Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2003
08/20/2003CN1118886C Electric connector and producing method thereof
08/20/2003CN1118833C Method for using resin package electronic element
08/20/2003CN1118832C Anisotropically electroconductive resin film
08/20/2003CN1118522C Process for preparing green pigment composition without halogen
08/19/2003US6608922 Method of recognizing connection of reconstructing pattern in printed wiring board
08/19/2003US6608921 Inspection of solder bump lighted with rays of light intersecting at predetermined angle
08/19/2003US6608763 Stacking system and method
08/19/2003US6608760 Dielectric material including particulate filler
08/19/2003US6608757 Method for making a printed wiring board
08/19/2003US6608663 Active matrix liquid-crystal display device having improved terminal connections
08/19/2003US6608385 Contact structure and production method thereof and probe contact assembly using same
08/19/2003US6608382 Metal bump
08/19/2003US6608381 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
08/19/2003US6608374 Semiconductor chip assembly with bumped conductive trace
08/19/2003US6608366 Lead frame with plated end leads
08/19/2003US6608257 Direct plane attachment for capacitors
08/19/2003US6608256 Flat cable
08/19/2003US6608119 Water-base ink, method of manufacturing the ink, and method of printing using the ink
08/19/2003US6607981 Method for forming a Cu interconnect pattern
08/19/2003US6607939 Method of making a multi-layer interconnect
08/19/2003US6607825 Metal film bonded body, bonding agent layer and bonding agent
08/19/2003US6607780 Forming opening by photolithography; filling opening with nonconductive paste; placing green sheet on support; filling through hole with conductive paste
08/19/2003US6607690 Methods for manufacturing ceramic green sheet and multilayer ceramic electronic parts
08/19/2003US6607653 Plating bath and process for depositing alloy containing tin and copper
08/19/2003US6607652 Electroplating method
08/19/2003US6607620 Greensheet carriers and processing thereof
08/19/2003US6607613 Solder ball with chemically and mechanically enhanced surface properties
08/19/2003US6607599 Apparatus for improving stencil/screen print quality
08/19/2003US6607414 Method of making an ion reflectron comprising a flexible circuit board
08/19/2003US6607396 IC socket
08/19/2003US6607120 Method of manufacturing a flexible circuit compression connector
08/19/2003US6607118 Apparatus and method for ball release
08/19/2003US6607117 Solder ball attaching system and method
08/19/2003US6607115 Junction box
08/19/2003US6606926 Method for punching brittle material and punching die to be used therefor
08/19/2003US6606793 Printed circuit board comprising embedded capacitor and method of same
08/19/2003US6606792 Process to manufacturing tight tolerance embedded elements for printed circuit boards
08/19/2003US6606791 Component alignment methods
08/19/2003US6606789 Method and apparatus in a production line
08/19/2003CA2154782C No-clean, low-residue, volatile organic compound free soldering flux and method of use
08/14/2003WO2003067946A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
08/14/2003WO2003067945A1 Printed circuit board comprising a component
08/14/2003WO2003067944A1 High-speed electrical router backplane with noise-isolated power distribution
08/14/2003WO2003067943A2 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
08/14/2003WO2003067940A2 Circuit carrier and production thereof
08/14/2003WO2003067906A2 High-speed router with single backplane distributing both power and signaling
08/14/2003WO2003067604A2 Circuit system with a printed board comprising a programmable memory element
08/14/2003WO2003067564A1 Compact display assembly
08/14/2003WO2003067417A1 Input device, mobile telephone, and mobile information device
08/14/2003WO2003067296A1 Hybrid optical module employing integration of electronic circuitry with active optical devices
08/14/2003WO2003066741A1 Resin composition
08/14/2003WO2003066740A1 Resin composition
08/14/2003WO2003066274A1 Solder and solder connection
08/14/2003WO2003026009A3 Power electronics component
08/14/2003WO2003023428B1 Test fixture glass etch
08/14/2003WO2002064496A3 Method for forming microelectronic spring structures on a substrate
08/14/2003WO2002015266A3 Direct build-up layer on an encapsulated die package
