H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2002
10/10/2002	US20020146921 Pin connector
10/10/2002	US20020146920 Method of soldering contact pins and the contact pins
10/10/2002	US20020146863 Method of mounting an exposed-pad type of semiconductor device over a printed circuit board
10/10/2002	US20020146861 Wafer level insulation underfill for die attach
10/10/2002	US20020146646 Providing wafer that has contact pads exposed by a passivation layer formed on surface of wafer; forming a first mask film having a openings; filling solder material in openings; reflowing solder material into solder posts
10/10/2002	US20020146640 Method of fabricating a printed board
10/10/2002	US20020146294 Expandable tooling plate for printed circuit board panel drilling machines
10/10/2002	US20020145857 Surface mount standoff for printed circuit board assembly
10/10/2002	US20020145856 Small form-factor pluggable transceiver cage
10/10/2002	US20020145845 Formation of thin film capacitors
10/10/2002	US20020145839 Power distribution system with a dedicated power structure and a high performance voltage regulator
10/10/2002	US20020145792 Electrophoretic displays using nanoparticles
10/10/2002	US20020145697 Substrate terminal structure, liquid-crystal device and electronic apparatus
10/10/2002	US20020145434 Interconnect package cluster probe short removal apparatus and method
10/10/2002	US20020145207 Method and structure for integrated circuit package
10/10/2002	US20020145203 Method and structure for economical high density chip carrier
10/10/2002	US20020145198 Semiconductor device and its manufacturing method
10/10/2002	US20020145197 Wiring substrate
10/10/2002	US20020145178 Matrix form semiconductor package substrate having an electrode of serpentine shape and method for forming
10/10/2002	US20020145171 Circuit structure, manufacturing method thereof and wiring structure
10/10/2002	US20020145032 Method and apparatus for shaping spring elements
10/10/2002	US20020145030 Continuous mode solder jet apparatus
10/10/2002	US20020144988 Method and apparatus of using robotics or a three-dimensional laser beam to expose a path on a curved or otherwise irregularly shaped surface
10/10/2002	US20020144908 Back-end metallisation process
10/10/2002	US20020144841 High current SMD jumper
10/10/2002	US20020144771 Contacting an adherend and a substrate with a photocurable adhesive of an adhesive and microspheres, photocuring to bond the adherend and substrate together
10/10/2002	US20020144765 Method of manufacturing laminated ceramic electrionic component and method of manufacturing laminated inductor
10/10/2002	US20020144397 Subtractive process for fabricating cylindrical printed circuit boards
10/10/2002	DE10136516A1 Verdrahtungs-Einheit Wiring unit
10/10/2002	DE10130393C1 Exposing connection surfaces of conducting track involves terminating insulation removal process when circuit detects electrical connection of two or more tools via conducting track
10/10/2002	DE10116653A1 Leitfähigkeitspaste, damit erzeugte Artikel mit einer leitfähigen Beschichtung auf Glas, Keramik und emailliertem Stahl und Verfahren zu deren Herstellung Conductive paste, thus produced article with a conductive coating on glass, ceramics and enamelled steel and process for their preparation
10/10/2002	DE10116570A1 Leiterplatte mit spannungsführenden elektromechanischen Komponenten und Verfahren zum Anfertigen einer solchen Leiterplatte PCB with live electro-mechanical components and method of making such a circuit board
10/10/2002	DE10115482A1 Solder composition used for soft soldering electronic components comprises starting solder composition based on metal having specified melting temperature
10/10/2002	DE10113912A1 Elektronische Vorrichtung Electronic device
10/10/2002	CA2434189A1 Offset pathway arrangements for energy conditioning
10/10/2002	CA2416019A1 Improved adhesion of polymeric materials to metal surfaces
10/09/2002	EP1248503A1 Multilayer printed wiring board and method of manufacturing the same
10/09/2002	EP1248502A1 Process for determining of uncertainties for printed circuit board perforating apparatus
10/09/2002	EP1247343A1 A slanted connector
10/09/2002	EP1247297A2 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulsewidths
10/09/2002	EP1246773A2 Fabrication of metallic microstructures via exposure of photosensitive composition
10/09/2002	EP1246730A1 Thermal transfer of microstructured layers
10/09/2002	EP1147067A4 Aqueous cleaning
10/09/2002	EP0914027B1 Film-like adhesive for connecting circuit and circuit board
10/09/2002	EP0772636B1 Radiation- and/or moisture-curable silicone compositions
