Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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09/04/2002 | CN1090438C Hand-off method in personal communication service system |
09/04/2002 | CN1090373C Terminal and its mfg. method |
09/04/2002 | CN1090372C 介电陶瓷组合物 The dielectric ceramic composition |
09/04/2002 | CN1090370C Anisotropically conducting adhesive and process for its production |
09/04/2002 | CN1090369C Thick film conductor compositions with improved adhesion |
09/04/2002 | CN1090191C Adhesion additives and curable organosiloxane compositions containing same |
09/04/2002 | CN1090190C Heterocycle-condensed morphinoid derivatives and its preparing method and use |
09/03/2002 | US6445594 Semiconductor device having stacked semiconductor elements |
09/03/2002 | US6445592 Electronic assembly |
09/03/2002 | US6445590 Capacitor for DRAM connector |
09/03/2002 | US6445589 Method of extending life expectancy of surface mount components |
09/03/2002 | US6445584 Electronic control unit |
09/03/2002 | US6445475 Method for practically loading transmission or receiving module for optical link and its rigid flexible board |
09/03/2002 | US6445277 Safety device of electric circuit and process for producing the same |
09/03/2002 | US6445173 Printed circuit board tester |
09/03/2002 | US6445075 Semiconductor module package substrate |
09/03/2002 | US6445074 Electronic component mounted on a flat substrate and padded with a fluid filler |
09/03/2002 | US6444977 Electric member having leads with loosening prevention kinks |
09/03/2002 | US6444925 Press-fit pin connection checking method and system |
09/03/2002 | US6444924 Printed wiring board with joining pin and manufacturing method therefor |
09/03/2002 | US6444923 Method of connecting printed wiring boards with each other, and printed circuit board |
09/03/2002 | US6444921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
09/03/2002 | US6444920 Thin film circuit with component |
09/03/2002 | US6444919 Thin film wiring scheme utilizing inter-chip site surface wiring |
09/03/2002 | US6444911 Bus bar wiring plate body for electric coupling box |
09/03/2002 | US6444563 Method and apparatus for extending fatigue life of solder joints in a semiconductor device |
09/03/2002 | US6444562 Nickel alloy films for reduced intermetallic formation in solder |
09/03/2002 | US6444561 Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips |
09/03/2002 | US6444501 Two stage transfer molding method to encapsulate MMC module |
09/03/2002 | US6444497 Method and apparatus for reducing BGA warpage caused by encapsulation |
09/03/2002 | US6444403 Coating an epoxy-acrylate photosensitive resin composition on a copper foil; etching the epoxy-acrylate photosensitive resin composition on the copper foil into a shape by exposing and developing; forming a first conductive pattern by plating |
09/03/2002 | US6444400 Method of making an electroconductive pattern on a support |
09/03/2002 | US6444379 Method for preparing a printed wiring board which can form electrostatic latent images at the desired positions of a substrate with good precision, and a uniform and good image can be formed for preparing a printed wiring board having |
09/03/2002 | US6444378 Waterborne photoresists for use in manufacture of printed circuit boards |
09/03/2002 | US6444305 Swellable elastomer microspheres; polymerizable monomer |
09/03/2002 | US6444297 Method of producing a thick film metallization on an aluminum nitride substrate |
09/03/2002 | US6444140 Contain a proton source, e.g., a mineral acid, an oxidizer agent, e.g., hydrogen peroxide, an azole compound, and a molybdenum source. |
09/03/2002 | US6444110 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels |
09/03/2002 | US6444109 Immersion silver deposits created are resistant to electromigration, electronics |
09/03/2002 | US6444066 Blending dielectric and glass powders of oxides of barium, titanium and rare earth metals, then molding into sheets; forming a silver conductor patterns on the surface and heating; suppression diffusion |
09/03/2002 | US6443739 LGA compression contact repair system |
09/03/2002 | US6443737 Circuit board, electrical connection box having the circuit board and method of making the circuit board |
09/03/2002 | US6443355 Soldering method and apparatus |
09/03/2002 | US6443351 Method of achieving solder ball coplanarity on ball grid array integrated circuit package |
09/03/2002 | US6443350 Continuous mode solder jet apparatus |
09/03/2002 | US6443041 Card edge chamfering system |
09/03/2002 | US6442832 Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric |
09/03/2002 | US6442831 Method for shaping spring elements |
08/29/2002 | WO2002067648A1 Machine tool for the processing of packs of printed circuit boards |