08/14/2003US20030154451 Method, system and computer program product for multidisciplinary design analysis of structural components
08/14/2003US20030154335 Encoding element for an electric module and electric module including such encoding element
08/14/2003US20030153834 Ultrasound probe wiring method and apparatus
08/14/2003US20030153723 Reaction of a dioxetane compound, an unsaturated monocarboxylic acid, and a polybasic anhydride with a primary hydroxyl group
08/14/2003US20030153704 Polymer-coated metal composites by dip autopolymerization
08/14/2003US20030153476 Aliphatic alcohol having 4 or fewer carbons and having an amino group or an imino group and a hydroxyl group in a molecular thereof, and a tetraalkyl ammonium hydroxide aqueous solution
08/14/2003US20030153223 Connecting method for metal material and electric conductive plastic material and product thereby
08/14/2003US20030153204 Terminal structure having large peel strength of land portion and ball
08/14/2003US20030153201 Circuit board electrical lead frame
08/14/2003US20030153197 Mask film, its manufacturing method, and manufacturing method of circuit board using the same
08/14/2003US20030153169 Process for manufacturing copper foil on a metal carrier substrate
08/14/2003US20030153160 Ball grid array package for enhanced stress tolerance
08/14/2003US20030153133 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153132 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153131 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
08/14/2003US20030153124 Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus
08/14/2003US20030153120 Method for producing a contactless chip card using transfer paper
08/14/2003US20030152863 Photostructured paste
08/14/2003US20030151905 Electrical connections within substrates
08/14/2003US20030151902 Flexible printed circuit board
08/14/2003US20030151650 Droplet ejection apparatus, a pattern formation apparatus, a wiring formation apparatus, a pattern formation medium, a droplet ejection method, a patterning method and a wiring formation method
08/14/2003US20030151477 High-frequency module and its manufacturing method
08/14/2003US20030151471 Multilayer ceramic device
08/14/2003US20030151147 Electrical assembly with vertical multiple layer structure
08/14/2003US20030151146 Vertical electronic circuit package and method of fabrication therefor
08/14/2003US20030151141 External connection terminal and semiconductor device
08/14/2003US20030151139 Semiconductor device
08/14/2003US20030151138 Circuit arrangement with a programmable memory element on a circuit board, with security against reprogramming
08/14/2003US20030151137 Semiconductor device
08/14/2003US20030151135 Circuit device and manufacturing method of circuit device
08/14/2003US20030151067 Wiring circuit substrate and manufacturing method therefor
08/14/2003US20030151032 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
08/14/2003US20030150840 For etching a nickel-chromium alloy, comprising: hydrochloric acid and thiourea.
08/14/2003US20030150743 Divalent tin ions; acid or complexing agent that forms a water-soluble salt or complex with the tin; one or more metals selected from elements of Groups IB to VB of the fourth to sixth periods
08/14/2003US20030150742 Copper is plated on the printed wiring board from a bath containing nickel and copper, followed by plating nickel from the same bath
08/14/2003US20030150738 High efficiency plating apparatus and method
08/14/2003US20030150737 Illuminating an inorganic negative tone resist layer on an electroplating base layer by a beam (EB), which is able to cure the resist to a pattern; removing non-illuminated portions and electroplating between cured layers
08/14/2003US20030150645 Method and apparatus for coupling a microelectronic device package to a circuit board
08/14/2003US20030150644 Printed wiring board and method of manufacturing the same
08/14/2003US20030150642 Electromagnetic bus coupling
08/14/2003US20030150641 Multilayer package for a semiconductor device
08/14/2003US20030150634 Undetachable electrical and mechnical connection, contact element for an undetachable electrical and mechanical connection, and method of producing such an electrical and mechanical connection
08/14/2003US20030150381 Apparatus for the spray treatment of printed circuit boards
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