H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2002
10/22/2002	US6470133 Integrated circuit electronic equipment and method of assembly which uses said integrated circuit
10/22/2002	US6470103 Semiconductor parts and semiconductor mounting apparatus
10/22/2002	US6469908 Dual-socket interposer and method of fabrication therefor
10/22/2002	US6469907 Packaging for power and other circuitry
10/22/2002	US6469614 Printed circuit boards having at least one metal layer
10/22/2002	US6469595 Isolating energy conditioning shield assembly
10/22/2002	US6469531 Loaded-board, guided-probe test fixture
10/22/2002	US6469530 Method and apparatus for testing of ball grid array circuitry
10/22/2002	US6469394 Conductive interconnect structures and methods for forming conductive interconnect structures
10/22/2002	US6469393 Semiconductor package and mount board
10/22/2002	US6469384 Unmolded package for a semiconductor device
10/22/2002	US6469371 Non-contact type IC card and process for manufacturing same
10/22/2002	US6469261 Wiring unit
10/22/2002	US6469260 Wiring boards, semiconductor devices and their production processes
10/22/2002	US6469258 Circuit board for semiconductor package
10/22/2002	US6469257 Integrated circuit packages
10/22/2002	US6469256 Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
10/22/2002	US6469255 Composite wiring board and manufacturing method thereof
10/22/2002	US6469248 Hybrid circuit with a heat dissipation system
10/22/2002	US6468893 Method of forming solder bumps
10/22/2002	US6468891 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
10/22/2002	US6468834 Method of fabricating a BGA package using PCB and tape in a die-up configuration
10/22/2002	US6468833 Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
10/22/2002	US6468716 Cover film for dry film resist
10/22/2002	US6468715 Thermal mass transfer donor element
10/22/2002	US6468665 Process for melt-bonding molded article of liquid crystalline polyester with metal
10/22/2002	US6468640 Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device
10/22/2002	US6468593 Conductive paint containinga resin vehicle, a conductive whisker, electroless plating on a surface of the coating film
10/22/2002	US6468589 A heat-cured polyether based on a 9,9-bis(p-hydroxyphenyl)-fluorene having at least one alkyl substituent and a dihydroxy aromatic comonomer; low dielectric protective coatings; heat resistance; noncracking
10/22/2002	US6468584 Transparent conductive thin film of ito, snsbo, znalo or the like or a metal thin film of al or the like by thick film printing coated with photoresist, photolithography provides patterns, fluorescent display device for graphic display
10/22/2002	US6468582 Dry etching a surface of a gold film on an electrode through template to remove oxide layer of metals on film; reaction between the surface of the electrode and a tackiness imparting compound, melting solder powder by heating; eliminates masking
10/22/2002	US6468448 Ph adjusting agent passivation to prevent dissolution of conductive particles; improving reliability of circuit boards
10/22/2002	US6468439 Etching of metallic composite articles
10/22/2002	US6468363 Composition for increasing activity of a no-clean flux
10/22/2002	US6468102 Method of manufacturing wiring board, and electric connection box
10/22/2002	US6467884 Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus
10/22/2002	US6467692 Modular data medium
10/22/2002	US6467676 A hydroxyl-containing fluxing precursor compound is added to the encapsulant composition to react with the anhydride curing agent to produce an active fluxing agent under typical reflow conditions.
