| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/02/2002 | DE10108168C1 Verfahren zur Herstellung einer Multiwire-Leiterplatte A process for preparing a multi-wire circuit board |
| 10/02/2002 | CN2514622Y Etching machine for circuit board |
| 10/02/2002 | CN1372783A Method for manufacturing printed wiring board |
| 10/02/2002 | CN1372428A High-frequency circuit board and high-frequency antenna switch module using same |
| 10/02/2002 | CN1372311A Semiconductor chip and package method thereof |
| 10/02/2002 | CN1372269A Conductive pasty material, method for controlling its viscosity and electronic component using same |
| 10/02/2002 | CN1092017C Method and device for soldering partson carrier sheet |
| 10/02/2002 | CN1091957C Antennas and their making methods and electronic devices with same antennas |
| 10/02/2002 | CN1091936C Protective plug |
| 10/02/2002 | CN1091776C 粘合用树脂组合物和粘合片 An adhesive resin composition and an adhesive sheet |
| 10/02/2002 | CN1091664C Apparatus and method for making uniformly sized and shaped spheres |
| 10/01/2002 | US6460170 Connection block for interfacing a plurality of printed circuit boards |
| 10/01/2002 | US6459592 Circuit assembly including VLSI package |
| 10/01/2002 | US6459588 Noncontact IC card and fabrication method thereof |
| 10/01/2002 | US6459586 Single board power supply with thermal conductors |
| 10/01/2002 | US6459585 Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method |
| 10/01/2002 | US6459582 Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
| 10/01/2002 | US6459474 Contact exposure device provided with a mask and workpiece interval setting means |
| 10/01/2002 | US6459418 Displays combining active and non-active inks |
| 10/01/2002 | US6459347 Method for vertical connection of conductors in a device in the microwave range |
| 10/01/2002 | US6459339 High-frequency circuit |
| 10/01/2002 | US6459272 Apparatus and method for inspecting wiring on board |
| 10/01/2002 | US6459164 Apparatus for sealing a ball grid array package and circuit card interconnection |
| 10/01/2002 | US6459105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 10/01/2002 | US6459048 Surface-mount electronic component |
| 10/01/2002 | US6459047 Layer of metal with at least one through hole having an adhesion promoting layer; layer of a partially cured low-loss polymer or polymer precursor on the adhesion promoting layer and conductive circuit lines on partly cured dielectric |
| 10/01/2002 | US6459046 Printed circuit board and method for producing the same |
| 10/01/2002 | US6459045 PCB structure for regulating constant power source and strengthening ground connections |
| 10/01/2002 | US6459044 Flexible multilayer wiring board |
| 10/01/2002 | US6459043 Flexible circuit with electrostatic damage limiting feature and method of manufacture |
| 10/01/2002 | US6459042 Electrical connector with an electrical component holder |
| 10/01/2002 | US6459041 Etched tri-layer metal bonding layer |
| 10/01/2002 | US6459039 Method and apparatus to manufacture an electronic package with direct wiring pattern |
| 10/01/2002 | US6458696 Plated through hole interconnections |
| 10/01/2002 | US6458670 Area of multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented |
| 10/01/2002 | US6458629 High-frequency module, method of manufacturing thereof and method of molding resin |
| 10/01/2002 | US6458624 Resistance-reducing conductive adhesives for attachment of electronic components |
| 10/01/2002 | US6458623 Conductive adhesive interconnection with insulating polymer carrier |
| 10/01/2002 | US6458608 Alignment check method on printed circuit board |
| 10/01/2002 | US6458514 Forming annular cavities by laser penetrating only dielectric sheet; coating with photoresist; etching conductive layer; stripping cavities to form through holes |
| 10/01/2002 | US6458509 Curable (meth)acrylic compound, crosslinked carboxyl elastic polymer, and adhesion intensifier comprising carboxylbenzotriazole and/or phosphoric acrylate; solders, printed circuits; heat resistance |
| 10/01/2002 | US6458431 Embedding particles; photochemistry |
| 10/01/2002 | US6458234 Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate |
| 10/01/2002 | US6457985 Locking assembly for securing semiconductor device to carrier substrate |
| 10/01/2002 | US6457655 Method and apparatus for measuring and adjusting a liquid spray pattern |
| 10/01/2002 | US6457634 Soldering method and soldering apparatus |
| 10/01/2002 | US6457633 Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls |
| 10/01/2002 | US6457632 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy |
| 10/01/2002 | US6457631 Rework and underfill nozzle for electronic components |
