Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2002
09/04/2002CN1090438C Hand-off method in personal communication service system
09/04/2002CN1090373C Terminal and its mfg. method
09/04/2002CN1090372C 介电陶瓷组合物 The dielectric ceramic composition
09/04/2002CN1090370C Anisotropically conducting adhesive and process for its production
09/04/2002CN1090369C Thick film conductor compositions with improved adhesion
09/04/2002CN1090191C Adhesion additives and curable organosiloxane compositions containing same
09/04/2002CN1090190C Heterocycle-condensed morphinoid derivatives and its preparing method and use
09/03/2002US6445594 Semiconductor device having stacked semiconductor elements
09/03/2002US6445592 Electronic assembly
09/03/2002US6445590 Capacitor for DRAM connector
09/03/2002US6445589 Method of extending life expectancy of surface mount components
09/03/2002US6445584 Electronic control unit
09/03/2002US6445475 Method for practically loading transmission or receiving module for optical link and its rigid flexible board
09/03/2002US6445277 Safety device of electric circuit and process for producing the same
09/03/2002US6445173 Printed circuit board tester
09/03/2002US6445075 Semiconductor module package substrate
09/03/2002US6445074 Electronic component mounted on a flat substrate and padded with a fluid filler
09/03/2002US6444977 Electric member having leads with loosening prevention kinks
09/03/2002US6444925 Press-fit pin connection checking method and system
09/03/2002US6444924 Printed wiring board with joining pin and manufacturing method therefor
09/03/2002US6444923 Method of connecting printed wiring boards with each other, and printed circuit board
09/03/2002US6444921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
09/03/2002US6444920 Thin film circuit with component
09/03/2002US6444919 Thin film wiring scheme utilizing inter-chip site surface wiring
09/03/2002US6444911 Bus bar wiring plate body for electric coupling box
09/03/2002US6444563 Method and apparatus for extending fatigue life of solder joints in a semiconductor device
09/03/2002US6444562 Nickel alloy films for reduced intermetallic formation in solder
09/03/2002US6444561 Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips
09/03/2002US6444501 Two stage transfer molding method to encapsulate MMC module
09/03/2002US6444497 Method and apparatus for reducing BGA warpage caused by encapsulation
09/03/2002US6444403 Coating an epoxy-acrylate photosensitive resin composition on a copper foil; etching the epoxy-acrylate photosensitive resin composition on the copper foil into a shape by exposing and developing; forming a first conductive pattern by plating
09/03/2002US6444400 Method of making an electroconductive pattern on a support
09/03/2002US6444379 Method for preparing a printed wiring board which can form electrostatic latent images at the desired positions of a substrate with good precision, and a uniform and good image can be formed for preparing a printed wiring board having
09/03/2002US6444378 Waterborne photoresists for use in manufacture of printed circuit boards
09/03/2002US6444305 Swellable elastomer microspheres; polymerizable monomer
09/03/2002US6444297 Method of producing a thick film metallization on an aluminum nitride substrate
09/03/2002US6444140 Contain a proton source, e.g., a mineral acid, an oxidizer agent, e.g., hydrogen peroxide, an azole compound, and a molybdenum source.