10/09/2002	CN2515921Y Circuit board/printed circuit board with conducting heating return circuit
10/09/2002	CN1373938A Energy conditioning circuit assembly
10/09/2002	CN1373922A Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
10/09/2002	CN1373895A Capacitor component
10/09/2002	CN1373817A Method for producing conductor pattern on dielectric substrate
10/09/2002	CN1373519A Semiconductor device and mfg. method thereof
10/09/2002	CN1373480A Conductive and resistance material with electrical stability for electronic apparatus
10/09/2002	CN1373387A Liquid crystal display
10/09/2002	CN1373386A Flexible base, board, electrooptical device and electronic device
10/09/2002	CN1092389C 片状电阻器 Chip resistor
10/09/2002	CN1092244C Method for directly depositing metal contg. patterned films
10/08/2002	US6463184 Method and apparatus for overlay measurement
10/08/2002	US6462976 Conversion of electrical energy from one form to another, and its management through multichip module structures
10/08/2002	US6462955 Component alignment casing system
10/08/2002	US6462954 Modular machine board structure capable of automatically correcting the contact travel for an electronic device
10/08/2002	US6462950 Stacked power amplifier module
10/08/2002	US6462629 Ablative RF ceramic block filters
10/08/2002	US6462571 Engagement probes
10/08/2002	US6462570 Breakout board using blind vias to eliminate stubs
10/08/2002	US6462568 Conductive polymer contact system and test method for semiconductor components
10/08/2002	US6462556 Circuit board testing apparatus and method
10/08/2002	US6462436 Economical packaging for EMI shields on PCB
10/08/2002	US6462424 Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
10/08/2002	US6462414 Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad
10/08/2002	US6462306 System and method for material processing using multiple laser beams
10/08/2002	US6462285 Wave solder application for ball grid array modules with plugged vias
10/08/2002	US6462284 Semiconductor device and method of manufacture thereof
10/08/2002	US6462283 Semiconductor package with central circuit pattern
10/08/2002	US6462282 Circuit board for mounting bare chip
10/08/2002	US6462281 High-insulated stud and printed circuit board therewith
10/08/2002	US6462107 Photoimageable compositions and films for printed wiring board manufacture
10/08/2002	US6461953 Solder bump forming method, electronic component mounting method, and electronic component mounting structure
10/08/2002	US6461896 Process for mounting electronic device and semiconductor device
10/08/2002	US6461895 Process for making active interposer for high performance packaging applications
10/08/2002	US6461890 Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the same
10/08/2002	US6461881 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
10/08/2002	US6461795 Manufacture of lithographic printing forms
10/08/2002	US6461745 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding
10/08/2002	US6461717 Composition for protecting apertures in substrate during etching, comprising crosslinkable polymers containing hydroxyl groups and having specified molecular weight, thermal acid generator catalysts, crosslinking agents and solvents
10/08/2002	US6461680 Simplified fabrication method of toroidal charged particle deflector vanes
10/08/2002	US6461678 Process for metallization of a substrate by curing a catalyst applied thereto
10/08/2002	US6461527 Method for fabricating a flexible printed circuit board with access on both sides
10/08/2002	US6461493 Decoupling capacitor method and structure using metal based carrier
10/08/2002	US6461188 Solderable electrical connection element with a solder deposit
10/08/2002	US6461169 Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts
10/08/2002	US6461136 Apparatus for filling high aspect ratio via holes in electronic substrates
10/08/2002	US6460773 Combination card having an IC chip module
10/08/2002	US6460755 Bump forming method and apparatus therefor
10/08/2002	US6460247 Wiring board constructions and methods of making same
10/08/2002	US6460216 Card brushing system
10/03/2002	WO2002078412A1 Method for producing printed wiring board and resist material
10/03/2002	WO2002078411A1 Circuit support element for electronic devices, in particular for communication terminals
10/03/2002	WO2002078410A1 Multi-piece substrate and method of manufacturing the substrate
10/03/2002	WO2002078359A2 Insulation strip for a pots splitter card
10/03/2002	WO2002078122A1 Electrically conductive patterns, antennas and methods of manufacture

1 ... 725 726 727 728 729 730 731 732 733 734 735 736 737 738 739 740 741 742 743 744 745 ... 1185