| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/19/2002 | US20020131258 Mounting structure for module substrates |
| 09/19/2002 | US20020131256 Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages |
| 09/19/2002 | US20020131255 I-channel surface-mount connector |
| 09/19/2002 | US20020131253 Circuit board and method of manufacturing the same, and display device |
| 09/19/2002 | US20020131252 Multi-layered high density connections |
| 09/19/2002 | US20020131248 Circuit board and its manufacture method |
| 09/19/2002 | US20020131247 Dielectric resin composition and multilayer circuit board comprising dielectric layers formed therefrom |
| 09/19/2002 | US20020131244 Prototype development system and method |
| 09/19/2002 | US20020131240 Heat dissipation structure of integrated circuit (IC) |
| 09/19/2002 | US20020131238 Heat sink |
| 09/19/2002 | US20020131229 Printed wiring board structure with z-axis interconnections |
| 09/19/2002 | US20020130756 Electrical circuit |
| 09/19/2002 | US20020130739 Embedded waveguide and embedded electromagnetic shielding |
| 09/19/2002 | US20020130737 High frequency printed circuit board via |
| 09/19/2002 | US20020130411 Bga substrate via structure |
| 09/19/2002 | US20020130410 Interconnect structure for surface mounted devices |
| 09/19/2002 | US20020130405 Electronic device |
| 09/19/2002 | US20020130302 Capable of firmly adhering to an electronic component and a circuit board and achieving good electrical continuity by thermal compression bonding at low temperature at which the circuit board is not eteriorated |
| 09/19/2002 | US20020130164 Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system |
| 09/19/2002 | US20020130163 Soldering method, soldering device, and method and device of fabricating electronic circuit module |
| 09/19/2002 | US20020130161 Method of attaching a body made of metal matrix composite (MMC) material or copper to a ceramic member |
| 09/19/2002 | US20020130113 Mixture of an aromatic mercaptothiazole or triazole, a water insoluble multi-substituted phenol, L-ascorbic acid or its salt, and a carboxylic acid/carboxylic acid salt pair; capable of sublimation; protect metals such as copper |
| 09/19/2002 | US20020130103 Polyimide adhesion enhancement to polyimide film |
| 09/19/2002 | US20020130033 Coating a surface of liquid crystalline polymer with palladium by sputtering or ionization plating |
| 09/19/2002 | US20020129974 Method and apparatus for distributing power to integrated circuits |
| 09/19/2002 | US20020129972 Structure having laser ablated Features and method of fabricating |
| 09/19/2002 | US20020129971 Filler material and pretreatment of printed circuit board components to facilitate application of a conformal EMI shield |
| 09/19/2002 | US20020129970 Portable electronic medium and manufacturing method thereof |
| 09/19/2002 | US20020129957 Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield |
| 09/19/2002 | US20020129951 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| 09/19/2002 | US20020129894 Method for joining and an ultra-high density interconnect |
| 09/19/2002 | US20020129879 Device produced by a process of controlling grain growth in metal films |
| 09/19/2002 | US20020129677 Punching apparatus for stamping and method for producing the same |
| 09/19/2002 | US20020129477 Method for making a sonoprobe |
| 09/19/2002 | DE10143907A1 Elektrische Verbindung mittels Induktionslöten Electrical connection by means of induction brazing |
| 09/19/2002 | DE10129778A1 Circuit board has openings in bearer layer with larger diameter than openings in metal layer; at least parts of metal layer protruding into vicinity of opening in bearer layer are structured |
| 09/19/2002 | DE10111371A1 Flexible flat cable (FFC) for mounting conduction paths on flexible carrier material, uses integrated electrical functional component for directly contacting conduction path |
| 09/19/2002 | DE10110948A1 Mechatronische Getriebesteuerung Mechatronic transmission control |
| 09/19/2002 | DE10110268A1 Circuit board manufacturing method selection, using computer program structure for identifying manufacturing method with minimum complexity |
| 09/19/2002 | DE10110203A1 Elektronisches Bauteil mit gestapelten Halbleiterchips An electronic part having stacked semiconductor chips |
| 09/19/2002 | DE10109818A1 Semiconductor device has semiconductor body and associated carrier provided with flip-chip connections and furhter connections for dissipation of waste heat |
| 09/19/2002 | CA2440694A1 Quasi-cw diode-pumped, solid-state uv laser system and method employing same |
| 09/18/2002 | EP1241740A1 Conversion apparatus and method |
| 09/18/2002 | EP1241481A2 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/18/2002 | EP1241279A1 Process for metallising a substrate |
