Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2003
08/14/2003US20030150353 Reducing agent that is oxidized by gold, and an additional reducing agent that is either oxidized by gold or by a substrate metal
08/14/2003US20030150111 Components with releasable leads
08/14/2003US20030150110 Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
08/14/2003US20030150109 Method of manufacturing a circuit board
08/14/2003US20030150101 Printed circuit board with buried resistor and manufacturing method thereof
08/14/2003DE20205339U1 Sensor circuit component group, for control of functions of household machine, includes circuit board, several sensors and relays
08/14/2003CA2474694A1 Resin composition_and products containing the same
08/14/2003CA2474693A1 Resin composition and products containing the same
08/13/2003EP1335643A2 Method for manufacturing double-sided circuit board
08/13/2003EP1335452A2 Device for bonding two metal structures
08/13/2003EP1335393A1 Method of producing electronic parts, and member for production thereof
08/13/2003EP1335389A1 Coated particle
08/13/2003EP1335211A2 Applications for encapsulated electrophoretic displays
08/13/2003EP1334820A2 Punch for a laminating press and use
08/13/2003EP1334810A1 Circuit board production method and circuit board production data
08/13/2003EP1334648A1 Method of jetting viscous medium
08/13/2003EP1334647A1 An integrated circuit carrier
08/13/2003EP1334542A2 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
08/13/2003EP1334520A2 Film material comprising metal spikes and method for the production thereof
08/13/2003EP1334393A1 Transparent substrate and hinged optical assembly
08/13/2003EP1254431B1 Method and system for detecting defects on a printed circuit board
08/13/2003EP1238444B1 Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection
08/13/2003EP0829186B1 Composite materials
08/13/2003CN2566582Y Printed circuit board forming machine unloading mechanism mounted on base
08/13/2003CN1436226A Polymeric materials to metal surfaces adhesion process
08/13/2003CN1436035A Apparatus and method for mfg. ceramic laminate
08/13/2003CN1436034A Interlayer connection of multi-layer electronic component and mfg. method thereof
08/13/2003CN1436033A Interlayer connecting method and apparatus
08/13/2003CN1436032A Ceramic laminate and making method thereof
08/13/2003CN1435926A Optical device and optical head apparatus mounting method
08/13/2003CN1435915A Spherical grid array connection device
08/13/2003CN1435914A Electric connector and chip soldered dot leveling method
08/13/2003CN1435510A Non-electrolysis gold plating solution
08/13/2003CN1435508A Method for sputtering plastic article with film and plastic article obtained thereby
08/13/2003CN1118099C Method for mounting intermediate connecting element to terminal of electronic module
08/13/2003CN1118094C Device and method for connecting two electronic components
08/13/2003CN1118093C Method for preparation of printed IC board
08/12/2003US6606519 Microcurrent therapy device components stack and conductive pad
08/12/2003US6606402 System and method for in-line inspection of stencil aperture blockage
08/12/2003US6606249 Connection structure for display module and printed substrate, semiconductor device, display module, and electronic component
08/12/2003US6606247 Multi-feature-size electronic structures
08/12/2003US6606014 Filter structures for integrated circuit interfaces
08/12/2003US6606012 Wideband bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure
08/12/2003US6606011 Energy conditioning circuit assembly
08/12/2003US6605876 Semiconductor chip package and connection structure including a ground metal plane having blank patterns
08/12/2003US6605869 Semiconductor device with improved cooling efficiency and reduced electric resistance
08/12/2003US6605778 Circuit carrier, in particular printed circuit board
08/12/2003US6605692 Compositions for making ene-thiol elastomers
08/12/2003US6605691 Compositions for making ene-thiol elastomers
08/12/2003US6605690 Compositions for making ene-thiol elastomers
08/12/2003US6605689 Compositions for making ene-thiol elastomers
08/12/2003US6605687 Compositions for making ene-thiol elastomers
08/12/2003US6605551 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance
08/12/2003US6605369 Printed wiring boards; anticorrosion zinc or zinc alloy layer on foil and an electrodeposited chromate layer on the zinc layer and a silane coupling agent-adsorbed layer on chromate layer; drying conditions after coupling treatment; adhesion