08/29/2002 | WO2002067644A1 Machine for stacking and bonding sub-boards of a multilayer board for a printed circuit and method of fabrication of a multilayer board |
08/29/2002 | WO2002067643A2 High strength vias |
08/29/2002 | WO2002067642A1 Method for producing a multiwire printed circuit board and multiwire printed circuit boards produced according to said method |
08/29/2002 | WO2002067641A1 Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process |
08/29/2002 | WO2002067640A1 Electronic device and method of manufacturing the same |
08/29/2002 | WO2002067639A1 An electronic device and a circuit arrangement |
08/29/2002 | WO2002067638A1 Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
08/29/2002 | WO2002067384A1 Method and system for connecting a cable to a circuit board |
08/29/2002 | WO2002067324A1 Member for electronic circuit, method for manufacturing the member, and electronic part |
08/29/2002 | WO2002067294A2 Arrangement and a method for reducing contamination with particles on a substrate in a process tool |
08/29/2002 | WO2002067017A2 Optical device module and method of fabrication |
08/29/2002 | WO2002067002A1 Method and device for testing the quality of printed circuits |
08/29/2002 | WO2002066256A2 Process for the manufacture of printed circuit boards with plated resistors |
08/29/2002 | WO2002066251A2 Printing plates |
08/29/2002 | WO2002066205A2 Operating head for a machine tool with a spindle rotating on a vertical axis |
08/29/2002 | WO2002045474A3 Board integrated resilient contact elements array and method of fabrication |
08/29/2002 | WO2002039794A3 System and method for fabricating printed circuit boards |
08/29/2002 | WO2002035655A3 Surface mount connector lead |
08/29/2002 | WO2001033927B1 Inter-circuit encapsulated packaging for power delivery |
08/29/2002 | US20020120031 Photothermosetting component |
08/29/2002 | US20020119665 Printing plates |
08/29/2002 | US20020119658 Semiconductor device and method for making the same |
08/29/2002 | US20020119605 Fluoropolymers |
08/29/2002 | US20020119396 Structure and method for forming z-laminated multilayered packaging substrate |
08/29/2002 | US20020119342 Multilayer coating for printed circuits |
08/29/2002 | US20020119251 Depositing catalytic particles on a selected area of the stamp including raised region, applying stamp on the substrate to indent selectd region caused by raised region, transferring catalyst particles, plating selected area |
08/29/2002 | US20020118523 Electronic circuit equipment using multilayer circuit board |
08/29/2002 | US20020118519 Composite devices of laminate type and processes for producing same |
08/29/2002 | US20020118504 Power supply module |
08/29/2002 | US20020118350 Method and apparatus for registration control in production by imaging |
08/29/2002 | US20020118347 Aligner |
08/29/2002 | US20020118345 Method and apparatus for printing patterns on substrates |
08/29/2002 | US20020118332 Liquid crystal display device |
08/29/2002 | US20020117964 Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
08/29/2002 | US20020117954 Device for mounting a light source |
08/29/2002 | US20020117764 Lead-on-chip type of semiconductor package with embedded heat sink |
08/29/2002 | US20020117761 Off-center solder ball attach assembly |
08/29/2002 | US20020117753 Three dimensional packaging |
08/29/2002 | US20020117743 Component built-in module and method for producing the same |
08/29/2002 | US20020117539 Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
08/29/2002 | US20020117535 Rework and underfill nozzle for electronic components |
08/29/2002 | US20020117468 Method for forming a recognition mark on a substrate for a KGD |
08/29/2002 | US20020117400 Conductor pattern is formed on surface of insulating substrate by electroless copper plating; anionic surfactant suppresses adsorption of palldium-tin mixed colloid catalyst to the plating resist solution; electronics |
08/29/2002 | US20020117331 Manufacturing method for a printed wiring board |
08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
08/29/2002 | US20020117329 Components with releasable leads |
08/29/2002 | US20020117328 Flexible substrate, electro-optical device and electronic device |
08/29/2002 | US20020117256 Methods for fabricating flexible circuit structures |
08/29/2002 | US20020117063 Screen printer and screen printing method |
08/29/2002 | US20020116815 Manufacturing method of printed circuit board using dry film resist |
08/29/2002 | DE10203366A1 Mikrostreifenleitung, Resonatorelement, Filter, Hochfrequenzschaltung und elektronisches Gerät, das dieselben verwendet Microstrip line resonator, filter, high-frequency circuit and electronic apparatus using the same |