| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/26/2002 | US20020134582 Integrated circuit package and method |
| 09/26/2002 | US20020134580 Configuration having an electronic device electrically connected to a printed circuit board |
| 09/26/2002 | US20020134579 Method and device for avoiding electrostatic discharge of an electronic device by using electroconductive sheet |
| 09/26/2002 | US20020134578 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device |
| 09/26/2002 | US20020134577 Printed circuit board having footprints, circuit module having a printed circuit board, and method of manufacturing a printed circuit board |
| 09/26/2002 | US20020134488 Method for producing multilayer ceramic substrate |
| 09/26/2002 | US20020134422 Solar tile and associated method for fabricating the same |
| 09/26/2002 | US20020134259 Uphill screen printing in the manufacturing of microelectronic components |
| 09/26/2002 | US20020134200 A control method for copper density in a solder dipping bath |
| 09/26/2002 | US20020133943 Method for manufacturing circuit device |
| 09/26/2002 | US20020133941 Electrical connector |
| 09/26/2002 | US20020133937 System for mounting electronic device |
| 09/26/2002 | US20020133933 Method of attaching a slider with head transducer to a suspension |
| 09/26/2002 | DE10127357C1 Manufacturing system for production of circuit structure on conductive plate uses two lasers with lenses illuminating two separate areas on plate |
| 09/26/2002 | DE10113585A1 Production of flexible thin layer circuits used in the automobile industry comprises preparing a flexible thin layer support, inserting an opening, applying a primary layer on the support, and forming a circuit pattern on the primary layer |
| 09/26/2002 | DE10113361A1 Laminated ceramic green body, useful for preparing, e.g. integrated circuits, comprises layers glued together with an adhesive film deposited on a release liner |
| 09/26/2002 | DE10111256A1 Circuit board, especially for direct engine mounting in motor vehicles, has through holes arranged on board to be optimized for reduction of mechanical vibration loads acting on board |
| 09/26/2002 | CA2426648A1 Plating method of metal film on the surface of polymer |
| 09/25/2002 | EP1244341A2 Electronic device |
| 09/25/2002 | EP1244172A2 Wiring board and wiring board module using the same |
| 09/25/2002 | EP1244055A2 Portable electronic medium and manufacturing method thereof |
| 09/25/2002 | EP1243672A1 Plating device and plating method |
| 09/25/2002 | EP1243569A2 Electrical circuit having a metal-bonded-ceramic material or MBC component as an insulating substrate |
| 09/25/2002 | EP1243167A1 Self-aligned coaxial via capacitors |
| 09/25/2002 | EP1243166A1 Flanged terminal pins for dc/dc converters |
| 09/25/2002 | EP1243026A1 Organic packages with solders for reliable flip chip connections |
| 09/25/2002 | EP1243003A1 Polycarbosilane adhesion promoters for low dielectric constant polymeric materials |
| 09/25/2002 | EP1242233A2 A method and apparatus using printer means for manufacturing an item |
| 09/25/2002 | EP0839341B1 Heterogeneous photo-initiators, photopolymerisable compositions and their use |
| 09/25/2002 | EP0805785B1 Low dielectric loss glasses |
| 09/25/2002 | CN1371503A Carrier element for electronic media apparatus |
| 09/25/2002 | CN1371485A Connector arrangement |
| 09/25/2002 | CN1371240A Manufacture of multilayer high-density base board |
| 09/25/2002 | CN1371239A Through hole processing and structure for HF circuit board |
| 09/25/2002 | CN1371169A Laminated composite device and its manufacture |
| 09/25/2002 | CN1371126A Semiconductor module and its manufacture |
| 09/25/2002 | CN1370802A Resin composition and its use and production process thereof |
| 09/25/2002 | CN1370630A Viscous material coater and coating method |
| 09/25/2002 | CN1091567C Return-flow soldering method and return-flow soldering apparatus using the method |
| 09/25/2002 | CN1091566C Red infrared radiation electrothermal film and its prodn. method |
| 09/25/2002 | CN1091402C IPC (chip) temination machine |
| 09/24/2002 | US6456757 Optical wavelength division multiplexer/demultiplexer having adhesive overflow channels with dams to achieve tight adhesive bond |
| 09/24/2002 | US6456505 Electronic device and attachment structure thereof |
| 09/24/2002 | US6455936 Integrated circuit assembly having interposer with a compliant layer |
| 09/24/2002 | US6455784 Thermosetting polyphenylene ether resins, unsaturated carboxylic acids or anhydrides, triallyl isocyanurate and/or cyanurate, conjugated copolyene block polymers, fillers and fireproofing multilayers for printed circuits |
| 09/24/2002 | US6455783 Multilayer printed wiring board and method for manufacturing the same |
| 09/24/2002 | US6455355 Method of mounting an exposed-pad type of semiconductor device over a printed circuit board |