| 09/18/2002 | EP1241209A2 Solvent swell containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous material |
| 09/18/2002 | EP1241208A1 Process for manufacturing prepreg |
| 09/18/2002 | EP1241207A1 Prepreg and process for manufacturing same |
| 09/18/2002 | EP1241148A1 Aluminium nitride substrate and method of preparing this substrate for joining with a copper foil |
| 09/18/2002 | EP1240968A1 Method for forming electrical connection by induction soldering |
| 09/18/2002 | EP1240809A1 Multilayer printed board |
| 09/18/2002 | EP1240668A1 Method and apparatus for encoding information in an ic package |
| 09/18/2002 | EP1240667A2 Integrated circuit package |
| 09/18/2002 | EP1239994A1 Headpiece for machine tools that produce multiple holes |
| 09/18/2002 | EP1171301A4 Flexible laminate for flexible circuit |
| 09/18/2002 | EP1129003B1 Improvements relating to power steering |
| 09/18/2002 | EP1102655B1 Movable selective debridging apparatus and method of debridging soldered joints on printed circuit boards using same |
| 09/18/2002 | EP1070329B1 Support for electronic components |
| 09/18/2002 | EP0888228B1 Control unit |
| 09/18/2002 | EP0862791B1 Method of manufacturing and transferring metallic droplets |
| 09/18/2002 | CN2512197Y Small drill for soldering circuit board |
| 09/18/2002 | CN1370389A Microfiber dielectrics which facilitate laser via drilling |
| 09/18/2002 | CN1370388A High density substrate and methods for mfg. same |
| 09/18/2002 | CN1369954A Electroplating current supply system |
| 09/18/2002 | CN1369936A Contact assembly for insertion connector |
| 09/18/2002 | CN1369883A Electronic assembly and mfg. method thereof |
| 09/18/2002 | CN1369531A Anisotyopic conductive adhesive |
| 09/18/2002 | CN1369526A Heat resistant compsns. |
| 09/18/2002 | CN1369351A Non-lead welding material and soldered fitting |
| 09/18/2002 | CN1369345A Autoamtic test method for cutting edges of drill bit dedicated to PC motherboard |
| 09/18/2002 | CN1091339C Return circuit basilar plate |
| 09/17/2002 | USRE37840 Method of preparing a printed circuit board |
| 09/17/2002 | US6452811 Augmented circuitry integration for a printed circuit board |
| 09/17/2002 | US6452808 Electronics module having power components, and a method of manufacture |
| 09/17/2002 | US6452804 Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate |
| 09/17/2002 | US6452754 Flexible printed circuit board attachment structure and recording and reproducing device using the same |
| 09/17/2002 | US6452407 Probe contactor and production method thereof |
| 09/17/2002 | US6452264 Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus |
| 09/17/2002 | US6452257 Film carrier tape |
| 09/17/2002 | US6452132 Laser hole boring apparatus |
| 09/17/2002 | US6452117 Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
| 09/17/2002 | US6452115 Circuit pattern for multi-layer circuit board for mounting electronic parts |
| 09/17/2002 | US6452113 Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 09/17/2002 | US6452112 Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same |
| 09/17/2002 | US6452111 Adhesives and adhesive films |
| 09/17/2002 | US6452110 Patterning microelectronic features without using photoresists |
| 09/17/2002 | US6451932 Resin composites and method for producing the same |
| 09/17/2002 | US6451878 Containing bisphenol s |
| 09/17/2002 | US6451875 Connecting material for anisotropically electroconductive connection |
| 09/17/2002 | US6451710 Method of manufacturing multi-layer printed wiring board |
| 09/17/2002 | US6451509 Curing photodielectric material |
| 09/17/2002 | US6451502 manufacture of electronic parts |
| 09/17/2002 | US6451448 Surface treated metallic materials and manufacturing method thereof |
| 09/17/2002 | US6451441 Circuit sheet used for multilayer semiconductor wiring board; adhesive is copolymer of an acrylic acid ester with a carboxyl group-containing monomer (acrylic acid), andwith a reactive polyfunctional compound (diisocyanate) |
| 09/17/2002 | US6451418 Heat conductive resin substrate and semiconductor package |
| 09/17/2002 | US6451383 Applying an acidic starting solution of an emulsion of chemically distinct monomers to a metal substrate which can initiate polymerization |
| 09/17/2002 | US6451127 Conductive paste and semiconductor component having conductive bumps made from the conductive paste |
| 09/17/2002 | US6450839 Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device |
| 09/17/2002 | US6450821 Electrical connectors adapted to reduce or prevent adherence of conductive material to contact portions as the connector |
| 09/17/2002 | US6450704 Transparent substrate and hinged optical assembly |