09/03/2002US6444110 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels
09/03/2002US6444109 Immersion silver deposits created are resistant to electromigration, electronics
09/03/2002US6444066 Blending dielectric and glass powders of oxides of barium, titanium and rare earth metals, then molding into sheets; forming a silver conductor patterns on the surface and heating; suppression diffusion
09/03/2002US6443739 LGA compression contact repair system
09/03/2002US6443737 Circuit board, electrical connection box having the circuit board and method of making the circuit board
09/03/2002US6443355 Soldering method and apparatus
09/03/2002US6443351 Method of achieving solder ball coplanarity on ball grid array integrated circuit package
09/03/2002US6443350 Continuous mode solder jet apparatus
09/03/2002US6443041 Card edge chamfering system
09/03/2002US6442832 Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
09/03/2002US6442831 Method for shaping spring elements
08/2002
08/29/2002WO2002067648A1 Machine tool for the processing of packs of printed circuit boards
08/29/2002WO2002067644A1 Machine for stacking and bonding sub-boards of a multilayer board for a printed circuit and method of fabrication of a multilayer board
08/29/2002WO2002067643A2 High strength vias
08/29/2002WO2002067642A1 Method for producing a multiwire printed circuit board and multiwire printed circuit boards produced according to said method
08/29/2002WO2002067641A1 Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process
08/29/2002WO2002067640A1 Electronic device and method of manufacturing the same
08/29/2002WO2002067639A1 An electronic device and a circuit arrangement
08/29/2002WO2002067638A1 Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board
08/29/2002WO2002067384A1 Method and system for connecting a cable to a circuit board
08/29/2002WO2002067324A1 Member for electronic circuit, method for manufacturing the member, and electronic part
08/29/2002WO2002067294A2 Arrangement and a method for reducing contamination with particles on a substrate in a process tool
08/29/2002WO2002067017A2 Optical device module and method of fabrication
08/29/2002WO2002067002A1 Method and device for testing the quality of printed circuits
08/29/2002WO2002066256A2 Process for the manufacture of printed circuit boards with plated resistors
08/29/2002WO2002066251A2 Printing plates
08/29/2002WO2002066205A2 Operating head for a machine tool with a spindle rotating on a vertical axis
08/29/2002WO2002045474A3 Board integrated resilient contact elements array and method of fabrication
08/29/2002WO2002039794A3 System and method for fabricating printed circuit boards
08/29/2002WO2002035655A3 Surface mount connector lead
08/29/2002WO2001033927B1 Inter-circuit encapsulated packaging for power delivery
08/29/2002US20020120031 Photothermosetting component
08/29/2002US20020119665 Printing plates
08/29/2002US20020119658 Semiconductor device and method for making the same
08/29/2002US20020119605 Fluoropolymers
08/29/2002US20020119396 Structure and method for forming z-laminated multilayered packaging substrate
08/29/2002US20020119342 Multilayer coating for printed circuits
08/29/2002US20020119251 Depositing catalytic particles on a selected area of the stamp including raised region, applying stamp on the substrate to indent selectd region caused by raised region, transferring catalyst particles, plating selected area
08/29/2002US20020118523 Electronic circuit equipment using multilayer circuit board
08/29/2002US20020118519 Composite devices of laminate type and processes for producing same
08/29/2002US20020118504 Power supply module
08/29/2002US20020118350 Method and apparatus for registration control in production by imaging
08/29/2002US20020118347 Aligner
08/29/2002US20020118345 Method and apparatus for printing patterns on substrates
08/29/2002US20020118332 Liquid crystal display device
08/29/2002US20020117964 Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same
08/29/2002US20020117954 Device for mounting a light source
08/29/2002US20020117764 Lead-on-chip type of semiconductor package with embedded heat sink
08/29/2002US20020117761 Off-center solder ball attach assembly
08/29/2002US20020117753 Three dimensional packaging
08/29/2002US20020117743 Component built-in module and method for producing the same
08/29/2002US20020117539 Solder, method for processing surface of printed wiring board, and method for mounting electronic part
08/29/2002US20020117535 Rework and underfill nozzle for electronic components
08/29/2002US20020117468 Method for forming a recognition mark on a substrate for a KGD
08/29/2002US20020117400 Conductor pattern is formed on surface of insulating substrate by electroless copper plating; anionic surfactant suppresses adsorption of palldium-tin mixed colloid catalyst to the plating resist solution; electronics
08/29/2002US20020117331 Manufacturing method for a printed wiring board
08/29/2002US20020117330 Resilient contact structures formed and then attached to a substrate
08/29/2002US20020117329 Components with releasable leads
08/29/2002US20020117328 Flexible substrate, electro-optical device and electronic device
08/29/2002US20020117256 Methods for fabricating flexible circuit structures
08/29/2002US20020117063 Screen printer and screen printing method
08/29/2002US20020116815 Manufacturing method of printed circuit board using dry film resist
08/29/2002DE10203366A1 Mikrostreifenleitung, Resonatorelement, Filter, Hochfrequenzschaltung und elektronisches Gerät, das dieselben verwendet Microstrip line resonator, filter, high-frequency circuit and electronic apparatus using the same