| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/09/2003 | CN1428458A Mfg. method of electronic parts and siad electronic parts, electroless coating method |
| 07/09/2003 | CN1428457A Method for mfg. electronic parts and said electronic parts |
| 07/09/2003 | CN1428456A Plating method |
| 07/09/2003 | CN1428204A Spraying nozzle with cover for spraying printed-circuit board |
| 07/09/2003 | CN1114338C Method for mfg. printed circuit board heat sink and radiating fin |
| 07/09/2003 | CN1114250C Electrical grounding shround |
| 07/09/2003 | CN1113983C Method and device for electrochemical treatment of items with processing fluid |
| 07/09/2003 | CN1113982C Non-cyanide brass plating bath and method of making metallic foil having brass layer using the same |
| 07/09/2003 | CN1113980C High fatigue ductility electrodeposited copper foil |
| 07/08/2003 | US6590788 Intrinsically safe universal switching power supply |
| 07/08/2003 | US6590780 Operating mechanism |
| 07/08/2003 | US6590491 Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same |
| 07/08/2003 | US6590478 Short coaxial transmission line and method for use thereof |
| 07/08/2003 | US6590406 Apparatus for inspecting display board or circuit board |
| 07/08/2003 | US6590291 Semiconductor device and manufacturing method therefor |
| 07/08/2003 | US6590290 Stacked via in copper/polyimide BEOL |
| 07/08/2003 | US6590287 Packaging method and packaging structures of semiconductor devices |
| 07/08/2003 | US6590286 Land grid array semiconductor device |
| 07/08/2003 | US6590285 Method and composition for mounting an electronic component and device formed therewith |
| 07/08/2003 | US6590165 Printed wiring board having throughole and annular lands |
| 07/08/2003 | US6590018 Vinyl silane compounds containing epoxy functionality |
| 07/08/2003 | US6590010 Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective coating |
| 07/08/2003 | US6589870 Inter-layer connection structure, multilayer printed circuit board and production processes therefor |
| 07/08/2003 | US6589811 Method for transferring semiconductor device layers to different substrates |
| 07/08/2003 | US6589802 Packaging structure and method of packaging electronic parts |
| 07/08/2003 | US6589662 Polyimide membrane formed on at one surface of polyester or polyphenylene sulfide substrate; diamines component includes one of 3,5- diaminobenzoic acid and a diaminosiloxane derivative |
| 07/08/2003 | US6589639 Hole fill composition and method for filling holes in a substrate |
| 07/08/2003 | US6589594 Method for filling a wafer through-via with a conductive material |
| 07/08/2003 | US6589593 Method for metal coating of substrates |
| 07/08/2003 | US6589459 Method of forming conductive circuits |
| 07/08/2003 | US6589413 Method of making a copper on INVAR® composite |
| 07/08/2003 | US6589381 Contacting copper foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film, laminating metal foil to a resin selected from polyimde, polyester or epoxy resin |
| 07/08/2003 | US6589376 Method and composition for mounting an electronic component and device formed therewith |
| 07/08/2003 | US6589355 1,1,1,3,3-pentafluoropropane as a supercritical fluid; printed circuit board |
| 07/08/2003 | US6589061 Printed circuit board for straddle mount electrical connector and method for pasting the same |
| 07/08/2003 | US6589059 Chip socket assembly and chip file assembly for semiconductor chips |
| 07/08/2003 | US6588919 Wave solderable pedestalled LED |
| 07/08/2003 | US6588645 Continuous mode solder jet apparatus |
| 07/08/2003 | US6588476 Method and apparatus for producing a faultless material web, as well as faultless material web |
| 07/08/2003 | US6588308 Rotary cutting blade; chips and associated connecting means, such as connection wires and solder balls which may be bonded to the connecting ends; products are clamped down on a supporting by using a vacuum |
| 07/08/2003 | US6588099 Process for manufacturing molded circuit board |
| 07/08/2003 | US6588097 Method of manufacturing multilayered ceramic substrate and green ceramic laminate |
| 07/08/2003 | US6588095 for processing an exposed conductive connection between an thermal inkjet head and a flexible tape circuit connectable to control signals for driving the inkjet device; plated with a polymer to protect it against corrosive damage |
| 07/08/2003 | CA2287707C Surface treatment of copper to prevent microcracking in flexible circuits |
| 07/07/2003 | CA2415979A1 Interconnection system |
| 07/07/2003 | CA2415810A1 Method of schematic-level ams topology optimization using direct representations |
| 07/03/2003 | WO2003055289A1 Housing system for an electric device |
| 07/03/2003 | WO2003055288A1 Method for making a multilayer module with high-density printed circuits |
| 07/03/2003 | WO2003054629A1 Method of patterning a layer and method of manufacturing an electronic device |
| 07/03/2003 | WO2003054486A1 Optical encoder device |
