Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2003
06/17/2003US6580501 Apparatus and method for the visual inspection in particular of concealed soldered joints
06/17/2003US6580491 Apparatus and method for compensating for distortion of a printed circuit workpiece substrate
06/17/2003US6580489 Liquid crystal display panel and a substrate capable of being cut by a laser light
06/17/2003US6580369 Electronic tag assembly and method therefor
06/17/2003US6580349 Guiding device for guiding conducting wire soldered on printed circuit board
06/17/2003US6580316 Power transistor module, power amplifier and methods in the fabrication thereof
06/17/2003US6580174 Vented vias for via in pad technology yield improvements
06/17/2003US6580169 Method for forming bumps, semiconductor device, and solder paste
06/17/2003US6580143 Thin-film circuit substrate and method of producing same
06/17/2003US6580055 Laser processing apparatus and method
06/17/2003US6580036 Multi-layer printed circuit board and a BGA semiconductor package using the multi-layer printed circuit board
06/17/2003US6580035 Flexible adhesive membrane and electronic device employing same
06/17/2003US6580031 Method for making a flexible circuit interposer having high-aspect ratio conductors
06/17/2003US6579804 Contact structure and production method thereof and probe contact assembly using same
06/17/2003US6579803 Removal of copper oxides from integrated interconnects
06/17/2003US6579744 Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive
06/17/2003US6579660 Process for direct digital printing of circuit boards
06/17/2003US6579591 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
06/17/2003US6579576 Polycarbonate housings having conveyors and horns to provide ultrasonic frequency used for coating, cleaning, dyeing, etching or plating substrates such as ceramics
06/17/2003US6579568 Copper foil for printed wiring board having excellent chemical resistance and heat resistance
06/17/2003US6579565 Clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof
06/17/2003US6579474 A conductive composition, and articles and methods using the conductive composition are disclosed. conductive particles in an amount of at least about 75 wt. % based on the weight of the composition, wherein at least 50% by weight of the
06/17/2003US6579472 Combination of an organometallic salt, an organosilane, and a borate, phosphate, or zinc functional component.
06/17/2003US6579437 Acid resistance
06/17/2003US6579392 Preparing a green composite laminate comprising first green sheet layers each comprising a first particulate aggregate and second green sheet layers each comprising a second particulate aggregate unsinterable at a temperature for
06/17/2003US6579159 Chemical planar head dampening system
06/17/2003US6579139 Electron emitting element of a surface conductive type, that is advantageous for the formation of a conductive film to cover a large area, without resorting to the use of the vacuum sputtering method or the vacuum deposition method
06/17/2003US6579106 Electrical connecting structure of a tape carrier package for a LCD driver
06/17/2003US6579105 Electrical connector assembly
06/17/2003US6578773 An assembly for jetting droplets of a viscous medium, said assembly being releasably mountable in a machine using the assembly for providing a substrate with deposits
06/17/2003US6578755 Polymer collar for solder bumps
06/17/2003US6578458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
06/17/2003US6578260 Method for assembling a multi-deck power supply device
06/13/2003CA2413369A1 Electronic module including a low temperature co-fired ceramic (ltcc) substrate with a capacitive structure embedded therein and related methods
06/12/2003WO2003049515A1 Depositing solid materials
06/12/2003WO2003049514A2 Miniature rf and microwave components and methods for fabricating such components
06/12/2003WO2003049513A1 Electric circuit module and method for its assembly
06/12/2003WO2003049512A1 Ball grid array package
06/12/2003WO2003049511A1 High speed multi-layer printed circuit board via
06/12/2003WO2003049500A2 Method and device for producing an electrical strip conductor on a substrate
06/12/2003WO2003049183A2 Optimum power and ground bump pad and bump patterns for flip chip packaging
06/12/2003WO2003048981A2 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid
06/12/2003WO2003048879A1 Ballast control card
06/12/2003WO2003048860A1 Photosensitive composition and production processes for photosensitive film and printed wiring board
06/12/2003WO2003048641A1 Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid
06/12/2003WO2003048235A1 Heat-curable resin composition
06/12/2003WO2003048234A1 Resin composition
