumped semiconductor components and method of fabrication |
| 08/20/2002 | US6437588 Circuitry testing substrates |
| 08/20/2002 | US6437451 Test interconnect for semiconductor components having bumped and planar contacts |
| 08/20/2002 | US6437450 Method of mounting semiconductor chip |
| 08/20/2002 | US6437435 Vertically mountable interposer, assembly and method |
| 08/20/2002 | US6437312 Illumination for inspecting surfaces of articles |
| 08/20/2002 | US6437289 Reflow soldering apparatus |
| 08/20/2002 | US6437283 Device and method for processing substrates |
| 08/20/2002 | US6437254 Apparatus and method for printed circuit board repair |
| 08/20/2002 | US6437253 Terminal structure to which an electronic component is to be bonded |
| 08/20/2002 | US6437252 Method and structure for reducing power noise |
| 08/20/2002 | US6437251 Flexible board made by joining two pieces through an adhesive film |
| 08/20/2002 | US6436816 Patterns to form an interconnect; said metal layer composed of a material selected from the group consisting of ni, cu, and palladium, |
| 08/20/2002 | US6436803 Manufacturing computer systems with fine line circuitized substrates |
| 08/20/2002 | US6436802 Method of producing contact structure |
| 08/20/2002 | US6436735 Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact |
| 08/20/2002 | US6436734 Method of making a support circuit for a semiconductor chip assembly |
| 08/20/2002 | US6436730 Microelectronic package comprising tin copper solder bump interconnections and method for forming same |
| 08/20/2002 | US6436615 Methods and materials for selective modification of photopatterned polymer films |
| 08/20/2002 | US6436593 A polyimide precursor or a polyoxazole precursor having a group represented by--or, acid generation with radiation |
| 08/20/2002 | US6436517 Continuous molded electronic circuits |
| 08/20/2002 | US6436467 Flexible printed board and method of manufacturing same |
| 08/20/2002 | US6436276 Using printed circuits having copper on its surface as cathodes during electrolysis in metal hydroxide electrolytes, so that removal with minimal sheeting and abrasion occurs on the metal layers |
| 08/20/2002 | US6435906 Printed circuit board electrical connector with anchoring device |
| 08/20/2002 | US6435883 High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill |
| 08/20/2002 | US6435881 Device for the electrical and mechanical connection of two printed circuit boards |
| 08/20/2002 | US6435414 Electronic module for chip card |
| 08/20/2002 | US6435408 Electronic verification machine for documents |
| 08/20/2002 | US6435401 Apparatus and a method for removing solder from an object |
| 08/20/2002 | US6434819 Production of multilayer circuit board |