Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2003
07/17/2003US20030133277 Multilayer printed wiring board and method of manufacturing the same
07/17/2003US20030133276 Arrangements to improve noise immunity of differential signals
07/17/2003US20030133275 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board
07/17/2003US20030133273 Mounting structure of fuse connection terminals on board
07/17/2003US20030133251 Capacitor module
07/17/2003US20030133249 Electronic component and method for manufacturing the same
07/17/2003US20030132544 Method for manufacturing electronic component and apparatus for manufacturing the same
07/17/2003US20030132533 Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frame
07/17/2003US20030132520 Semiconductor device and mounting method
07/17/2003US20030132519 Array structure of solder balls able to control collapse
07/17/2003US20030132513 Semiconductor package device and method
07/17/2003US20030132416 Stripping tin or tin alloys with organic sulfonic acids, nitro-substituted organic compounds and sulfuric acid or a nonionic surfactant with a cloud point of 50-80 degrees c
07/17/2003US20030132273 Reflowing of solder joints
07/17/2003US20030132271 Method for controlling the formation of intermetallic compounds in solder joints
07/17/2003US20030132208 Simulated laser spot enlargement
07/17/2003US20030132192 Flexible printed wiring board
07/17/2003US20030132122 Electroplating solution for high speed plating of tin-bismuth solder
07/17/2003US20030132026 Pad structure of semiconductor package
07/17/2003US20030132025 Printed circuit boards and method of producing the same
07/17/2003US20030131932 Liquid matrix includes one or more additive materials that are strongly absorbing for the wavelength of the laser radiation, such as carbon black, a dye or a metal.
07/17/2003US20030131870 Process of removing holefill residue from a metallic surface of an electronic substrate
07/17/2003US20030131753 Electroplating solution for high speed plating of tin-copper solder
07/17/2003US20030131742 Screen printer
07/17/2003US20030131741 Vacuum print system
07/17/2003US20030131700 Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool
07/17/2003US20030131472 Method of fabricating a multi-layer circuit board assembly
07/17/2003US20030131471 Manufacturing process of IC module
07/17/2003DE19744351C2 Verfahren zur Verkapselung einer vollvergossenen elektronischen Baugruppe Method of encapsulating a fully encapsulated electronics assembly
07/17/2003DE10206681C1 Assembly to bond a plug connection plate to a flexible flat cable, or printed circuit, has a grooved base body to take the inserted flat cable and a holder presses the plate home with distortion to bond them at their contact points
07/17/2003DE10158416C1 Multi-Kugelschalter-Anordnung in Schicht-/Plattenbauweise Multi-ball switch arrangement in stratum / bricks
07/16/2003EP1328142A2 Circuit arrangement
07/16/2003EP1327995A2 Resistor structure
07/16/2003EP1327675A1 Cleaning solvent and dispenser
07/16/2003EP1327653A1 Heat-resistant resin precursor, heat-resistant resin and insulating film and semiconductor device
07/16/2003EP1327517A2 Method of metal layer formation and metal foil-based layered product
07/16/2003EP1327265A2 Electronic module having canopy-type carriers
07/16/2003EP1326729A1 Method and device for applying pieces of material to a workpiece
07/16/2003EP1230442B1 Device for electrolytically treating board-shaped workpieces, especially printed circuits
07/16/2003EP1214198B1 Silk-screen printing machine
07/16/2003EP1188212A4 A multi-functional energy conditioner
07/16/2003EP1188199A4 Multilayer microwave couplers using vertically-connected stripline
07/16/2003CN2560489Y Automatic sizing material feeding apparatus
07/16/2003CN1430866A Multi-piece substrate and method of manufacturing the same
07/16/2003CN1430811A Isolating energy conditioning shield assembly
07/16/2003CN1430768A Method and device for examining pre-determined area of printed circuit board
07/16/2003CN1430466A Set-up structure of shield casing of circuit base plate or flat aerial
07/16/2003CN1430465A Soldering method and soldering structure body
07/16/2003CN1430464A Soldering method and soldering structural body
07/16/2003CN1430463A Circuit board and its manufacturing method
07/16/2003CN1430462A Sheet element for jumper line and its mounting structure
07/16/2003CN1430277A Semiconductor device and its manufacturing method, circuit base plate and electronic machine
07/16/2003CN1430272A Semiconductor device and its manufacturing method
07/16/2003CN1430252A Manufacturing method of grid array packaged base pin surface
07/16/2003CN1430207A 磁头装置 Head means
07/16/2003CN1429707A Printing method and printing device for non-individual body sheet
07/16/2003CN1429682A Welding method of contact pin
07/16/2003CN1115083C Method for mfg. of printed circuit board and printed circuit board
07/16/2003CN1115082C 电路部件和电路板 Circuit component and the circuit board
07/16/2003CN1115081C Printed circuit board for electrical apparatus with HF components, particularly for mobile radio communications equipment
07/16/2003CN1114970C Device for changing printed wire connection mode after installation
07/16/2003CN1114969C Method of dendritic interconnection and its structure
07/15/2003US6594556 Upgradeable voltage regulator modules
07/15/2003US6594153 Circuit package for electronic systems
07/15/2003US6594152 Board-to-board electrical coupling with conductive band
07/15/2003US6594151 Frame support for a printed board assembly
07/15/2003US6594128 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
07/15/2003US6593840 Electronic packaging device with insertable leads and method of manufacturing
07/15/2003US6593764 Test socket and methods
07/15/2003US6593732 Sensor module
07/15/2003US6593661 Method of repairing disconnected wiring and multilevel wiring structure
07/15/2003US6593535 Direct inner layer interconnect for a high speed printed circuit board
07/15/2003US6593534 Printed wiring board structure with z-axis interconnections
07/15/2003US6593526 Mounting mechanism of metal plate on printed board
07/15/2003US6593523 Shield structure for electronic circuit parts
07/15/2003US6593255 Impregnated glass fiber strands and products including the same
07/15/2003US6593249 Method for forming a metal pattern on a dielectric substrate
07/15/2003US6593224 Method of manufacturing a multilayer interconnect substrate
07/15/2003US6593169 Method of making hybrid integrated circuit device
07/15/2003US6593066 Method and apparatus for printing patterns on substrates
07/15/2003US6592980 Mesoporous films having reduced dielectric constants
07/15/2003US6592973 Card and process for producing the card
07/15/2003US6592943 Stencil and method for depositing solder
07/15/2003US6592783 Anisotropic conductive adhesive film
07/15/2003US6592738 Electrolytic process for treating a conductive surface and products formed thereby
07/15/2003US6592696 Method for fabricating a multilayered structure and the structures formed by the method
07/15/2003US6592670 Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
07/15/2003US6592382 Simplified board connector
07/15/2003US6592021 Thin and large-area dielectric substrate and an improved grounding condition
07/15/2003US6592020 Lead-free solder paste
07/15/2003US6592018 Sealant against potting compound
07/15/2003US6591745 Screen printing apparatus and screen printing method
07/15/2003US6591496 Method for making embedded electrical traces
07/15/2003US6591495 Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
07/15/2003US6591491 Method for producing multilayer circuit board
07/15/2003US6591490 Method of constructing a multilayer electric apparatus
07/15/2003CA2292003C Screen printing method and apparatus therefor
07/15/2003CA2195038C Integrated circuit packaging structure
07/11/2003CA2413270A1 Cleaning solvent and dispenser
07/10/2003WO2003056889A1 Connection substrate, multilayer wiring board using the connection substrate, substrate for semiconductor package, semiconductor package, and methods for manufacturing them
07/10/2003WO2003056888A1 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same
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