Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2003
08/28/2003WO2002011207A3 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
08/28/2003US20030163282 Method and system for detecting a spatial movement state of moving objects
08/28/2003US20030163218 Patching methods and apparatus for fabricating memory modules
08/28/2003US20030162935 Halogen-free
08/28/2003US20030162911 No flow underfill composition
08/28/2003US20030162898 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards
08/28/2003US20030162436 Terminal for electrically connecting button battery
08/28/2003US20030162434 Electronic circuit unit having a penetration-type connector housing
08/28/2003US20030162386 Semiconductor device and its manufacturing method
08/28/2003US20030162321 Bmuping process
08/28/2003US20030162310 Characteristics evaluation of intermediate layer circuit
08/28/2003US20030162047 Electrically conductive filled through holes
08/28/2003US20030162006 Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
08/28/2003US20030162003 Manufacturing system using solder self-alignment with optical component deformation fine alignment
08/28/2003US20030161959 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase
08/28/2003US20030161593 Thermal pads for surface mounting of optical devices
08/28/2003US20030161198 Method and apparatus for implementing a selectively operable clock booster for DDR memory or other logic modules which utilize partially-defective memory parts, or a combination of partially-defective and flawless memory parts
08/28/2003US20030161129 Flexible multilayer wiring board and manufacture method thereof
08/28/2003US20030161127 Electronic module assembly apparatus, methods and articles of manufacture
08/28/2003US20030161123 Bonding structure for bonding substrates by metal studs
08/28/2003US20030161122 Electronic component and method of producing the same
08/28/2003US20030161120 Wiring board, method of manufacturing the same, electronic component, and electronic instrument
08/28/2003US20030161089 Electronic component
08/28/2003US20030161086 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
08/28/2003US20030160960 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
08/28/2003US20030160626 Probe card and method of testing wafer having a plurality of semiconductor devices
08/28/2003US20030160339 Electronic component and fabrication method thereof
08/28/2003US20030160336 Fixing device for ball grid array chip
08/28/2003US20030160317 Forming channel in electroconductive foil; overcoating with dielectric
08/28/2003US20030160089 Method of modifying tin to lead ratio in tin-lead bump
08/28/2003US20030160035 Method of forming an opening or cavity in a substrate for receicing an electronic component
08/28/2003US20030159939 Solder electroplating bath including brighteners having reduced volatility
08/28/2003US20030159852 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
08/28/2003US20030159851 Flexible circuit board
08/28/2003US20030159783 Apparatus for manufacturing laminated member
08/28/2003US20030159770 Composite laminate and method for manufacturing the same
08/28/2003US20030159761 Tin, silver, copper alloy
08/28/2003US20030159282 Wiring board and method of fabricating the same, semiconductor device, and electronic instrument
08/28/2003US20030159278 Methods and apparatus for fabricating Chip-on-Board modules
08/28/2003US20030159276 Process for forming electrical/mechanical connections
08/28/2003US20030159262 High frequency device packages and methods
08/28/2003CA2420165A1 Electronic module assembly apparatus, methods and articles of manufacture
08/27/2003EP1339270A2 Method of manufacturing metal clad laminate for printed circuit board
08/27/2003EP1339269A1 Coding element for an electrical module and electrical module with such coding element
08/27/2003EP1338624A1 Liquid thermosetting resin composition, printed wiring boards and process for their production
08/27/2003EP1338431A2 Visible image receiving material having surface hydrophilicity
08/27/2003EP1338345A1 Devices and methods for forming a film, manufacturing a color filter and manufacturing a display device
08/27/2003EP1338182A1 Electrical component, arrangement for said component and method for producing said arrangement
08/27/2003EP1338176A1 Coating removal
08/27/2003EP1337943A1 System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer pcb manufacture
08/27/2003EP1337693A2 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
08/27/2003EP1337687A1 Systems and methods for preventing and/or reducing corrosion in various articles
08/27/2003EP1337685A2 Electroless rhodium plating
08/27/2003EP1337377A1 Solder material and electric or electronic device in which the same is used
08/27/2003EP1230712B1 Electrical connector
08/27/2003EP1163552B1 Method of forming a masking pattern on a surface
08/27/2003EP0843509B1 Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
08/27/2003EP0835046B1 Component mounting board, process for producing the board, and process for producing the module
08/27/2003EP0823096B1 Method of producing a smart card
08/27/2003CN2569522Y Tool for producing welding wire ring
08/27/2003CN2569521Y Device for increasing tin wave height in wave soldering
08/27/2003CN2569520Y Punch cover for mounting element with punch surface
08/27/2003CN2569519Y Welding general tray for print circuit board
08/27/2003CN2569518Y General cripping device for print circuit board
08/27/2003CN1439236A Process for thick film circuit patterning
08/27/2003CN1439174A Process for the manufacture of printed circuit boards with plated resistors
08/27/2003CN1439117A Material and method for making an electroconductive pattern
08/27/2003CN1439060A Method for depositing metal and metal oxide films and patterned films
08/27/2003CN1439028A Insulating resin composition, adhesive resin composition and adhesive sheeting
08/27/2003CN1438834A Improved method for imlaying thick-film assembly
08/27/2003CN1438833A Circuit-board having internal electronic element and making method thereof
08/27/2003CN1438832A Wiring baseboard and making method
08/27/2003CN1438735A 连接装置 Connecting device
08/27/2003CN1438734A Solder-holder for supplying solder to connector
08/27/2003CN1438698A 半导体器件 Semiconductor devices
08/27/2003CN1438686A Semiconductor device and making method
08/27/2003CN1438491A Apparatus for scanning-testing printed circuit poard
08/27/2003CN1438361A Apparatus for spraying printed circuit-board
08/27/2003CN1438286A Adhisive piece for fixing flexible printed circuit-board and method for fitting electronic element on flexible printed circuit board
08/27/2003CN1438077A Film formation method and device, liquid-drip putting-out device, colour filter making method and use
08/27/2003CN1119768C Method and apparatus for bonding wire conductor
08/27/2003CN1119700C Use of etching solution in etching polyimide film
08/27/2003CN1119433C Metalizing process for diamond heat-sink thick film base plate
08/26/2003US6611419 Electronic assembly comprising substrate with embedded capacitors
08/26/2003US6611280 Flexible cable, flexible cable mount method, semiconductor device with flexible cable, led array head with flexible cable, image forming apparatus with such led array head
08/26/2003US6611066 Power distributor for vehicle
08/26/2003US6611065 Connection material
08/26/2003US6611058 Vertical surface mount assembly and methods
08/26/2003US6611049 Semiconductor device with chamfered substrate and method of making the same
08/26/2003US6611046 Flexible polyimide circuits having predetermined via angles
08/26/2003US6610972 System for compensating for chip-to-chip gap widths in a multi-chip photosensitive scanning array
08/26/2003US6610961 System and method of workpiece alignment in a laser milling system
08/26/2003US6610960 Method for drilling micro-holes with a laser beam
08/26/2003US6610934 Semiconductor module and method of making the device
08/26/2003US6610621 Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
08/26/2003US6610591 Methods of ball grid array
08/26/2003US6610559 Integrated void-free process for assembling a solder bumped chip
08/26/2003US6610459 Lamination; preventing premature tacking
08/26/2003US6610430 Method of attaching a device to a circuit board
08/26/2003US6610418 Electolytic copper foil with carrier foil and method for manufacturing the same
1 ... 663 664 665 666 667 668 669 670 671 672 673 674 675 676 677 678 679 680 681 682 683 ... 1185