| 09/24/2002 | US6455351 Vertical surface mount assembly and methods |
| 09/24/2002 | US6455331 Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
| 09/24/2002 | US6455231 Dry film photoimageable compositions |
| 09/24/2002 | US6455175 Solution of triamminetris(nitrito-n,n,n)rhodium(iii), ammonium hydroxide and hydrazine hydrate; uniform coating; chemical reduction |
| 09/24/2002 | US6455139 Printed circuit substrate treated with swelling agent, alkaline permanganate, chromate, and/or chlorite; coating with metal |
| 09/24/2002 | US6454954 Desmear etchant and use thereof |
| 09/24/2002 | US6454878 Cladding prior to being stacked; multilayer circuitboard |
| 09/24/2002 | US6454868 Permanganate desmear process for printed wiring boards |
| 09/24/2002 | US6454596 Electrical conductor strain relief for a printed circuit board |
| 09/24/2002 | US6454582 Wiring unit |
| 09/24/2002 | US6454573 Board-cable connection structure |
| 09/24/2002 | US6454258 Device for treating plate-shaped work pieces, especially printed-circuit boards |
| 09/24/2002 | US6454159 Method for forming electrical connecting structure |
| 09/24/2002 | US6454157 High density connector having a ball type of contact surface |
| 09/24/2002 | US6454154 Filling device |
| 09/24/2002 | US6453963 Vacuum film laminating apparatus |
| 09/24/2002 | US6453811 Printing method and printing apparatus |
| 09/24/2002 | US6453810 Method and apparatus for dispensing material in a printer |
| 09/24/2002 | US6453549 Method of filling plated through holes |
| 09/24/2002 | US6453537 Cooling method for electronic components |
| 09/24/2002 | US6453527 Free form capacitor |
| 09/19/2002 | WO2002074029A1 Multilayer printed wiring board |
| 09/19/2002 | WO2002074028A1 Method and protective device for mounting a temperature-sensitive electronic component |
| 09/19/2002 | WO2002074027A1 Improved laser metallisation circuit formation and circuits formed thereby |
| 09/19/2002 | WO2002074026A1 Vacuum deposited circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| 09/19/2002 | WO2002074024A2 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 09/19/2002 | WO2002073685A2 Multi-layer circuit assembly and process for preparing the same |
| 09/19/2002 | WO2002073633A1 Flexible strip cable |
| 09/19/2002 | WO2002073322A1 Quasi-cw diode-pumped, solid-state uv laser system and method employing same |
| 09/19/2002 | WO2002073278A2 Manufacturing method using solder self-alignment with optical component deformation fine alignment |
| 09/19/2002 | WO2002073127A1 Land appearance inspecting device, and land appearance inspecting method |
| 09/19/2002 | WO2002072915A1 Conditioning agent and use thereof |
| 09/19/2002 | WO2002072700A1 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| 09/19/2002 | WO2002072309A1 High capacity tool crib for a machine tool for the processing of printed circuit boards |
| 09/19/2002 | WO2002028585A3 Method for ablating points of contact (debumping) |
| 09/19/2002 | WO2002020875A3 Method for producing an adhesive metal coating |
| 09/19/2002 | WO2002011201A3 Method and device for producing connection substrates for electronic components |
| 09/19/2002 | WO2002009884A3 Methods for the lithographic deposition of materials containing nanoparticles |
| 09/19/2002 | WO2002004706A9 Acidic treatment liquid and method of treating copper surfaces |
| 09/19/2002 | WO2000004753A3 Alignment of vias in circuit boards or similar structures |
| 09/19/2002 | US20020132873 Lead protective coating composition, process and structure thereof |
| 09/19/2002 | US20020132533 Discrete device socket and method of fabrication therefor |
| 09/19/2002 | US20020132502 Molded and plated electrical interface component |
| 09/19/2002 | US20020132450 Semiconductor device and method for producing the same, and anisotropic conductive circuit board |
| 09/19/2002 | US20020132108 Resin moldings |
| 09/19/2002 | US20020132096 Wiring board |
| 09/19/2002 | US20020132095 Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board |
| 09/19/2002 | US20020132094 Wiring board and method for fabricating the same |
| 09/19/2002 | US20020132061 Preparing organic polymer constituent and an inorganic-organic constituent and/or inorganic constituent and applying layer on substrate; removal of inorganic-organic constituent and/or inorganic constituent from layer to form a porous layer |
| 09/19/2002 | US20020132056 Contacting metal surface with adhesion promotion formulation comprising sulfuric acid and phosphoric acid to form a micro-roughened conversion coated metal surface, contacting with aqueous organosilicon formulation |
| 09/19/2002 | US20020131725 Single-piece cage for pluggable fiber optic transceiver |
| 09/19/2002 | US20020131632 Method and apparatus of registering a printed circuit board |
| 09/19/2002 | US20020131615 Microphone unit mounting structure |