| 10/01/2002 | US6457234 Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond |
| 10/01/2002 | US6457233 Solder bonding method, and process of making electronic device |
| 10/01/2002 | CA2065897C Process and an apparatus for producing a thin photoimageable coating on a metallic-layered substrate |
| 09/28/2002 | CA2379107A1 Holder for holding a printed circuit for exposure to light |
| 09/28/2002 | CA2379101A1 Apparatus for exposing a face of a printed circuit panel |
| 09/26/2002 | WO2002076166A1 Heat sink |
| 09/26/2002 | WO2002076163A1 Radiating fin and radiating method using the radiating fin |
| 09/26/2002 | WO2002076162A1 A power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages |
| 09/26/2002 | WO2002076161A1 Method of manufacturing electronic part and electronic part obtained by the method |
| 09/26/2002 | WO2002076160A1 Transfer printing |
| 09/26/2002 | WO2002076159A1 Laminate comprised of flat conductor elements |
| 09/26/2002 | WO2002075020A1 Plating method of metal film on the surface of polymer |
| 09/26/2002 | WO2002074841A1 Substrates having conductive surfaces |
| 09/26/2002 | WO2002074715A1 Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| 09/26/2002 | WO2002074531A1 High polymer plate and conductive plate connecting body, and part using the connecting plate |
| 09/26/2002 | WO2002074481A1 Laser ablation technique |
| 09/26/2002 | WO2002074480A1 Laser ablation technique |
| 09/26/2002 | WO2002049109B1 Stacked die package |
| 09/26/2002 | US20020137818 Styrene-maleic anhydride binder copolymer of which the maleic anhydride group is partly esterified with a lower alcohol, the ink composition forming a solder resist film excellent in flexibility, soldering heat resistance, adherence |
| 09/26/2002 | US20020137404 I-channel surface-mount connector |
| 09/26/2002 | US20020137391 Electronic device |
| 09/26/2002 | US20020137367 Compression connector actuation system |
| 09/26/2002 | US20020137366 Universal low profile connector for grid arrays with organic contact retainer |
| 09/26/2002 | US20020137347 Circuit board and a method for making the same |
| 09/26/2002 | US20020137325 Method for forming bumps |
| 09/26/2002 | US20020137324 Ball transferring method and apparatus |
| 09/26/2002 | US20020137257 Substrate of semiconductor package |
| 09/26/2002 | US20020137256 Method and structure for an organic package with improved BGA life |
| 09/26/2002 | US20020136961 Using a heat sensitive coating of a polymer where aqueous developer solubility of the composition is not increased by incident UV radiation but is increased by delivery of heat |
| 09/26/2002 | US20020136873 Method of making a circuit board |
| 09/26/2002 | US20020136546 FPC mounting structure |
| 09/26/2002 | US20020136396 Insulation strip for a pots splitter card |
| 09/26/2002 | US20020135986 Electronic device and a method of manufacturing the same |
| 09/26/2002 | US20020135985 Over-current protecting apparatus |
| 09/26/2002 | US20020135982 Electronic module having a three dimensional array of integrated circuit packages |
| 09/26/2002 | US20020135727 Display module, flexible wire board and flexible wire board connecting method |
| 09/26/2002 | US20020135519 Electrically conductive patterns, antennas and methods of manufacture |
| 09/26/2002 | US20020135459 Method for the manufacture of printed circuit boards with plated resistors |
| 09/26/2002 | US20020135444 Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same |
| 09/26/2002 | US20020135390 Method and apparatus for inspection |
| 09/26/2002 | US20020135387 Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
| 09/26/2002 | US20020135104 Heated filling method |
| 09/26/2002 | US20020135077 Semiconductor copper bond pad surface protection |
| 09/26/2002 | US20020135064 Transfer apparatus for arraying small conductive bumps on substrate and/ or chip |
| 09/26/2002 | US20020135058 Component built-in module and method of manufacturing the same |
| 09/26/2002 | US20020135051 Semiconductor device and lead frame therefor |
| 09/26/2002 | US20020134963 For removal of residues from integrated circuits; comprises a choline compound, water and an organic solvent |
| 09/26/2002 | US20020134685 Coaxial capacitors are adapted to utilize the plating of a plated via as a first electrode, a dielectric layer formed to cover first electrode while leaving a portion of via unfilled, wherein second electrode is formed by a dielectric layer |
| 09/26/2002 | US20020134684 Seed layer processes |
| 09/26/2002 | US20020134584 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 09/26/2002 | US20020134583 Method and apparatus for coupling a circuit board to a transmission line that includes a heat sensitive dielectric |