| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/17/2002 | US6450416 Device and method for jetting droplets |
| 09/17/2002 | US6450397 Method of making ball grid array columns |
| 09/17/2002 | US6450181 Heating aqueous solution of oxygen, ammonia and hydrogen peroxide |
| 09/17/2002 | US6450091 Mini-stencil and device for using same |
| 09/17/2002 | US6449840 Column grid array for flip-chip devices |
| 09/17/2002 | US6449839 Electrical circuit board and a method for making the same |
| 09/17/2002 | US6449837 Method for attaching electronic devices to metallized glass printed circuit |
| 09/17/2002 | US6449836 Method for interconnecting printed circuit boards and interconnection structure |
| 09/17/2002 | US6449835 Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it |
| 09/12/2002 | WO2002071819A1 Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method |
| 09/12/2002 | WO2002071818A1 Method for producing flexible wiring board |
| 09/12/2002 | WO2002071484A1 Board level shield |
| 09/12/2002 | WO2002071466A1 Metal pattern formation |
| 09/12/2002 | WO2002070921A1 Mechatronic transmission control |
| 09/12/2002 | WO2002070780A1 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 09/12/2002 | WO2002070260A1 Screen printing |
| 09/12/2002 | WO2002058448A3 Apparatus and method for producing non-or lightly-embossed panels |
| 09/12/2002 | WO2002019430A3 Hybrid substrate with embedded capacitors and methods of manufacture |
| 09/12/2002 | WO2001017327A9 Low cost conformal emi/rfi shield |
| 09/12/2002 | US20020128745 Part mounting device and part mounting method |
| 09/12/2002 | US20020127894 Method and structure for controlled shock and vibration of electrical interconnects |
| 09/12/2002 | US20020127893 Particle distribution interposer and method of manufacture thereof |
| 09/12/2002 | US20020127847 Electrochemical co-deposition of metals for electronic device manufacture |
| 09/12/2002 | US20020127839 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument |
| 09/12/2002 | US20020127837 Methods for forming a die package |
| 09/12/2002 | US20020127494 Providing perforate metal core; applying a dielectric polymer onto all exposed surfaces; applying a dielectric polymer; ablating surface of dielectric polymer in a pattern to expose; forming metallized vias; applying photosensitive layer |
| 09/12/2002 | US20020127418 Embedding resin and wiring substrate using the same |
| 09/12/2002 | US20020127406 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| 09/12/2002 | US20020127379 Circuit board and method for manufacturing the same |
| 09/12/2002 | US20020126951 Optical converter flex assemblies |
| 09/12/2002 | US20020126463 Component retention socket |
| 09/12/2002 | US20020126461 Protection structure of a circuit board and method for manufacturing the same |
| 09/12/2002 | US20020126460 Printed circuit board arrangement |
| 09/12/2002 | US20020126458 Connection structure of flexible board arranged in camera |
| 09/12/2002 | US20020126456 Optical data link |
| 09/12/2002 | US20020125983 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same |
| 09/12/2002 | US20020125980 Photolithographically-patterned out-of-plane coil structures and method of making |
| 09/12/2002 | US20020125618 Methods for manufacturing ceramic green sheet and multilayer ceramic electronic parts |
| 09/12/2002 | US20020125612 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 09/12/2002 | US20020125583 Integrated circuit package with surface mounted pins on an organic substrate |
| 09/12/2002 | US20020125574 Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics |
| 09/12/2002 | US20020125570 Ball grid array semiconductor package structure to avoid high frequency interference |
| 09/12/2002 | US20020125566 High frequency circuit chip and method of producing the same |
| 09/12/2002 | US20020125561 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
| 09/12/2002 | US20020125552 Windowed non-ceramic package having embedded frame |
| 09/12/2002 | US20020125505 Substrate for an electronic power circuit, and an electronic power module using such a substrate |
| 09/12/2002 | US20020125486 Electrode substrate of plasma display panel and method for making the same |
| 09/12/2002 | US20020125402 Hybrid molds for molten solder screening process |
| 09/12/2002 | US20020125329 Electronic module for chip card |
| 09/12/2002 | US20020125227 Quasi-CW diode-pumped, solid-state UV laser system and method employing same |
| 09/12/2002 | US20020125221 Laser beam system for micro via formation |
| 09/12/2002 | US20020125044 Layered circuit boards and methods of production thereof |
| 09/12/2002 | US20020125043 Semiconductor packaging structure, packaging board and inspection method of packaging conditions |
