| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/03/2003 | US20030121146 Method for fabricating electrical connecting elements, and connecting element |
| 07/02/2003 | EP1324646A2 Jumper chip component and mounting structure therefor |
| 07/02/2003 | EP1324389A2 Semiconductor component in a chip format and method for the production thereof |
| 07/02/2003 | EP1324384A2 Via filling method |
| 07/02/2003 | EP1324135A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 07/02/2003 | EP1324087A1 Mounting opto-electric modules on circuit boards |
| 07/02/2003 | EP1323850A1 Electroplating method of printed circuit with pulsed current density |
| 07/02/2003 | EP1323589A1 Heating or cooling device for a vehicle with flexible flat cable |
| 07/02/2003 | EP1323341A1 Methods of manufacturing a printed circuit board shielded against interfering radiation |
| 07/02/2003 | EP1322994A1 Connection method |
| 07/02/2003 | EP1322967A1 Module for a testing device for testing printed circuit boards |
| 07/02/2003 | EP1322798A1 Bath and method of electroless plating of silver on metal surfaces |
| 07/02/2003 | EP1322432A2 Process for treating adhesion promoted metal surfaces |
| 07/02/2003 | EP1214171A4 Excimer laser ablation process control of multilaminate materials |
| 07/02/2003 | EP1147070A4 Electrically conductive ceramics |
| 07/02/2003 | EP1015669A4 Article, method, and apparatus for electrochemical fabrication |
| 07/02/2003 | EP1011973B1 Viewing and imaging systems |
| 07/02/2003 | CN2559183Y Cooling device of soldering machine |
| 07/02/2003 | CN2559100Y Ceramic substrate of assembly module |
| 07/02/2003 | CN1428069A Double-sided wiring board and its mfg. method |
| 07/02/2003 | CN1428006A Electronic module having 3-D array of carrier-mounted IC packages |
| 07/02/2003 | CN1427902A Electrical contacting element made of elastic material |
| 07/02/2003 | CN1427668A Guide hole filling method |
| 07/02/2003 | CN1427667A Application method of outer lead pin joining backfold welding heat insulating material |
| 07/02/2003 | CN1427666A Local welding method for printed substrate and apparatus thereof |
| 07/02/2003 | CN1427664A Screen printing method and device |
| 07/02/2003 | CN1427663A Heat transfer substrate and method for mfg. same |
| 07/02/2003 | CN1427662A Flexible distributing board |
| 07/02/2003 | CN1427661A Manufacturing method of printed circuit board having stepped high density interconnection structure |
| 07/02/2003 | CN1427469A Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure |
| 07/02/2003 | CN1427094A Electroplating method |
| 07/02/2003 | CN1427038A Aqueous polyaminoresin composition |
| 07/02/2003 | CN1427035A Paste for connecting circuit, anisotropic conducting paste and application thereof |
| 07/02/2003 | CN1113588C Method of mounting surface of SIL hybric circuit |
| 07/02/2003 | CN1113587C 印刷电路板 A printed circuit board |
| 07/02/2003 | CN1113586C Conductive elastomer for grafting to elastic substrate |
| 07/02/2003 | CN1113585C Printed circuit board and mfg. method thereof |
| 07/02/2003 | CN1113418C Battery connector for printed circuit boards |
| 07/01/2003 | US6587580 Stencil printing process optimization for circuit pack assembly using neural network modeling |
| 07/01/2003 | US6587351 Surface mount standoff for printed circuit board assembly |
| 07/01/2003 | US6587310 Magnetic head suspension with single layer preshaped trace interconnect |
| 07/01/2003 | US6587177 Connection structure of display device with a plurality of IC chips mounted thereon and wiring board |
| 07/01/2003 | US6586873 Display panel module with improved bonding structure and method of forming the same |
| 07/01/2003 | US6586830 Semiconductor device with an interposer |
| 07/01/2003 | US6586827 Wiring board and method for fabricating the same |
| 07/01/2003 | US6586826 Integrated circuit package having posts for connection to other packages and substrates |
| 07/01/2003 | US6586783 Substrate for an electronic power circuit, and an electronic power module using such a substrate |
| 07/01/2003 | US6586703 Laser machining method, laser machining apparatus, and its control method |
| 07/01/2003 | US6586687 Printed wiring board with high density inner layer structure |
| 07/01/2003 | US6586686 Multilayer printed wiring board and method for manufacturing the same |
| 07/01/2003 | US6586685 Bump electrode and printed circuit board |
| 07/01/2003 | US6586684 Circuit housing clamp and method of manufacture therefor |
