Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2002
09/11/2002CN1090698C Screen-like plated article comprising mesh-like fabric using sheath-ore composite filaments and cylinder for rotary screen
09/11/2002CN1090686C Copper and copper alloy micro-etching agent
09/11/2002CN1090651C Polymer composition for making single or multilayer circuit patterns
09/11/2002CN1090550C 焊料合金 Solder alloy
09/11/2002CN1090549C Pb-in-sn tall C-4 for fatigue enhancement solder structure for electronic component subassembly and its application method
09/10/2002US6449308 High-speed digital distribution system
09/10/2002US6449167 Method and apparatus for building and testing electronic circuits
09/10/2002US6449158 Method and apparatus for securing an electronic power device to a heat spreader
09/10/2002US6449082 Busbars for electrically powered cells
09/10/2002US6449030 Balanced positioning system for use lithographic apparatus
09/10/2002US6448697 Piezoelectric device having increased mechanical compliance
09/10/2002US6448647 BGA package substrate
09/10/2002US6448646 Semiconductor device-mounting construction and inspection method therefor
09/10/2002US6448533 Method of repairing disconnected wiring and multilevel wiring structure
09/10/2002US6448510 Substrate for electronic packaging, pin jig fixture
09/10/2002US6448509 Printed circuit board with heat spreader and method of making
09/10/2002US6448508 Electrical component with a flexible strip of connecting conductors
09/10/2002US6448506 Semiconductor package and circuit board for making the package
09/10/2002US6448504 Printed circuit board and semiconductor package using the same
09/10/2002US6448491 Electromagnetic interference suppressing body having low electromagnetic transparency and reflection, and electronic device having the same
09/10/2002US6448184 Formation of diamond particle interconnects
09/10/2002US6448170 Method of producing external connector for substrate
09/10/2002US6448169 Apparatus and method for use in manufacturing semiconductor devices
09/10/2002US6447929 Printed circuit boards; electrodepositing layer of chromium on copper foil, electrodepositing layer of copper on said chromium layer; nodular treatment to layers to enhance the bonding characteristics and peel strength
09/10/2002US6447915 Small variation in thickness between layers; polysulfone thermoplastic resin, epoxy or phenoxy resin having both a bisphenol s skeleton and a biphenyl skeleton, multifunctional epoxy resin, epoxy curing agent; coating a copper foil
09/10/2002US6447914 Seeding and electroless plating; dielectric layer is an epoxy resin, which is a phenoxy polyol resin, the condensate of an epihalohydrin and bisphenol a or an epoxidized bisphenol a formaldehyde novolac resin
09/10/2002US6447898 Tackifying resins, epoxy resins with hardeners, metallized particles,nondeformable spacer particles; electronic components
09/10/2002US6447847 Circuit boards; robotic dispensing and/or spraying
09/10/2002US6447321 Socket for coupling an integrated circuit package to a printed circuit board
09/10/2002US6446855 Compact reflow and cleaning apparatus
09/10/2002US6446335 Direct thermal compression bonding through a multiconductor base layer
09/06/2002WO2002069681A1 A method of soldering
09/06/2002WO2002069680A2 Adapter for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
09/06/2002WO2002069679A2 Stacked panel processing apparatus and methods
09/06/2002WO2002069678A2 Method for producing printed circuit boards
09/06/2002WO2002069454A1 A shielded carrier with components for land grid array connectors
09/06/2002WO2002069388A1 Electrical apparatus and method of manufacturing electrical apparatus
09/06/2002WO2002069053A2 Method and apparatus for registration control in production by imaging
09/06/2002WO2002069048A2 Method and apparatus for printing patterns on substrates
09/06/2002WO2002068831A1 Assembly element for interlinking two objects
09/06/2002WO2002068321A2 Forming tool for forming a contoured microelectronic spring mold
09/06/2002WO2002068245A1 Method for producing a moulded component comprising an integrated conductor strip and moulded component
09/06/2002WO2002068198A1 Corrosion prevention for cac component
09/06/2002WO2002034021A3 Carrier-based electronic module
09/06/2002WO2001007195A9 Method of producing microbore holes
09/05/2002US20020123540 Dielectric compositions having two steps of laminating temperatures
09/05/2002US20020123313 High frequency circuit board and antenna switch module for high frequency using the same