06/12/2003WO2003048171A1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
06/12/2003WO2003047806A1 Method of laser milling
06/12/2003WO2003047805A1 Method of laser milling using constant tool path algorithm
06/12/2003WO2001090446A3 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
06/12/2003WO2001061732A3 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
06/12/2003US20030110452 Electronic package design with improved power delivery performance
06/12/2003US20030109666 Thermosetting resin compositions containing maleimide and/or vinyl compounds
06/12/2003US20030109330 Multilayer golf ball with filled inner layer having dual core, liquid core, or wound core
06/12/2003US20030109182 Contact module, connector and method of producing said contact module
06/12/2003US20030109170 Relay device and relay device mounting structure
06/12/2003US20030109152 Multi-connector for use in high-speed communication apparatus and method for mounting the same multi-connector into printed board
06/12/2003US20030109083 Interconnecting substrates for electrical coupling of microelectronic components
06/12/2003US20030108764 Method for improving bonding of circuit board substrates to metal surfaces and the articles formed thereby
06/12/2003US20030108727 Transfer sheet
06/12/2003US20030108664 Depositing silver metal precursor into portion of recessed feature, heating to temperature of not greater than 400 degrees C to convert precursor to conductor having resistivity of not greater than 10 times resistivity of metal
06/12/2003US20030107881 Setting construction of shield case or planar antenna on circuit board
06/12/2003US20030107876 Structure for mounting an electronic circuit unit
06/12/2003US20030107874 De-mountable, solderless in-line lead module package with interface
06/12/2003US20030107465 Passive element component and substrate with built-in passive element
06/12/2003US20030107452 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure
06/12/2003US20030107444 Oscillator and electronic apparatus using the same
06/12/2003US20030107331 Ballast control card
06/12/2003US20030107128 Package for microwave components
06/12/2003US20030107059 Substrate exposure apparatus
06/12/2003US20030107054 Semiconductor device and its manufacturing method
06/12/2003US20030106925 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas
06/12/2003US20030106802 Reaction product of amines with glycidyl ether or quaternary ammonium compound
06/12/2003US20030106711 Solder resist opening to define a combination pin one indicator and fiducial
06/12/2003US20030106710 Heat distributor for electrical connector
06/12/2003US20030106709 Interconnecting substrates for electrical coupling of microelectronic components
06/12/2003US20030106706 Flat cable and a manufacturing method therefor
06/12/2003US20030106630 Pin lamination method that may eliminate pits and dents formed in a multi-layer printed wiring board and the ply-up device thereof
06/12/2003US20030106211 Method of connecting flat cable and terminal
06/12/2003US20030106209 Method and apparatus for manufacturing known good semiconductor die
06/12/2003DE10136514C1 Verfahren zur Herstellung einer elektrisch leitenden Bondverbindung, sowie Bondverbindung A process for producing an electrically conductive bond, as well as bond
06/11/2003EP1318708A2 Resin filler and multilayer printed wiring board
06/11/2003EP1318707A1 Method for manufacturing solder mask of printed circuit board
06/11/2003EP1318706A1 Process and apparatus for manufacturing electrically conductive patterns on carriers, and foils therefor
06/11/2003EP1318704A1 Printed circuit board micro hole processing method
06/11/2003EP1318532A1 Coil assembly and manufacturing thereof
06/11/2003EP1318013A1 Method for forming a metal/resin composite material
06/11/2003EP1317991A2 Solder paste
06/11/2003EP1317875A1 Method for producing an electrically conductive structure on a non-planar surface and the use of said method
06/11/2003EP1317801A2 Thick film millimeter wave transceiver module
06/11/2003EP1317769A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component
06/11/2003EP1317691A2 Photosensitive composition, cured article thereof, and printed circuit board using the same
06/11/2003EP1317674A1 Method and device for testing the operativeness of printed circuit boards
06/11/2003EP1240809B1 Multilayer printed board
06/11/2003EP1239994B1 Headpiece for machine tools that produce multiple holes
06/11/2003EP1236052B1 Electrical test of the interconnection of conductors on a substrate
06/11/2003EP1144197B1 Thermal Transfer Method.
06/11/2003EP1080247B1 Method for producing metallized substrate materials
06/11/2003CN1423848A Method for making an electro conductive joint
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