08/12/2003US6605365 Pigmented alkoxyzirconium sol
08/12/2003US6605357 A PEI film to be bonded is disposed on a glass epoxy substrate through an alkane film, and a position to be adhered is heated to a temperature not less than the glass transition point Tg of the PEI film, thereby forming an adhesion-improving layer
08/12/2003US6605353 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming
08/12/2003US6604970 Methods for producing electron source, image-forming apparatus, and wiring substrate having a stack of insulating layers; and electron source, image-forming apparatus, and wiring substrate produced using the methods
08/12/2003US6604948 Double-double (2×2) tester paddle board AKA 2×2 paddle board
08/12/2003US6604673 Filling device and method for filling balls in the apertures of a ball-receiving element
08/12/2003US6604282 Circuit board manufacturing method
08/12/2003US6604281 Circuit board packaging process for preventing electromagnetic interference
08/12/2003US6604255 Soldering iron cleaning apparatus
08/12/2003CA2284837C Method and pdt probe for minimizing ct and mri image artifacts
08/07/2003WO2003065777A1 Control device
08/07/2003WO2003065763A1 Gating grid and method of making same
08/07/2003WO2003065510A1 Apparatus and method of manufacturing printed circuit boards
08/07/2003WO2003065509A1 Surface mount attachable land grid array connector and method of forming same
08/07/2003WO2003065446A1 Multi-layer ceramic substrate, and method and device for producing the same
08/07/2003WO2003064973A1 Three-dimensional measuring instrument, filter striped plate, and illuminating means
08/07/2003WO2003064733A1 Method and device for electrically contacting a product to be treated in electrolytic systems
08/07/2003WO2003064506A1 High adhesive liquid crystalline polymer film
08/07/2003WO2003064495A2 Planarized microelectronic substrates
08/07/2003WO2003064493A1 No flow underfill composition
08/07/2003WO2003064156A1 Machine for continuously producing plastic laminates in a cold press
08/07/2003WO2003064102A1 Solder metal, soldering flux and solder paste
08/07/2003US20030149505 Apparatus and method for creating flexible circuits
08/07/2003US20030148904 Cured polymers dissolving compositions
08/07/2003US20030148739 High-frequency module device
08/07/2003US20030148662 Terminal structure of high frequency signal transmitting part
08/07/2003US20030148653 Power electronics unit
08/07/2003US20030148642 Device and system for recessing a fastener on a printed wire board
08/07/2003US20030148593 Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure
08/07/2003US20030148138 First step of preparing a lower layer paste with the use of a first mixture comprising nickel, tungsten and molybdenum, applying the lower layer paste to a surface of a ceramic base which is a sintered ceramic, and drying the resultant coating
08/07/2003US20030148136 Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminate
08/07/2003US20030148107 Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board
08/07/2003US20030148079 Thermal conductive substrate and the method for manufacturing the same
08/07/2003US20030148078 Polyimide film which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate layer 2 formed from one, or two or more elements selected from a group consisting of molybdenum, silicon and
08/07/2003US20030148077 High-performance laminate for integrated circuit interconnection
08/07/2003US20030148024 Electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition
08/07/2003US20030147601 Hybrid optical module employing integration of electronic circuitry with active optical devices
08/07/2003US20030147333 Mounting method for optical device and optical head equipment
08/07/2003US20030147227 Multi-layered interconnect structure using liquid crystalline polymer dielectric
08/07/2003US20030147221 Integral high current stamped metal circuit for printed circuit board bussed electrical center
08/07/2003US20030147217 Electronic circuit board case and method of producing electronic circuit unit
08/07/2003US20030147196 Electronic component and manufacturing method thereof
08/07/2003US20030146705 Ultra-high pressure discharge lamp
08/07/2003US20030146510 Elastomer interposer for grid array packages and method of manufacturing the same
08/07/2003US20030146505 Sperical core of high melting metal; connector of low melting eutectic
08/07/2003US20030146497 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
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