H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2002
10/17/2002	US20020148112 Encapsulation method for ball grid array semiconductor package
10/17/2002	US20020148111 Self-adjusting printed circuit board support and method of use
10/17/2002	US20020148094 Particle lock joint
10/17/2002	DE10215963A1 Selective soldering device for soldering components onto circuit boards, has outlet opening at known distance from top of pipe in each pipe extending vertically above solder container
10/17/2002	DE10212662A1 Verfahren zum Herstellen einer elektrischen Schaltung auf einem Substrat A method of manufacturing an electric circuit on a substrate
10/17/2002	DE10205408A1 Semiconductor module comprises a housing closed on one side by a metallic heat conducting base which is connected to a metallic coated, electrically insulating heat conducting ceramic layer via a solder layer
10/17/2002	DE10137668A1 Component used in production of integrated circuits comprises substrate, semiconductor components connected to substrate via contacts arranged between substrate and semiconductor components, and supporting bodies
10/17/2002	DE10124770C1 Process for contacting an electrical component, especially a semiconductor component, to a substrate comprises applying a connecting unit between the electrical component
10/17/2002	DE10118487A1 Plastic component with electrical functions, e.g. a chip card, contains functional elements, e.g. an antenna, made of electrically conducting plastic
10/17/2002	DE10117404A1 Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties
10/17/2002	DE10117107A1 Formteil mit hoher Kurzzeitwärmeformbeständigkeit Molding with high short-term heat resistance
10/17/2002	DE10116406A1 Device for manufacturing and testing electronic units, has bearer plate with externally contactable central electrical contact area for connecting voltage, load or signals to electronic units
10/17/2002	DE10113857A1 Selective, metal-based activation of substrates for wet-chemical, electroless plating, especially on circuit board for microelectronic device, uses vesicles to transport activator metal or precursor to selected area
10/16/2002	EP1250033A2 Printed circuit board and electronic component
10/16/2002	EP1250032A1 Electronic device using Zn-Al-Ge-Mg alloy solder having Al or Cu particles
10/16/2002	EP1250031A2 Wiring board and method of manufacturing same
10/16/2002	EP1249870A2 Semiconductor device
10/16/2002	EP1249472A2 Molding having higher short-time heat-resistance
10/16/2002	EP1249057A2 Flexible compliant interconnect assembly
10/16/2002	EP1249041A1 Organic flip chip packages with an array of through hole pins
10/16/2002	EP1248953A1 A printed circuit assembly with configurable boundary scan paths
10/16/2002	EP1082883B1 Apparatus and method for drilling microvia holes in electrical circuit interconnection packages
10/16/2002	EP1058697A4 Polymeric films having controlled viscosity response to temperature and shear
10/16/2002	EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly
10/16/2002	EP0719451B1 Filling holes and the like in substrates
10/16/2002	CN1375179A Wiring-connecting material and process for producing circuit board with the same
10/16/2002	CN1374827A Multilayer base plate with holes for assembly and its producing method
10/16/2002	CN1374826A Laminating method and product of circuit board with low dielectric coefficient insulating material to inhibitor electromagnetic interference
10/16/2002	CN1374720A Contactor with welding flux and producing method and application in flux ball grid array connector
10/16/2002	CN1374694A Insulation substrate for semi-conductor and power modular
10/16/2002	CN1374668A Rough ceramic sheet method for producing multilayer ceramic electronic elements and carrier sheet of rough ceramic sheet
10/16/2002	CN1374666A Formation of embedded capacitor polar plate sing thin dielectric
10/16/2002	CN1374639A Suspension holder for HDD and its producing method
10/16/2002	CN1374494A Far infrared drying device, drying device constitution body and drying method
10/16/2002	CN1374192A Method for producing metal laminated products
10/16/2002	CN1374190A Polyester film and its producing method
10/16/2002	CN1374189A Process for producing polyester film
10/16/2002	CN1374157A Perforating apparatus and workpiece processing method
10/16/2002	CN1092918C Multilayer print circuit board and its producing method
10/16/2002	CN1092690C Heat resistant resin composition and adhesive sheet using the same composition
10/16/2002	CN1092674C Epoxy propenoic acid resin and its use
10/16/2002	CA2381749A1 Surge protection device including a thermal fuse spring, a fuse trace and a voltage clamping device
10/15/2002	USRE37882 Semiconductor device manufacturing method