| 07/01/2003 | US6586683 Printed circuit board with mixed metallurgy pads and method of fabrication |
| 07/01/2003 | US6586682 Printed wiring board with controlled line impedance |
| 07/01/2003 | US6586526 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof |
| 07/01/2003 | US6586275 Wafer level package and method for manufacturing the same |
| 07/01/2003 | US6586274 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument |
| 07/01/2003 | US6586155 Forming electroconductive film pattern |
| 07/01/2003 | US6586153 Multilayer devices formed by multilayer thermal transfer |
| 07/01/2003 | US6586105 Sealed with silicon gel |
| 07/01/2003 | US6586081 Polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, high strength |
| 07/01/2003 | US6585904 Method for the manufacture of printed circuit boards with plated resistors |
| 07/01/2003 | US6585903 Electrical circuit board and a method for making the same |
| 07/01/2003 | US6585877 Acid resistance; waterproof |
| 07/01/2003 | US6585876 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles |
| 07/01/2003 | US6585865 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
| 07/01/2003 | US6585837 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board |
| 07/01/2003 | US6585836 Flat cable and a manufacturing method thereof |
| 07/01/2003 | US6585150 Complexing tin oxide with dicarboxylic acid imparting oxidation resistance |
| 07/01/2003 | US6585149 Packaging method using lead-free solder |
| 07/01/2003 | US6585024 Positioning target for laminated printed circuit board |
| 07/01/2003 | US6584905 Plated through-hole ignitor for detonation cord or shock tube |
| 07/01/2003 | US6584897 Method and stencil for extruding material on a substrate |
| 07/01/2003 | US6584820 Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same |
| 07/01/2003 | US6584684 Applying polymer containing ionized metallic particles; exposing to electric field growing dendrites forming electro-conductive path and metallurgical bond; setting polymer for structural reinforcement and electrical insulation |
| 07/01/2003 | US6584682 Method for making circuit board |
| 06/26/2003 | WO2003053117A1 Layered circuit boards and methods of production thereof |
| 06/26/2003 | WO2003053115A1 An electronic assembly and a method for manufacturing the same |
| 06/26/2003 | WO2003053114A1 Epoxy washer for retention of inverted smt components |
| 06/26/2003 | WO2003053101A1 Flexible electric circuit for heating comprising a metallised fabric |
| 06/26/2003 | WO2003052876A2 Method and apparatus for connecting circuit boards for a sensor assembly |
| 06/26/2003 | WO2003052875A1 Assembly and connecting technique in textile structures |
| 06/26/2003 | WO2003052822A2 Method for making a non-detachable microcircuit card |
| 06/26/2003 | WO2003052821A1 Microfluidic analytical apparatus |
| 06/26/2003 | WO2003052809A1 Method for production of dielectric layers using polyfunctional carbosilanes |
| 06/26/2003 | WO2003052798A2 Method for improving electromigration performance of metallization features through multiple depositions of binary alloys |
| 06/26/2003 | WO2003051964A1 Prepreg production method and prepreg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method |
| 06/26/2003 | WO2003051628A1 Composite resin molding and process for producing the same |
| 06/26/2003 | WO2003051626A1 Multi-layeres with vias in filled holes |
| 06/26/2003 | WO2003051545A1 Printed circuit board recycle method and apparatus thereof |
| 06/26/2003 | WO2003024711A3 Method for producing a ceramic substrate and ceramic substrate |
| 06/26/2003 | US20030119948 A slurry comprising a dispersed fibers for improving the cured coatings resist to chipping; automotive refinishing |
| 06/26/2003 | US20030119370 Solder mask configuration for a printed circuit board of a modular jack |
| 06/26/2003 | US20030119357 Cpu socket connector |
| 06/26/2003 | US20030119340 Clip-type lead frame for electrically connecting two substrates or devices |
| 06/26/2003 | US20030119299 Methods of ball grid array |
| 06/26/2003 | US20030119298 Semiconductor device, a method of manufacturing the same and an electronic device |
| 06/26/2003 | US20030119296 Semiconductor device and manufacturing method for the same |
| 06/26/2003 | US20030118947 System and method for selective deposition of precursor material |
| 06/26/2003 | US20030118842 Sintered compact; low dielectric; high thermal expansion |