H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2002
10/03/2002	WO2002077714A1 Self-flame-retardant resist material and insulating material
10/03/2002	WO2002077713A1 Method for forming metal pattern
10/03/2002	WO2002077321A1 Method for forming metal pattern
10/03/2002	WO2002076666A2 A laser machining system and method
10/03/2002	WO2002051224A3 Multilayered hybrid electronic module
10/03/2002	WO2002003462A3 Self retained pressure connection
10/03/2002	WO2001092596A3 Method for producing three-dimensional, selectively metallized parts and a three-dimensional, selectively metallized part
10/03/2002	WO2001081088A9 Apparatus for aligning a flexible circuit on an ink jet printer carriage
10/03/2002	WO2000047024A3 Multi-layer circuit board assembly for the packaging of semiconductor devices
10/03/2002	US20020144228 Method and apparatus for designing printed-circuit board
10/03/2002	US20020144032 Computer enclosure
10/03/2002	US20020143416 Method and apparatus for programming a paste dispensing machine
10/03/2002	US20020143091 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
10/03/2002	US20020142653 Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector
10/03/2002	US20020142648 Surface battery clip
10/03/2002	US20020142632 Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment
10/03/2002	US20020142627 Connection structure between terminal and flexible printed circuit body and auxiliary machine module
10/03/2002	US20020142517 Flip chip interconnection using no-clean flux
10/03/2002	US20020142516 Methods of bonding microelectronic elements
10/03/2002	US20020142509 Having first interlayer film serving not only as layer to form contact or via hole but also etch stop layer in etching second interlayer film to form interconnect trench opened to contact hole
10/03/2002	US20020142234 Photomask
10/03/2002	US20020142094 Overcoating particle with organosilicon polymer and metal; heat resistance, conductivity stability
10/03/2002	US20020142092 Method for the metalization of an insulator and/or a dielectric
10/03/2002	US20020141842 Twist drill
10/03/2002	US20020141835 Method for determining uncertainties for printed circuit board drilling machines
10/03/2002	US20020141473 Controlling laser polarization
10/03/2002	US20020141024 Direct pattern writer
10/03/2002	US20020140654 Signal transmission film and a liquid crystal display panel having the same
10/03/2002	US20020140532 Wiring board and wiring board module using the same
10/03/2002	US20020140450 Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes
10/03/2002	US20020140443 Method and apparatus for inspecting conductive pattern
10/03/2002	US20020140401 Battery pack containing a circuit breaker
10/03/2002	US20020140135 Multilayered ceramic substrate production method
10/03/2002	US20020140134 AIN substrate and method for preparing such substrate for bonding to a copper foil
10/03/2002	US20020140105 High strength vias
10/03/2002	US20020140094 Fluxless flip chip interconnection
10/03/2002	US20020140090 High frequency semiconductor device housing package
10/03/2002	US20020140086 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
10/03/2002	US20020140084 Semiconductor device
10/03/2002	US20020140081 Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices
10/03/2002	US20020140080 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
10/03/2002	US20020140076 Multi-layer wiring circuit board and method for producing the same
10/03/2002	US20020139832 Chip rework solder tool
10/03/2002	US20020139792 Method of and apparatus for thermal analysis, method of and apparatus for calculating thermal conditions, computer product
10/03/2002	US20020139686 Conditioning with a cationic conditioning agent and an anionic dispersing agent and a binder, coating with a conductive carbon, electroplating and soldering
10/03/2002	US20020139684 Pump for supplying plating fluid from the reservoir tank to the closed plating cup cyclically changes the pressure or flow rate of the plating fluid to prevent air bubbles in the blind holes of the plating member
10/03/2002	US20020139679 Selective electroplating by etching in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and a sulfide solution; decorative or protective function; electronic packaging
10/03/2002	US20020139668 Embedded metallic deposits
10/03/2002	US20020139663 Chemical treatment system
10/03/2002	US20020139608 Speaker holder
10/03/2002	US20020139580 Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
10/03/2002	US20020139579 Electrical interconnect having a multi-layer circuit board structure and including a conductive spacer for impedance matching
10/03/2002	US20020139578 Hyperbga buildup laminate
10/03/2002	US20020139576 Conductive contamination reliability solution for assembling substrates
10/03/2002	US20020139574 Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