10/15/2002	US6466451 Electric connection box
10/15/2002	US6466440 Circuit board cooling apparatus with air guide plates
10/15/2002	US6466282 Structure of liquid crystal display device for easy assembly and disassembly
10/15/2002	US6466124 Thin film resistor and method for forming the same
10/15/2002	US6466113 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
10/15/2002	US6466008 Method for matching the lengths of signal traces
10/15/2002	US6465951 Electroluminescent lamp devices and their manufacture
10/15/2002	US6465876 Semiconductor device and lead frame therefor
10/15/2002	US6465748 Wiring unit
10/15/2002	US6465747 Microelectronic assemblies having solder-wettable pads and conductive elements
10/15/2002	US6465746 Oscillator attachment structure preventing interference by beat signal
10/15/2002	US6465743 Multi-strand substrate for ball-grid array assemblies and method
10/15/2002	US6465742 Three dimensional structure and method of manufacturing the same
10/15/2002	US6465738 Grounding terminal and mounting structure of the same on a printed circuit board
10/15/2002	US6465732 Laser formation of a metal capacitor and integrated coaxial line
10/15/2002	US6465540 Polymer containing epoxized ethylenically unsaturate, diacry-lated polyether and polybasic anhydride with such as a cresol novolac epoxy resin and photoinitiator; dilute alkali deve-lopable; protective films for color filters; printed circuits
10/15/2002	US6465338 Method of planarizing die solder balls by employing a die's weight
10/15/2002	US6465085 Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
10/15/2002	US6465084 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
10/15/2002	US6465082 Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
10/15/2002	US6464513 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same
10/15/2002	US6464125 Rework and underfill nozzle for electronic components
10/15/2002	US6464124 Electrically conductive elevation shaping tool
10/15/2002	US6464122 Soldering method and soldering apparatus
10/15/2002	US6464121 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards
10/15/2002	US6463839 Punch holder apparatus
10/15/2002	US6463831 Method of making a precision punch and die design and construction
10/15/2002	US6463653 Component alignment apparatuses
10/10/2002	WO2002080641A1 Power module
10/10/2002	WO2002080639A1 Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board
10/10/2002	WO2002080637A1 Circuit elements having an embedded conductive trace and methods of manufacture
10/10/2002	WO2002080636A1 Method of modulating surface mount technology solder volume to optimize reliability and fine pitch yield
10/10/2002	WO2002080635A1 Router bit
10/10/2002	WO2002080634A1 High-frequency module
10/10/2002	WO2002080633A1 Flexible circuit with electrostatic damage limiting feature and method of manufacture
10/10/2002	WO2002080330A1 Offset pathway arrangements for energy conditioning
10/10/2002	WO2002080279A1 Three-dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same
10/10/2002	WO2002080271A2 Fluxless flip chip interconnection
10/10/2002	WO2002080263A2 Flip chip interconnection using no-clean flux
10/10/2002	WO2002080261A1 Wafer level insulation underfill for die attach
10/10/2002	WO2002080197A1 Composition for filling through-holes in printed wiring boards
10/10/2002	WO2002079877A1 Method for manufacturing printeed wiring board and photosensitive resin composition to be used for it
10/10/2002	WO2002079766A1 Machine for inspecting printed circuit board
10/10/2002	WO2002079542A2 Improved adhesion of polymeric materials to metal surfaces
10/10/2002	WO2002078896A1 Methods and systems for processing a device, methods and systems for modeling same and the device
10/10/2002	WO2002078895A1 High-speed, precision, laser-based method and system
10/10/2002	WO2002078781A2 Method and apparatus for providing hermetic electrical feedthrough
10/10/2002	WO2002049048A3 Multi-layer and user-configurable micro-printed circuit board
10/10/2002	WO2002047448A3 Attaching devices using polymers
10/10/2002	WO2002047446A3 Process for selectively plating areas of a substrate
10/10/2002	WO2002041673A3 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure
10/10/2002	WO2002025825A3 Method for assembling components and antennae in radio frequency identification devices
10/10/2002	US20020147575 Method and system for modeling dielectric losses in a transmission line
10/10/2002	US20020147557 Method of compensating for work piece distortions and machine errors
10/10/2002	US20020147264 Embedding resin
10/10/2002	US20020147263 Electronics embedded in dielectric
10/10/2002	US20020146928 Component carrier

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