| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/29/2002 | US6471805 Method of forming metal contact pads on a metal support substrate |
| 10/29/2002 | US6471538 Contact structure and production method thereof and probe contact assembly using same |
| 10/29/2002 | US6471115 Process for manufacturing electronic circuit devices |
| 10/29/2002 | US6471111 Method and apparatus for acoustic pressure assisted wave soldering |
| 10/29/2002 | US6471109 Method and apparatus for soldering and soldering land of a printed circuit board |
| 10/29/2002 | US6470797 Apparatus for pad printing a conductive picture on an irregular surface |
| 10/29/2002 | US6470545 Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| 10/29/2002 | CA2178465C Wave soldering process including dry fluxing and device therefor |
| 10/29/2002 | CA2076088C Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
| 10/24/2002 | WO2002085085A1 Connecting method for structure with implantable electrodes |
| 10/24/2002 | WO2002085084A1 Retainer element for electrical components for assembly on circuit supports |
| 10/24/2002 | WO2002085083A1 Method for bonding flexible printed circuit boards and/or metal foils |
| 10/24/2002 | WO2002085082A1 Surface mounting type electronic component |
| 10/24/2002 | WO2002085081A1 Printed circuit board and production method therefor, and laminated printed circuit board |
| 10/24/2002 | WO2002084808A1 Circuit board connector |
| 10/24/2002 | WO2002084677A1 Component with a winding support for assembly on a circuit support |
| 10/24/2002 | WO2002084306A1 Contact probe |
| 10/24/2002 | WO2002083610A1 Curable polyvinylbenzyl compound and process for producing the same |
| 10/24/2002 | WO2002083355A1 Circle laser trepanning |
| 10/24/2002 | WO2002083354A1 Particle lock joint |
| 10/24/2002 | WO2002083350A2 Device for applying solder globules |
| 10/24/2002 | WO2002083328A1 Method for improving bonding of rigid, thermosetting compositions to metal and articles formed thereby |
| 10/24/2002 | WO2002067643A3 High strength vias |
| 10/24/2002 | WO2002058234A3 High frequency printed circuit board via |
| 10/24/2002 | WO2002056653A3 Antenna configuration in or on dielectric bodies |
| 10/24/2002 | WO2002056652A3 Method for the production of an electronic component |
| 10/24/2002 | WO2002039793A3 Multi-layer printed circuit board fabrication system and method |
| 10/24/2002 | WO2000035262A3 Method for mounting an electronic component |
| 10/24/2002 | US20020157077 Printed board designing apparatus, printed board designing method, and recording medium on which control program for printed board design is recorded |
| 10/24/2002 | US20020155710 HDD suspension and its manufacture |
| 10/24/2002 | US20020155661 Multilayer; semiconductor substrate, patterned photoreisits, exposure metal contactors, dielectrics; contacting with electroconductive solution |
| 10/24/2002 | US20020155637 Flip chip interconnected structure and a fabrication method thereof |
| 10/24/2002 | US20020155315 Cobalt-molybdenum-phosphorus alloy diffusion barrier coatings |
| 10/24/2002 | US20020155298 Mixture of epoxy resins, curing agents, solvent and organophosphorus compound |
| 10/24/2002 | US20020155280 Liquid crystal polymers for flexible circuits |
| 10/24/2002 | US20020155271 Thermosetting resins |
| 10/24/2002 | US20020155264 Monolithic ceramic sunstrate, manufacturing and designing methods therefor, and electronic device |
| 10/24/2002 | US20020154520 Intrinsically safe universal switching power supply |
| 10/24/2002 | US20020154492 Assembling structure of electronic device |
| 10/24/2002 | US20020154490 Electronic equipment and board insertion/removal apparatus therefor |
| 10/24/2002 | US20020154050 Integrally molded remote entry transmitter |
| 10/24/2002 | US20020153976 Short coaxial transmission line and method for use thereof |
| 10/24/2002 | US20020153872 Switching power-supply module |
| 10/24/2002 | US20020153617 Flip chip interconnected structure and a fabrication method thereof |
| 10/24/2002 | US20020153611 Wiring substrate |
| 10/24/2002 | US20020153608 Land grid array semiconductor device and method of mounting land grid array semiconductor devices |
| 10/24/2002 | US20020153582 High-frequency module and method for manufacturing the same |
| 10/24/2002 | US20020153513 Conductive paste, method of controlling viscosity thereof and electronic component using the same |
| 10/24/2002 | US20020153404 Structure of soldering iron tip |
| 10/24/2002 | US20020153403 Tape shifting means |
| 10/24/2002 | US20020153260 For use in electroplating printed circuit boards and other electronic packaging devices |
