| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/29/2002 | DE10121969C1 Schaltungsanordnung in Druckkontaktierung und Verfahren zu seiner Herstellung Circuit arrangement in pressure contact and process for its preparation |
| 08/29/2002 | DE10107609A1 Spannungsversorgungsmodul Power Module |
| 08/29/2002 | DE10107342A1 Hausübergabepunkt und Bauteilesatz dafür Interconnection point and set of components for |
| 08/29/2002 | DE10105329A1 Druckschablone Stencil |
| 08/29/2002 | DE10105190A1 Verfahren zur Herstellung einer Feinstrukturierung eines Materials und Vorrichtung A method for producing a fine structuring of a material and device |
| 08/29/2002 | DE10105069A1 Kopplungselement für Dual-Interface-Karte Coupling element for dual interface card |
| 08/29/2002 | DE10104414A1 Elektrotechnisches Bauteil, Verfahren zum Verlöten dieses Bauteils mit einem weiteren elektrotechnischen Bauteil sowie Anordnung dieser miteinander verlöteten Bauteile Electro-technical component method for soldering of this component with another electrical component and assembly of these components are soldered together |
| 08/29/2002 | DE10103456C1 Vorrichtung mit mindestens einem Halbleiterbauteil und einer Leiterplatte und Verfahren zur Herstellung einer elektromechanischen Verbindung zwischen beiden A device with at least one semiconductor device and a circuit board and method for producing an electro-mechanical connection between the two |
| 08/29/2002 | CA2439167A1 Method and device for testing the quality of printed circuits |
| 08/29/2002 | CA2438469A1 Method and system for connecting a cable to a circuit board |
| 08/28/2002 | EP1235472A1 Insulating agent for multilayer printed wiring board, insulating agent with metal foil and multilayer printed wiring board |
| 08/28/2002 | EP1235295A2 High frequency circuit board and antenna switch module for high frequency using the same |
| 08/28/2002 | EP1235267A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same |
| 08/28/2002 | EP1235264A2 Direct etch for thin film resistor using a hard mask |
| 08/28/2002 | EP1235235A1 Electronic parts and method producing the same |
| 08/28/2002 | EP1235233A2 Electrical devices |
| 08/28/2002 | EP1234488A1 Inter-circuit encapsulated packaging for power delivery |
| 08/28/2002 | EP1234487A2 Method for the direct electroplating of through-holes in printed circuit boards |
| 08/28/2002 | EP1233935A1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body |
| 08/28/2002 | EP1156886A4 Apparatus and method for applying flux to a substrate |
| 08/28/2002 | EP0963290B1 High temperature release films |
| 08/28/2002 | CN2508472Y Small optical transmission and receiving module casing capable of connecting-disconnecting |
| 08/28/2002 | CN1366798A Laminate with inside layer circuit used for multilayer printed circuit board for high frequency circuit, and method and device for measuring circuit impedance of laminate with inside layer circuit |
| 08/28/2002 | CN1366797A System for mounting electronic device |
| 08/28/2002 | CN1366563A Process for electroplating work piece coated with electrically conducting polymer |
| 08/28/2002 | CN1366447A Circuit substrate and its making method and display apparatus |
| 08/28/2002 | CN1366446A Parts built in module and its making method |
| 08/28/2002 | CN1366445A Manufacturing method of multilayer flexible wiring plate |
| 08/28/2002 | CN1366444A Parts built-in module and its making method |
| 08/28/2002 | CN1366337A Joint head and parts installation equipment |
| 08/28/2002 | CN1366323A Electrode base plate used for plasma display screen and its manufacturing method |
| 08/28/2002 | CN1366211A Printing ink composition used for welding protective layer |
| 08/28/2002 | CN1365998A Resin shaping block |
| 08/28/2002 | CN1365879A Punching apparatus |
| 08/28/2002 | CN1365871A Thermal pressure welding method and thermal pressure welding equipment |
| 08/28/2002 | CN1089991C Structure for mounting EL lamp |
| 08/28/2002 | CN1089907C 光敏树脂组合物 The photosensitive resin composition |
| 08/28/2002 | CN1089905C Liquid crystal display device with reduced frame portion surrounding display area |
| 08/28/2002 | CN1089791C Copper foil with adhesive layer |
| 08/28/2002 | CN1089790C Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith |
| 08/28/2002 | CN1089689C Device for cleaning screen plate used in sceen printing |
| 08/28/2002 | CN1089685C Screen printing method and apparatus therefor |
| 08/28/2002 | CA2373675A1 Optical data link |
| 08/28/2002 | CA2365004A1 Manufacturing method for a printed wiring board |
| 08/27/2002 | US6441717 PTC thermister chip |
| 08/27/2002 | US6441628 CSP BGA test socket with insert and method |
| 08/27/2002 | US6441488 Fan-out translator for a semiconductor package |
| 08/27/2002 | US6441486 BGA substrate via structure |