| 07/03/2003 | WO2003054053A1 New 3,4-alkylenedioxythiophene compounds and polymers thereof |
| 07/03/2003 | WO2003053895A2 Copper deposition using copper formate complexes |
| 07/03/2003 | WO2003053680A1 Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil |
| 07/03/2003 | WO2003053628A1 Scavenging system and method |
| 07/03/2003 | WO2003053623A1 Heated filling device and method |
| 07/03/2003 | WO2003036686A3 Method of patterning electrically conductive polymers |
| 07/03/2003 | WO2003028099A3 Arrangement of vias in a substrate to support a ball grid array |
| 07/03/2003 | WO2003023787B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 07/03/2003 | WO2003014751A3 Method and apparatus for evaluating a set of electronic components |
| 07/03/2003 | US20030124866 Method and apparatus for forming pattern using printing method |
| 07/03/2003 | US20030124865 Method for forming pattern using printing process |
| 07/03/2003 | US20030124862 Method of polishing copper layer of substrate |
| 07/03/2003 | US20030124765 System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication |
| 07/03/2003 | US20030124757 Method of forming pattern |
| 07/03/2003 | US20030124463 An optical exposure method and a device are used for forming patterns on a printed board wiring or semiconductor board. A single exposing region of a surface to be exposed is irradiated with a plurality of optical beams having different |
| 07/03/2003 | US20030124461 Finely divided particles of inorganic material comprising conductive particles selected from RuO2, ruthenium- based polynary oxides or mixtures thereof; inorganic binder having a glass transition temperature in the range of from 325 to 600 |
| 07/03/2003 | US20030124326 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 07/03/2003 | US20030124260 Printing a conductive organic material, such as polyethylenedioxythiophene, on the substrate; and curing to form the metal pattern on the substrate |
| 07/03/2003 | US20030124259 Precursor compositions for the deposition of electrically conductive features |
| 07/03/2003 | US20030123818 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device |
| 07/03/2003 | US20030123237 Jumper chip component and mounting structure therefor |
| 07/03/2003 | US20030123234 Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module |
| 07/03/2003 | US20030123233 Terminal locating means assembly |
| 07/03/2003 | US20030123217 Chip capacitor |
| 07/03/2003 | US20030123193 Magnetic head device with flexible wiring board |
| 07/03/2003 | US20030122897 Structure of a flexible printed circuit for inkjet printheads and the manufacturing process therefor |
| 07/03/2003 | US20030122573 Technique to reduce reflections and ringing on CMOS interconnections |
| 07/03/2003 | US20030122256 Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same |
| 07/03/2003 | US20030122254 Device and method for including passive components in a chip scale package |
| 07/03/2003 | US20030122234 LSI package and internal connecting method used therefor |
| 07/03/2003 | US20030122213 Semiconductor packaging substrate and method of producing the same |
| 07/03/2003 | US20030121991 Nozzle with cover for spraying printed circuit board |
| 07/03/2003 | US20030121959 Process for soldering and connecting structure |
| 07/03/2003 | US20030121958 Solder reflow with microwave energy |
| 07/03/2003 | US20030121957 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
| 07/03/2003 | US20030121954 Process for soldering and connecting structure |
| 07/03/2003 | US20030121953 Self-adhesive flexible repair circuit |
| 07/03/2003 | US20030121792 Electrolytic cell; vibration, agitation |
| 07/03/2003 | US20030121791 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
| 07/03/2003 | US20030121790 Contact composite of metal and plastic; press fitting |
| 07/03/2003 | US20030121789 Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil |
| 07/03/2003 | US20030121700 Method for fabricating electrical connecting element, and electrical connecting element |
| 07/03/2003 | US20030121699 Multi-layered printed wiring board having via holes, circuit module comprising circuit elements mounted on the multi-layered printed wiring board, and method of manufacturing the multi-layered printed wiring board |
| 07/03/2003 | US20030121698 Semiconductor device and printed wiring board having electrode pads |
| 07/03/2003 | US20030121697 Copper alloy foil |
| 07/03/2003 | US20030121604 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board |
| 07/03/2003 | US20030121602 Binder, electricoconductive carbon black and graphite particles and volatile solvent; metal free; self regulating temperature; easy application |
| 07/03/2003 | US20030121564 Tin, zinc alloy mixed with flux |
| 07/03/2003 | US20030121473 Method and apparatus for improving stencil/screen print quality |
| 07/03/2003 | US20030121470 Paste application apparatus and method for applying paste |