09/05/2002US20020123285 Electronic supports and methods and apparatus for forming apertures in electronic supports
09/05/2002US20020123253 Low inductance connector
09/05/2002US20020123213 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
09/05/2002US20020123176 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method
09/05/2002US20020123172 Methods for forming a die package
09/05/2002US20020122934 Producing time is shortened, and crack or warp are hard to occur, reduction of cost can be attained
09/05/2002US20020122923 Layered circuit boards and methods of production thereof
09/05/2002US20020122915 Adhesive, process for the preparation thereof, and process for mounting components
09/05/2002US20020122898 Positioning source of laser energy in a spaced relation to the target substrate; positioning receiving substrate in a spaced relation to target substrate; exposing target substrate to the laser energy for deposition
09/05/2002US20020122301 Electronic component and method of producing the same
09/05/2002US20020122283 Capacitor, circuit board with built-in capacitor and method for producing the same
09/05/2002US20020122109 Laser pattern imaging of circuit boards with grayscale image correction
09/05/2002US20020121912 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
09/05/2002US20020121709 External connection terminal and semiconductor device
09/05/2002US20020121693 Stacked die package
09/05/2002US20020121690 Semiconductor memory module having double-sided stacked memory chip layout
09/05/2002US20020121689 Flip chip type semiconductor device and method for manufacturing the same
09/05/2002US20020121687 Electronic component with stacked semiconductor chips
09/05/2002US20020121507 Method of producing microbore holes
09/05/2002US20020121334 Wiring board prepreg and manufacturing method thereof
09/05/2002DE10106399C1 Verfahren zur Herstellung von Schaltungsträgern mit groben Leiterstrukturen und mindestens einem Bereich mit feinen Leiterstrukturen A process for producing circuit carriers with conductor structures and at least one rough area with fine conductor structures
09/05/2002DE10103761A1 Flexibles Flachbandkabel Flexible flat cable
09/05/2002DE10102671A1 Elektrische Heizung für ein Kraftfahrzeug Electric heating for a motor vehicle
09/04/2002EP1237399A1 Multilayered printed circuit board
09/04/2002EP1237398A2 Manufacturing method for a printed wiring board
09/04/2002EP1237397A2 Insulating substrate boards for semiconductor and power modules
09/04/2002EP1237396A2 Component carrier
09/04/2002EP1237202A2 Semiconductor device and method for making the same
09/04/2002EP1237025A2 Opto-electronic module with printed circuit board (PCB)
09/04/2002EP1236991A1 Solderability testing apparatus and solderability testing method
09/04/2002EP1236760A1 Solvent swell for texturing resinous material and desmearing and removing resinous material
09/04/2002EP1236383A2 Switchable wavelength laser-based etched circuit board processing system
09/04/2002EP1236382A1 Mounting electrical devices to circuit boards
09/04/2002EP1236273A1 High voltage hybrid circuit
09/04/2002EP1236052A1 Electrical test of the interconnection of conductors on a substrate
09/04/2002EP1236017A2 X-ray tomography bga ( ball grid array ) inspections
09/04/2002EP1235661A1 Separating and milling device
09/04/2002EP1082777A4 Wideband rf port structure using coplanar waveguide and bga i/o
09/04/2002EP0996957B1 Capacitor connector, especially for an electrolytic power capacitor
09/04/2002EP0976155B1 High-voltage, high-current multilayer circuit board, method for the production thereof
09/04/2002EP0956952B1 Cleaning apparatus and cleaning method
09/04/2002EP0707524B1 Solderable anisotropically conductive composition and method of using same
09/04/2002CN2509817Y Punching equipment for printed circuit board
09/04/2002CN1367992A Improved circuit board manufacturing process
09/04/2002CN1367946A Multi-functional energy conditioner
09/04/2002CN1367757A Method for preparing highly stabilised hydroxylamine solutions
09/04/2002CN1367734A Adhesion promoting layer for use with epoxy prepregs
09/04/2002CN1367641A Screen printing device and method
09/04/2002CN1367554A Electric component with conducting circuit
09/04/2002CN1367371A Circuit board checking device and method
09/04/2002CN1367068A Method for making pathway pattern
09/04/2002CN1090440C Method for cleaning metal masks for surface mounting technology
09/04/2002CN1090439C Method for preparing base plate for semiconductor assembling