| 08/27/2002 | US6441485 Apparatus for electrically mounting an electronic device to a substrate without soldering |
| 08/27/2002 | US6441477 Substrate mounting an integrated circuit package with a deformed lead |
| 08/27/2002 | US6441339 Apparatus for manufacturing circuit modules |
| 08/27/2002 | US6441337 Laser machining method, laser machining device and control method of laser machining |
| 08/27/2002 | US6441320 Electrically conductive projections having conductive coverings |
| 08/27/2002 | US6441319 Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate |
| 08/27/2002 | US6441318 Compensation adjustable printed circuit board |
| 08/27/2002 | US6441316 Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module |
| 08/27/2002 | US6441314 Multilayered substrate for semiconductor device |
| 08/27/2002 | US6441312 Electronic package with plurality of solder-applied areas providing heat transfer |
| 08/27/2002 | US6440864 Substrate cleaning process |
| 08/27/2002 | US6440835 Method of connecting a conductive trace to a semiconductor chip |
| 08/27/2002 | US6440777 Method of depositing a thermoplastic polymer in semiconductor fabrication |
| 08/27/2002 | US6440775 Method and apparatus for edge connection between elements of an integrated circuit |
| 08/27/2002 | US6440647 Resist stripping process |
| 08/27/2002 | US6440642 Dielectric composition |
| 08/27/2002 | US6440641 Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 08/27/2002 | US6440625 Method of electrostatic recording on a cylindrical photoreceptor with dielectric coating and an electrophotographic duplicating apparatus |
| 08/27/2002 | US6440576 Metal plated aromatic polyimide film |
| 08/27/2002 | US6440542 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 08/27/2002 | US6440503 Laser deposition of elements onto medical devices |
| 08/27/2002 | US6440331 Electrically conductive coating of printed wiring boards so they can be electroplated; graphite particles, tin oxide and antimony |
| 08/27/2002 | US6440318 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 08/27/2002 | US6440258 Polycarbodiimide, epoxy resins and fillers, having heat resistance and flexibility |
| 08/27/2002 | US6440215 Fluid knife |
| 08/27/2002 | US6439900 Sliding connector interface with non-metallic contacts |
| 08/27/2002 | US6439898 Method and apparatus for interconnecting devices using an adhesive |
| 08/27/2002 | US6439895 Pin-free socket compatible with optical/electrical interconnects |
| 08/27/2002 | US6439698 A dual curable encapsulant is provided for use in protecting electrical components. the encapsulant contains epoxy material, from a catalytic amount of a photocurative catalyst and co-catalyst and a reactive diluent. ink jet printer and |
| 08/27/2002 | US6439115 Uphill screen printing in the manufacturing of microelectronic components |
| 08/27/2002 | US6438830 Process of producing plastic pin grid array |
| 08/27/2002 | US6438827 Ceramic electronic part and method for producing the same |
| 08/22/2002 | WO2002065822A1 Method for producing wirings with rough conducting structures and at least one area with fine conducting structures |
| 08/22/2002 | WO2002065606A2 Energy pathway arrangements for energy conditioning |
| 08/22/2002 | WO2002065592A1 Demountable clamping means for land grid array connectors |
| 08/22/2002 | WO2002065589A1 Connector and contact wafer |
| 08/22/2002 | WO2002065527A1 Method for patterning a multilayered conductor/substrate structure |
| 08/22/2002 | WO2002065487A1 Resistor element, stress sensor and method for manufacturing them |
| 08/22/2002 | WO2002064496A2 Method for forming microelectronic spring structures on a substrate |
| 08/22/2002 | WO2002064364A1 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 08/22/2002 | WO2002064363A1 Laminate and process for producing the same |
| 08/22/2002 | WO2002064301A2 Laser micromachining and electrical structures |
| 08/22/2002 | WO2002051223A8 Method for producing interconnection in a multilayer printed circuits |
| 08/22/2002 | WO2002023674A3 Thick film millimeter wave transceiver module |
| 08/22/2002 | US20020115739 Bisphenol type epoxyacrylate resin; (meth)acrylic acid copolymer modified by reaction with glycidyl (meth)acrylate; thermosetting resin; reactive diluent; photoinitiator |
| 08/22/2002 | US20020115316 Solderless connector for opto-electric module |
| 08/22/2002 | US20020115314 Board edge launch connector |
| 08/22/2002 | US20020115279 Use of palladium in IC manufacturing |
| 08/22/2002 | US20020115278 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
| 08/22/2002 | US20020114969 Covercoats to protect the circuitry |
| 08/22/2002 | US20020114932 Composite multilayered ceramic board and manufacturing method thereof |
| 08/22/2002 | US20020114726 Electronic device |