Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2003
05/30/2003WO2003043945A1 Biomedical electrochemical sensor array and method of fabrication
05/30/2003WO2003043747A2 Manufacture having double sided features in a metal-containing web formed by etching
05/30/2003WO2003004717A3 Partition plate and method for producing a partition plate for a multi-layer pressed stack
05/30/2003WO2002093649A3 Electronic module and method for assembling same
05/30/2003CA2467716A1 Manufacture having double sided features in a metal-containing web formed by etching
05/30/2003CA2467024A1 Method of producing coating composition and coating composition made therefrom
05/29/2003US20030101418 Process for designing high frequency circuits in multiple domains
05/29/2003US20030101231 Caching dynamic web documents
05/29/2003US20030100654 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
05/29/2003US20030100456 Entry sheet for drilling and method for drilling hole
05/29/2003US20030100287 Radiocommunication module in the form of an electronic macro-component , corresponding interface structure and transfer method onto a motherboard
05/29/2003US20030100212 Method and structure for tape ball grid array package
05/29/2003US20030100200 Buried solder bumps for AC-coupled microelectronic interconnects
05/29/2003US20030100197 Edge-plated well for circuit board components
05/29/2003US20030100146 Method of fabricating multilayer ceramic substrate
05/29/2003US20030100145 Metal plated spring structure
05/29/2003US20030099836 Thermal management device and method of making such a device
05/29/2003US20030099818 Abrasion resistant electrode and device
05/29/2003US20030099768 Method for selectively applying solder mask
05/29/2003US20030099767 Bumping process for chip scale packaging
05/29/2003US20030099737 Forming tool for forming a contoured microelectronic spring mold
05/29/2003US20030099524 Nut with threaded blind hole
05/29/2003US20030099099 Printed wiring board having connecting terminals for electrically connecting conductor layers, circuit module having printed wiring board, and manufacturing method for printed wiring board
05/29/2003US20030099097 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
05/29/2003US20030098750 Oscillator module and electronic apparatus using the same
05/29/2003US20030098703 Methods of testing integrated circuitry
05/29/2003US20030098514 Packages for semiconductor die
05/29/2003US20030098505 Semiconductor module
05/29/2003US20030098504 Semiconductor memory module having double-sided stacked memory chip layout
05/29/2003US20030098500 180 degree bump placement layout for an integrated circuit power grid
05/29/2003US20030098499 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pad, semiconductor device components including same, and methods for fabricating same
05/29/2003US20030098472 High-frequency module
05/29/2003US20030098470 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
05/29/2003US20030098342 Method for connecting conductive members
05/29/2003US20030098339 Connecting structure of printed circuit boards
05/29/2003US20030098179 Multi-layer wiring board and method of producing same
05/29/2003US20030098178 Printed circuit board having test points formed on sides thereof
05/29/2003US20030098177 Multi-layer circuit board
05/29/2003US20030097941 Method and apparatus for dispensing material in a printer
05/29/2003US20030097750 Manufacturing method of electronic circuit including multilayer circuit board
05/28/2003EP1315407A2 Dielectric structure
05/28/2003EP1315305A1 multiband high-frequency switching module
05/28/2003EP1315207A2 Semiconductor module
05/28/2003EP1315205A1 Power module and power module with heat sink
05/28/2003EP1314342A1 Method, apparatus and use of applying viscous medium on a substrate
05/28/2003EP1314341A1 Collective method for flush filling of through holes in a substrate
05/28/2003EP1314200A2 Hybrid substrate with embedded capacitors and methods of manufacture
05/28/2003EP1314196A1 Method for making an integrated circuit capable of being surface-mounted and resulting circuit
05/28/2003EP1314172A1 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly
05/28/2003EP1314169A1 Circuit board protection system and method
05/28/2003EP1212583B1 Device for inspecting a three-dimensional surface structure
05/28/2003EP1192047B1 Wiper blades for screen printing
05/28/2003EP1141104B1 Heat debondable adhesive composition and adhesion structure
05/28/2003EP1066209B1 Device for treating plate-shaped work pieces, especially printed-circuit boards
05/28/2003DE20300626U1 Chip card for Light Emitting Diode has heat bridges between top mounting surface and cooling baseplate and has central mounting for Light Emitting Diode
05/28/2003CN2553162Y Fixing rivet for crimping circuit board with improved structure
05/28/2003CN1420998A Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with same
05/28/2003CN1420905A Impregnated glass fiber strands and products including same
05/28/2003CN1420904A Composite of powdered fillers and polymer matrix and process for preparing them
05/28/2003CN1420898A Resins curable with actinic radiation, process for production thereof, and photo- and thermo-setting resin composition
05/28/2003CN1420719A Electronic element installing method
05/28/2003CN1420717A Copper tin displacement method of PC board
05/28/2003CN1420715A Insulation sheet, multilayer wiring base board and mfg. method thereof
05/28/2003CN1420714A Thin circuit board and method for mfg. same
05/28/2003CN1420637A Passive device and module of transceiver
05/28/2003CN1420589A Press fit bus for distribution
05/28/2003CN1420537A Method and device for mfg. parts after installation of electronic element
05/28/2003CN1420392A Optical amplification regulating system and projection exposure apparatus
05/28/2003CN1420150A Adhesive for connection of circuit
05/28/2003CN1420070A High-speed constant-volume discharging distributor head capable of precisely controlling up-and -down motion and rotating of poston
05/28/2003CN1110232C Apparatus and method for stability enhancement of molten solder droplets as ejected
05/28/2003CN1110231C Method for producing circuit substrate
05/28/2003CN1110088C Improved PTFE thin film chip carrier
05/28/2003CN1110087C Clamp assembly for retention of fragile conductive trace with protective clamp
05/28/2003CN1110080C Process for providing metal wire in IC
05/28/2003CN1110079C Electronic part device
05/28/2003CN1110078C Method for mounting semiconductor element
05/28/2003CN1110072C Method for forming bump electrode of semiconductor device
05/28/2003CN1110063C Substrate with solder alloy for assembling electronic component
05/27/2003US6571007 Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method
05/27/2003US6570775 Circuit board assembly having a compact structure
05/27/2003US6570773 Control apparatus for an automobile
05/27/2003US6570771 Single-piece molded module housing
05/27/2003US6570484 Mounting structure for thermistor with positive resistance-to-temperature characteristic
05/27/2003US6570469 Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips
05/27/2003US6570280 Solder-bonding structure and brushless motor having the same
05/27/2003US6570271 Apparatus for routing signals
05/27/2003US6570263 All the plated wires utilizing the coverage of the solder mask can be entirely cut without the pulling problem from the cutter.
05/27/2003US6570262 Mother substrate and electronic component utilizing the mother substrate
05/27/2003US6570188 Optoelectronic component for data transmission
05/27/2003US6570102 Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
05/27/2003US6570100 Pad structure of semiconductor package
05/27/2003US6570099 Thermal conductive substrate and the method for manufacturing the same
05/27/2003US6570098 Printed wiring board and method for producing the same
05/27/2003US6569753 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
05/27/2003US6569712 Structure of a ball-grid array package substrate and processes for producing thereof
05/27/2003US6569708 Repairable flip chip semiconductor device with excellent packaging reliability and method of manufacturing same
05/27/2003US6569604 Blind via formation in a photoimageable dielectric material
05/27/2003US6569543 Copper foil with low profile bond enahncement
05/27/2003US6569514 Ceramic circuit board and method of manufacturing the same
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