| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/26/2003 | US20030118797 Structure for multi-layer conductive via and circuit and method for making same |
| 06/26/2003 | US20030118743 Nanostructured and nanoporous film compositions, structures, and methods for making the same |
| 06/26/2003 | US20030118742 Method for enhancing the solderability of a surface |
| 06/26/2003 | US20030118738 Sustains surface flattening method by employing participation of porous materials such as zeolites, zeolite like, mesoporous and mesoporous composites; planarized substrate comprises ceramic substrate, buffer layer, nanostructure layer |
| 06/26/2003 | US20030118481 Sintered textured channel; heat conductive detector |
| 06/26/2003 | US20030117787 Method and apparatus for EMI shielding |
| 06/26/2003 | US20030117784 Circuit board device and mounting method therefor |
| 06/26/2003 | US20030117780 Apparatus having contacts made from carbon tracks and method of producing them |
| 06/26/2003 | US20030117459 Ejecting ink using shape memory alloys |
| 06/26/2003 | US20030116868 Method and apparatus for encoding information in an ic package |
| 06/26/2003 | US20030116863 Bonding strength between semiconductor chip and support; microstructure circuits |
| 06/26/2003 | US20030116860 Using low melting solder; contacting electroconductive substrate; forming soldered joints |
| 06/26/2003 | US20030116857 Circuit substrate and method for fabricating the same |
| 06/26/2003 | US20030116856 Resistive vias for controlling impedance and terminating I/O signals at the package level |
| 06/26/2003 | US20030116844 High-frequency signal amplification device and method for manufacturing the same |
| 06/26/2003 | US20030116843 Semiconductor device package and method of production and semiconductor device of same |
| 06/26/2003 | US20030116776 Substrate stack |
| 06/26/2003 | US20030116756 Conductive adhesive and packaging structure using the same |
| 06/26/2003 | US20030116544 Method for processing ceramic green sheet and laser beam machine used therefor |
| 06/26/2003 | US20030116439 Electroless deposition of barrier material; forming aperture pattern by photolithography |
| 06/26/2003 | US20030116428 Apparatus for cleaning residual material from an article |
| 06/26/2003 | US20030116352 Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly |
| 06/26/2003 | US20030116351 Method of making an interposer sub-assembly in a printed wiring board |
| 06/26/2003 | US20030116350 Flexible wiring boards and manufacturing processes thereof |
| 06/26/2003 | US20030116348 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| 06/26/2003 | US20030116346 Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine |
| 06/26/2003 | US20030116345 Printed wiring board and method for producing the same |
| 06/26/2003 | US20030116344 Built-in unit for a transmission control of a motor vehicle |
| 06/26/2003 | US20030116343 Flexible printed wiring board |
| 06/26/2003 | US20030116276 Methods of roughening a ceramic surface |
| 06/26/2003 | US20030116173 Electrolysis cleaning using aqueous solution of tetramethylammonium hydroxide |
| 06/26/2003 | US20030115752 Method of making an interposer with contact structures |
| 06/26/2003 | US20030115749 Inductive heating of microelectronic components |
| 06/25/2003 | EP1322146A1 Method of electroplating solder bumps on an organic circuit board |
| 06/25/2003 | EP1322145A2 Process for etching a conductive layer |
| 06/25/2003 | EP1322001A1 Connector, electronic equipment and control method for electronic equipment |
| 06/25/2003 | EP1321998A1 Waveguide-microstrip transition and application to HF circuit |
| 06/25/2003 | EP1321983A2 Wiring board and semiconductor device |
| 06/25/2003 | EP1321980A1 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/25/2003 | EP1321978A2 Contact structure |
| 06/25/2003 | EP1321483A1 3,4-alkylenedioxythiophene compounds and polymers thereof |
| 06/25/2003 | EP1321215A2 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board |
| 06/25/2003 | EP1320881A1 Method of securing solder balls and any components fixed to one and the same side of a substrate |
| 06/25/2003 | EP1320863A1 Lamp base comprising an electronic component and a method for producing a lamp base |
| 06/25/2003 | EP0900132B1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets |
| 06/25/2003 | EP0620259B1 Epoxy/polyester hot melt compositions |
| 06/25/2003 | CN2558189Y Automatic inserting in and drawing out device |
| 06/25/2003 | CN2557536Y Improved circuit board electroplating device |
| 06/25/2003 | CN1426272A Hand mounting equipment and method for electronic part |
| 06/25/2003 | CN1426271A Circuit board device and its mounting method |