| 09/12/2002 | US20020125042 Method for transforming a substrate with edge contacts into a ball grid array, ball grid array manufactured according to this method, and flexible wiring for the transformation of a substrate with edge contacts into a ball grid array |
| 09/12/2002 | US20020125040 Multi-layer circuit assembly and process for preparing the same |
| 09/12/2002 | US20020125039 Electromagnetic coupler alignment |
| 09/12/2002 | US20020124994 Terminal holding and heat dissipating structure |
| 09/12/2002 | US20020124938 Apparatus and method for producing non- or lightly-embossed panels |
| 09/12/2002 | US20020124933 Thermocompression bonding device and bonding head thereof |
| 09/12/2002 | US20020124768 Process for improving the adhesion of polymeric materials to metal surfaces |
| 09/12/2002 | US20020124699 Punching device and workpiece processing method |
| 09/12/2002 | US20020124398 Multi-layer circuit assembly and process for preparing the same |
| 09/12/2002 | US20020124392 Method for making an article having an embedded electronic device |
| 09/12/2002 | US20020124375 Manufacturing system using solder self-alignment with optical component deformation fine alignment |
| 09/12/2002 | DE10204429A1 Elektronische Komponente und Herstellungsverfahren dafür Electronic component and manufacturing method thereof |
| 09/12/2002 | DE10152095A1 Blank-Chip-Träger und Verfahren zum Herstellen einer Halbleitervorrichtung unter Verwendung des Blank-Chip-Trägers Blank chip carrier and method for producing a semiconductor device using the chip carrier blank |
| 09/12/2002 | DE10111389A1 Soldered connection between tracks on e.g. flexible- and glass substrates, to make position measurement sensor, involves using solder pads of specified shape on each substrate |
| 09/12/2002 | DE10109542A1 Leiterplattenanordnung Printed circuit board assembly |
| 09/12/2002 | DE10109222A1 Montageelement zum Verbinden zweier Gegenstände Mounting element for connecting two objects |
| 09/12/2002 | DE10109030A1 Contactless transponder for contactless chip card has chip in module arranged in opening in base film into which conductors are lowered |
| 09/12/2002 | CA2435755A1 Metal pattern formation |
| 09/11/2002 | EP1239715A2 Holding and heat dissipation structure for heat generation part |
| 09/11/2002 | EP1239714A2 Terminal holding and heat dissipation structure |
| 09/11/2002 | EP1239713A2 Substrate-stacking structure |
| 09/11/2002 | EP1239712A2 Electronic circuit for remote data transmission |
| 09/11/2002 | EP1239515A1 Substrate for electronic power circuit and electronic power module utilizing such a substrate |
| 09/11/2002 | EP1238800A2 Method for producing metal laminate |
| 09/11/2002 | EP1238446A1 An electrical contact device for interconnecting electrical components |
| 09/11/2002 | EP1238445A1 System comprising at least two printed circuit boards |
| 09/11/2002 | EP1238444A1 Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection |
| 09/11/2002 | EP1238431A1 Method and device for interconnecting electronic components in three dimensions |
| 09/11/2002 | EP1238121A1 Surface preparation of a substrate for thin film metallization |
| 09/11/2002 | EP1237677A1 Soldering flux |
| 09/11/2002 | EP1196283A4 Barrier laminate |
| 09/11/2002 | EP1183462A4 Integrated powertrain control system for large engines |
| 09/11/2002 | EP1101232B1 Electric component formed from sheet metal, provided with a welding abutment and that can be welded on the contact surfaces of a circuit substrate |
| 09/11/2002 | EP1057038B1 Method and device for testing printed circuit boards |
| 09/11/2002 | CN2511094Y Apparatus for driving-in pulling-out fixing pin of printed circuit board |
| 09/11/2002 | CN2511093Y Improved thin film circuit board wire jumper structure |
| 09/11/2002 | CN2510992Y Slotted seat structure for grid-array packaged element |
| 09/11/2002 | CN1369119A Multiplayer microwave couplers using vertically-connected stripline |
| 09/11/2002 | CN1369107A Ion reflection comprising flexible printed circuit board |
| 09/11/2002 | CN1368904A Method of forming thin metal layer on insulating substrate |
| 09/11/2002 | CN1368838A Base plate connecting device |
| 09/11/2002 | CN1368757A Semiconductor device and method for manufacture semiconductor equipment |
| 09/11/2002 | CN1090892C Method for mfg. of double-side conductive metal foil type circuit board and products thereof |
| 09/11/2002 | CN1090891C Manufacture method of multi-layer printed circuit board and multi-layer printed circuit board made by it |
| 09/11/2002 | CN1090890C Method for forming electroplated layer on through-hole inwall of PC board with through-hole |
| 09/11/2002 | CN1090889C Paste soldering material printing apparats |
| 09/11/2002 | CN1090767C Photoenhanced diffusion patterning for organic polymer films |