| 10/24/2002 | US20020153167 UHF ground interconnects |
| 10/24/2002 | US20020153165 Electric circuit board including glass substrate and method and apparatus trimming thereof |
| 10/24/2002 | US20020153153 Electrical subassembly having a holding device and an electrical component fastened thereto |
| 10/24/2002 | US20020153092 Methods of positioning components using liquid prime movers and related structures |
| 10/24/2002 | US20020152926 Immersing the substrate in a copper plating bath; immersing an activator in copper plating bath; performing a direct contact between activator and substrate to deposit copper on substrate |
| 10/24/2002 | US20020152925 Printed circuit board manufacture |
| 10/24/2002 | US20020152619 Printed circuit board processing machine |
| 10/24/2002 | US20020152611 Thin core substrate for fabricating a build-up circuit board |
| 10/24/2002 | US20020152610 Electronic circuit device and method of production of the same |
| 10/24/2002 | US20020152609 Method and device for coupling PCB sheet |
| 10/24/2002 | US20020152605 Method and system for forming RF reflective pathways |
| 10/24/2002 | US20020152604 Method and system for forming electrically conductive pathways |
| 10/24/2002 | EP1145612A3 Method for mounting an electronic component |
| 10/24/2002 | DE10152537A1 Oberflächenmontierbarer PTC-Thermistor und Befestigungsverfahren desselben The same surface mount PTC thermistor and method of attachment |
| 10/24/2002 | DE10118866A1 Radar antenna with metal foil coating is made by separate injection molding of plastic part and electroforming of metal foil and joining them with adhesive |
| 10/24/2002 | DE10114897A1 Elektronisches Bauteil Electronic component |
| 10/24/2002 | DE10112324A1 Elektronische Schaltung zur Datenfernübertragung An electronic circuit for data transmission |
| 10/24/2002 | DE10109087A1 Verfahren zum Herstellen eines Formbauteils mit einer integrierten Leiterbahn A method for producing a shaped component with an integrated conductor track |
| 10/24/2002 | CA2443482A1 Particle lock joint |
| 10/23/2002 | EP1251724A2 Electric circuit board including glass substrate and method and apparatus for trimming thereof |
| 10/23/2002 | EP1251592A1 System for securing and connecting modules of electrical apparatuses |
| 10/23/2002 | EP1251528A2 Surge protection device |
| 10/23/2002 | EP1251358A2 Device for and method of manufacturing and testing electronic modules |
| 10/23/2002 | EP1250974A2 Structure of soldering iron tip |
| 10/23/2002 | EP1250727A1 Rfid foil or film antennas |
| 10/23/2002 | EP1154914B1 Control apparatus for an automobile |
| 10/23/2002 | EP1002452B1 Contact arrangement linking two substrates and method for the production of said contact arrangement |
| 10/23/2002 | EP0972318B1 Electrical connection between a circuit support and a strip conductor support |
| 10/23/2002 | EP0944671B1 Thermally reworkable binders for flip-chip devices |
| 10/23/2002 | CN2518300Y Pressing overrun opening appts. for circuit board |
| 10/23/2002 | CN2518299Y Whole-vision paster machine |
| 10/23/2002 | CN2517555Y Dust collector of circuit board shaper |
| 10/23/2002 | CN1376308A Sputtering process |
| 10/23/2002 | CN1376100A Laser drilling method and laser drilling device |
| 10/23/2002 | CN1376026A Mounting machine and its part mounting method |
| 10/23/2002 | CN1376022A Manufacture of multi-layered printed circuit board |
| 10/23/2002 | CN1376021A Multi-layered base plate with built-in capacitor and is making process |
| 10/23/2002 | CN1376020A Making process of metallized ceramic base plate |
| 10/23/2002 | CN1376019A Printed circuit board and its production process |
| 10/23/2002 | CN1376018A Multi-layer printed wiring base plate and mfg. method thereof |
| 10/23/2002 | CN1375867A Radiating structure of integrated circuit (IC) |
| 10/23/2002 | CN1375864A Base-plate terminal structure, liquid crystal device and electronic device |
| 10/23/2002 | CN1375842A Raw chip laminating apparatus and method, and laminated ceramic electronic element making method |
| 10/23/2002 | CN1375840A Electronic element and making method thereof |
| 10/23/2002 | CN1375512A Aeolotropic conductive film |
| 10/23/2002 | CN1093367C Multi-layer printed circuit board and method for manufacturing same |
| 10/23/2002 | CN1093318C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 10/23/2002 | CN1093036C Equipment and emthod for manufacturing laminated boards, in particular, industrial laminated boards |
| 10/23/2002 | CN1093020C Nickel powder and process for preparing same |