| 06/25/2003 | CN1425559A Polyimide metal laminated plate and its producing method |
| 06/25/2003 | CN1425531A Laser processor |
| 06/25/2003 | CN1112723C Mounting structure and mounting process for semiconductor device |
| 06/25/2003 | CN1112703C Static memory device having compatibility with disk drive in electronic apparatus |
| 06/25/2003 | CN1112602C Low temperature metalization process of preparing thick film photoetching glue |
| 06/25/2003 | CN1112273C Soldering flux jetting device and soldering method |
| 06/24/2003 | US6584608 Interactive designing process and system of a printed circuit board pattern |
| 06/24/2003 | US6583990 Flexible circuit board and connect structure thereof |
| 06/24/2003 | US6583849 Controlled temperature preventing voids and excessive bridging density |
| 06/24/2003 | US6583843 LCD module |
| 06/24/2003 | US6583834 Adhesive, liquid crystal device, process for manufacturing liquid crystal device, and electronic equipment |
| 06/24/2003 | US6583703 Electrical apparatus having an electromagnetic device operable at multiple inductance values |
| 06/24/2003 | US6583677 Oscillator and an oscillator characteristic adjustment method |
| 06/24/2003 | US6583542 Device for mounting a light source |
| 06/24/2003 | US6583517 Method and structure for joining two substrates with a low melt solder joint |
| 06/24/2003 | US6583515 Ball grid array package for enhanced stress tolerance |
| 06/24/2003 | US6583513 Integrated circuit package with an IC chip and pads that dissipate heat away from the chip |
| 06/24/2003 | US6583500 Thin tin preplated semiconductor leadframes |
| 06/24/2003 | US6583499 Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package |
| 06/24/2003 | US6583447 Multiple LED chip package |
| 06/24/2003 | US6583402 Semiconductor parts and semiconductor mounting apparatus |
| 06/24/2003 | US6583385 Method for soldering surface mount components to a substrate using a laser |
| 06/24/2003 | US6583381 Precision controlling energy beam during material removal or tranfer |
| 06/24/2003 | US6583380 Device and method for marking copper-clad laminates |
| 06/24/2003 | US6583366 Substrate having pins |
| 06/24/2003 | US6583364 Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
| 06/24/2003 | US6583354 Method of reforming reformable members of an electronic package and the resultant electronic package |
| 06/24/2003 | US6583201 Polymeric resin, a conductive filler, a curing agent, an optional (reactive) diluent, and as corrosion inhibitor, one of 6-hydroxyquinoline, 2-hydroxyquinoline or piperidene to improve contact resistance in harsh conditions |
| 06/24/2003 | US6583073 Drying process for woven glass fabric intended for use as a reinforcing laminate in printed circuit boards |
| 06/24/2003 | US6583040 Method of making a pillar in a laminated structure for a semiconductor chip assembly |
| 06/24/2003 | US6583035 Semiconductor package with a controlled impedance bus and method of forming same |
| 06/24/2003 | US6583019 Perimeter anchored thick film pad |
| 06/24/2003 | US6582989 Photolithographically-patterned out-of-plane coil structures and method of making |
| 06/24/2003 | US6582887 Electrically conductive patterns, antennas and methods of manufacture |
| 06/24/2003 | US6582876 Thermal transfer element and process for forming organic electroluminescent devices |
| 06/24/2003 | US6582767 Microstamping pattern of alkanethiol to surface; surface treating silicon polymer with aqueous solution of metal salt; electroless deposition |
| 06/24/2003 | US6582616 Method for preparing ball grid array board |
| 06/24/2003 | US6582581 Comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement. |
| 06/24/2003 | US6582578 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 06/24/2003 | US6582541 Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device |
| 06/24/2003 | US6582371 Ultrasound probe wiring method and apparatus |
| 06/24/2003 | US6582240 Connector jack attaching structure and electronic camera |
| 06/24/2003 | US6582238 Printed circuit board with ground corner regions |
| 06/24/2003 | US6581821 Electronic package interconnect structure comprising lead-free solders |
| 06/24/2003 | US6581282 Apparatus for mounting electronic components |
| 06/24/2003 | US6581281 Component alignment methods |
| 06/24/2003 | US6581280 Method for filling high aspect ratio via holes in electronic substrates |
| 06/24/2003 | US6581278 Process and support carrier for flexible substrates |
| 06/24/2003 | US6581276 Fine-pitch flexible connector, and method for making same |
| 06/24/2003 | US6581274 Apparatus for configuring and inserting component leads into printed-circuit boards |