10/22/2002	US6467671 Solder recovering method and solder recovering apparatus
10/22/2002	US6467666 Method of producing a semiconductor device
10/22/2002	US6467641 Container device with adjustable volume for immobilizing solder spheres and method thereof
10/22/2002	US6467383 Machine for punching panels
10/22/2002	US6467185 Potted timer and circuit board assembly for use in a regenerative desiccant air dryer
10/22/2002	US6467164 Method for connecting a terminal fitting and a flat conductor, a terminal connection apparatus and a terminal fitting
10/22/2002	US6467162 Method for mounting devices on a printed circuit board despite misalignment of resist
10/22/2002	US6467161 Method for making a circuit board
10/22/2002	US6467160 Fine pitch circuitization with unfilled plated through holes
10/22/2002	CA2233385C Electronic-circuit assembly and manufacturing method thereof
10/17/2002	WO2002082875A2 Circuit board with voltage-conducting electromechanical components and method for production of said circuit board
10/17/2002	WO2002082874A2 Pin connector
10/17/2002	WO2002082588A1 Retention system for electrical connectors
10/17/2002	WO2002082584A2 Electrical terminal tail aligner
10/17/2002	WO2002082577A1 Microwave circuit
10/17/2002	WO2002082466A1 Conductive paste, article produced therewith with a conductive coating on glass, ceramics or enameled steel and method for the production thereof
10/17/2002	WO2002081782A1 Back-end metallisation process
10/17/2002	WO2002081141A1 Carbon dioxide gas laser machining method of multilayer material
10/17/2002	WO2002063261A3 Electronic pressure sensitive transducer apparatus and method for manufacturing same
10/17/2002	WO2002049405A3 Multi-layer circuits and methods of manufacture thereof
10/17/2002	US20020151439 Forming a dielectric layer by thermal decomposition of a metallo-organic material
10/17/2002	US20020151200 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
10/17/2002	US20020151196 Electrical connecting element and method of producing the same
10/17/2002	US20020151195 Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
10/17/2002	US20020151193 Solder-down printed circuit board connection structure
10/17/2002	US20020151164 Structure and method for depositing solder bumps on a wafer
10/17/2002	US20020151161 Method for forming conductive film pattern, and electro-optical device and electronic apparatus
10/17/2002	US20020150838 Conductive posts are disposed in the dielectric layers and can be stacked to form a generally vertical conduction pathway which passes atleast partially through multilayer circuit structure, thus occupy less space
10/17/2002	US20020150787 Alloy of silver, copper, indium and tin
10/17/2002	US20020150743 Method for manufacturing ceramic substrate and non-fired ceramic substrate
10/17/2002	US20020150741 Method and structure for producing z-axis interconnection assembly of printed wiring board elements
10/17/2002	US20020150735 Heat-resistant film and thermal transfer recording medium
10/17/2002	US20020150692 Electroless deposition; corrosion resistance
10/17/2002	US20020150673 Printed wiring boards and methods for making them
10/17/2002	US20020149921 Construction and method for interconnecting flexible printed circuit and wiring board, liquid crystal display device, and method for manufacturing the same
10/17/2002	US20020149899 Surge protection device including a thermal fuse spring, a fuse trace and a voltage clamping device
10/17/2002	US20020149888 Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same
10/17/2002	US20020149494 LED symbol signal
10/17/2002	US20020149119 Semiconductor device
10/17/2002	US20020149114 Product using Zn-Al alloy solder
10/17/2002	US20020149113 Lead-free solder structure and method for high fatigue life
10/17/2002	US20020149101 Wiring board and method of manufacturing same
10/17/2002	US20020149100 Vertically mountable interposer, assembly and method
10/17/2002	US20020149098 Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
10/17/2002	US20020149074 Electro-optical device, method of manufacturing electro-optical device, liquid crystal device, method of manufacturing liquid crystal device and electronic apparatus
10/17/2002	US20020149005 Irregular shaped copper particles and methods of use
10/17/2002	US20020148881 Process for manufacturing solid-solder-deposit printed circuit boards
10/17/2002	US20020148816 Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower
10/17/2002	US20020148809 Method for making an electrical circuit board
10/17/2002	US20020148733 Wiring layer is formed through the degenerated layer including the amide group formed on the resin substrate surface and various layers including a metallic oxide layer
10/17/2002	US20020148642 Circuit board and a method for making the same
10/17/2002	US20020148641 Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate
10/17/2002	US20020148640 Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
10/17/2002	US20020148639 Multi-layer substrates and fabrication processes
10/17/2002	US20020148638 Surface mount component
10/17/2002	US20020148637 High performance dense wire for printed circuit board
10/17/2002	US20020148636 Circuit assembly and a method for making the same
10/17/2002	US20020148631 Controller for a motor vehicle
10/17/2002	US20020148374 Cleaning apparatus in a stencil printer
10/17/2002	US20020148370 Frame for foil stencil
10/17/2002	US20020148369 Screen printing apparatus and method of screen printing
10/17/2002	US20020148113 Transfer of patterned metal by cold-welding

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