10/03/2002	US20020139573 Design for constructing an input circuit to receive and process an electrical signal
10/03/2002	US20020139571 Semiconductor device and process for fabricating the same
10/03/2002	US20020139570 Compliant multi-layered circuit board for pbga applications
10/03/2002	US20020139569 Flexible circuit with electrostatic damage limiting feature and method of manufacture
10/03/2002	US20020139568 Buried intersignal capacitance
10/03/2002	US20020139566 Printed wiring board with controlled line impedance
10/03/2002	US20020139556 Method and apparatus for providing hermetic electrical feedthrough
10/03/2002	US20020139472 Method of forming an electrical circuit on a substrate
10/03/2002	US20020139467 On board mounting electronic apparatus and on board mounting electric power supply
10/03/2002	US20020139459 Hot rolling an ingot repeating cold rolling and annealing alternately, and recrystallized grains have a diameter of </= 20 mu m, the reduction ration being beyong 90%
10/03/2002	US20020139257 Method and stencil for extruding material on a substrate
10/03/2002	US20020138979 Altering method of circuit pattern of printed-circuit board, cutting method of circuit pattern of printed-circuit board and printed-circuit board having altered circuit pattern
10/03/2002	US20020138978 Process for manufacturing molded circuit board
10/03/2002	US20020138973 Circuit board and method for producing the same
10/03/2002	CA2441965A1 Electrically conductive patterns, antennas and methods of manufacture
10/02/2002	EP1246514A2 Circuit board and method for producing the same
10/02/2002	EP1246325A2 Laser working dielectric substrate and method for working same and semiconductor package and method for manufacturing same
10/02/2002	EP1246309A2 An electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
10/02/2002	EP1246305A2 An electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
10/02/2002	EP1246300A2 A binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting it
10/02/2002	EP1246206A2 Moisture resistant electrically conductive cements and method for the production and using same
10/02/2002	EP1246184A2 Carriage structure for a disk drive
10/02/2002	EP1246092A1 Method and apparatus for designing printed-circuit board
10/02/2002	EP1246015A1 Substrate holder for the exposure of a printed circuit board
10/02/2002	EP1245998A2 Device for the exposure of a printed circuit board
10/02/2002	EP1245933A2 Electromechanical device for mounting electronic equipment on support, particularly for mounting indicating instrument recessed in dashboard
10/02/2002	EP1245697A2 Process for electroles silver plating
10/02/2002	EP1245586A2 Polymer synthesis and films therefrom
10/02/2002	EP1245361A1 Method for injection molding parts with electrically conductive elements and electrical component with such a part
10/02/2002	EP1245328A1 Lead-free solder paste
10/02/2002	EP1245138A1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product
10/02/2002	EP1245137A1 Method and device for laser drilling organic materials
10/02/2002	EP1244532A1 Drilling covering made from or essentially made from a metal foil
10/02/2002	EP1244523A1 Device for collectively filling blind cavities
10/02/2002	EP1116180B1 Method for contacting a circuit chip
10/02/2002	EP1093503B1 Fine pitch anisotropic conductive adhesive
10/02/2002	EP1047744B1 Curable epoxy-based compositions
10/02/2002	EP1018291B1 Flexible circuits and carriers and process for manufacture
10/02/2002	DE10212629A1 Verfahren zum Herstellen eines Mehrlagen-Keramiksubstrats A method for manufacturing a ceramic multi-layer substrate
10/02/2002	DE10211926A1 Heat dissipation structure for integrated circuit in electronic appliance, has space between integrated circuit and circuit board which is filled with solder through holes in circuit board
10/02/2002	DE10116008A1 Elektromechanische Vorrichtung zur Montage einer elektronischen Baugruppe auf einem Baugruppenträger, insbesondere zur Montage eines in einer Armaturentafel eingesenkten Anzeigeinstruments Electromechanical device for mounting an electronic module to a mounting rack, in particular for mounting a recessed into an instrument panel display instrument
10/02/2002	DE10113474A1 Elektrische Schaltung Electrical circuit
10/02/2002	DE10112561A1 Verfahren zur Erzeugung von porösen Schichten A process for the production of porous layers
10/02/2002	DE10112023A1 Verfahren zum Bilden eines Metallmusters auf einen dielektrischen Substrat A method of forming a metal pattern on a dielectric substrate
10/02/2002	DE10110999A1 Structure for accommodating electronic component and printed circuit board, links electronic component with external contacts to printed circuit board with contact connection surfaces in a strip conductor structure.

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