Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2003
08/07/2003US20030146421 Addition-condensation copolymer containing aromatic polyethers
08/07/2003US20030146266 Conductive adhesive material with metallurgically-bonded conductive particles
08/07/2003US20030146196 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
08/07/2003US20030146101 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness
08/07/2003US20030146020 Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
08/07/2003US20030146019 Board and ink used for forming conductive pattern, and method using thereof
08/07/2003US20030146018 System and method for repairing flex circuits
08/07/2003US20030146017 A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH RELIABILITY APPLICATIONS
08/07/2003US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer
08/07/2003US20030145948 Method of fixing eletronic part
08/07/2003US20030145947 Semiconductor device, method of manufacturing the same, manufacturing apparatus for the same, and electronic instrument
08/07/2003US20030145940 Using a cured silicone; plasma treatment
08/07/2003US20030145460 Standoff arrangements to control distance and provide electrical function
08/07/2003US20030145458 Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby
08/07/2003DE10209617C1 Laser processing method, for rapidly boring holes in dielectric substrates, comprises deviating a laser beam produced by a carbon dioxide laser onto the substrate to be processed using a deviating unit
08/07/2003CA2473982A1 Machine for continuously producing plastic laminates in a cold press
08/06/2003EP1333709A2 Supporting device for discrete electric component
08/06/2003EP1333708A1 CIRCUIT BOARD, CIRCUIT BOARD−USE MEMBER AND PRODUCTION METHOD THEREFOR AND METHOD OF LAMINATING FEXIBLE FILM
08/06/2003EP1333532A2 Electrical connector with terminal tail aligning device
08/06/2003EP1333481A1 Process and device for soldering leads on substrates
08/06/2003EP1333461A2 Method of manufacturing plasma display device
08/06/2003EP1333079A1 Conductive adhesive material with metallurgically-bonded conductive particles
08/06/2003EP1332867A1 Film with multilayered metal and process for producing the same
08/06/2003EP1332830A1 Lead pin with Au-Ge based brazing material
08/06/2003EP1332800A1 Coating device for electric or electronic circuit boards, coating method using this device, and electric or electronic circuit board coated by this method
08/06/2003EP1332654A2 Methods of positioning components using liquid prime movers and related structures
08/06/2003EP1332653A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
08/06/2003EP1332244A1 Method for enhancing the solderability of a surface
08/06/2003EP1332238A1 Metallized film, method for the production thereof, and its use
08/06/2003EP1155602B1 Electrical connection method and connection site
08/06/2003EP1147694B1 Electronic module
08/06/2003EP1115567A4 Resin/copper/metal laminate and method of producing same
08/06/2003EP0898712B1 Wafer-level burn-in and test
08/06/2003CN2565235Y Tin bead placing device
08/06/2003CN2565233Y 印刷电路板 A printed circuit board
08/06/2003CN1434980A Microparticle arrangement film, electrical connection film, electrical connection stracture and microparticle arrangement method
08/06/2003CN1434932A Nonlinear image distortion correction in printed circuit board manufacturing
08/06/2003CN1434919A 光学系统 Optical system
08/06/2003CN1434838A Method of treating epoxy resin-cured product
08/06/2003CN1434833A Photocurable/thermoseting composition for forming matte film
08/06/2003CN1434676A Method for making layer increased circuit board with inner embedded film shape resistor assembly
08/06/2003CN1434675A Method for making stacking type multilayer board with inner embeded film shape resistor element
08/06/2003CN1434674A Method for making multilayer circuit board using preimmersion base material as adhesive layer
08/06/2003CN1434673A Tinol printer capable of being beneficial to tinol actively separating
08/06/2003CN1434672A Multi-layer heap circuit board and making method thereof
08/06/2003CN1434504A Semiconductor device and making method, and printing mask
08/06/2003CN1434498A Flip chip type semiconductor device and making method thereof
08/06/2003CN1434350A Photoreactive resin composition and circuit board and method for making multilayer ceramic base material
08/06/2003CN1434330A LCD device
08/06/2003CN1433851A Dry distillation apparatus for waste treatment
08/06/2003CN1117512C Multilayer printed wiring board and process for producing same
08/06/2003CN1117396C Semiconductor package body and semiconductor module using same
08/06/2003CN1117395C Semiconductor package manufacturing method and semiconductor package
08/06/2003CN1117342C LCD module
08/06/2003CN1116956C Floating device of hot-press welder
08/05/2003US6603670 Supporting device for coupling batteries to circuit board
08/05/2003US6603668 Interlayer structure with multiple insulative layers with different frequency characteristics
08/05/2003US6603667 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic
08/05/2003US6603663 Electronic unit
08/05/2003US6603646 Multi-functional energy conditioner
08/05/2003US6603467 Power up test panel is used to perform the power up test on a LCD panel which greatly simplifies the test and reduces cost. The power up test panel includes a plurality of test electrodes formed on a substrate. The plurality of test
08/05/2003US6603404 Light emitting display device and method of making the same
08/05/2003US6603210 Semiconductor module and producing method therefor
08/05/2003US6603205 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components
08/05/2003US6603202 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same
08/05/2003US6603201 Electronic substrate
08/05/2003US6603079 Printed circuit board electrical interconnects
08/05/2003US6603077 Cable connection structure and electronic apparatus having the same
08/05/2003US6603071 Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board
08/05/2003US6602946 Photosensitive insulating paste and thick film multi-layer circuit substrate
08/05/2003US6602804 Dielectric, polymer blend
08/05/2003US6602777 Method for controlling the formation of intermetallic compounds in solder joints
08/05/2003US6602766 Ultraviolet/electron beam forming process for multi-layer electronic components and products thereof
08/05/2003US6602733 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding
08/05/2003US6602730 Method for gravitation-assisted control of spread of viscous material applied to a substrate
08/05/2003US6602653 Surface oxidation and removal of selected portions forming fine line structures
08/05/2003US6602584 Multilayer; electroconductive plate, dielectric and metal hydroxide adhesive
08/05/2003US6602583 Heat and pressure treating a liquid crystalline polymer film to produce a liquid bond ply and forming circuit by laminiation at a temperature lower than the melt temperature of the bond ply
08/05/2003US6602446 Electrically conductive filler and a heating element adapted to generate heat on electromagnetic induction compounded with resin
08/05/2003US6602440 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
08/05/2003US6602370 Method of manufacturing ceramic electronic components
08/05/2003US6602092 Cable assembly module with compressive connector
08/05/2003US6602078 Electrical interconnect having a multi-layer circuit board structure and including a conductive spacer for impedance matching
08/05/2003US6601963 FPC for mounting components and spread illuminating apparatus using the same
08/05/2003US6601947 Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus
08/05/2003US6601754 Method of connecting circuit boards
08/05/2003US6601752 Electronic part mounting method
08/05/2003US6601297 Method for producing micro-openings
08/05/2003US6601296 Metal conductors supported and mechanically interlocked with substrate
08/05/2003US6601295 Method of producing chip-type electronic devices
08/05/2003US6601292 Method for the connection and repair of flex and other circuits
07/2003
07/31/2003WO2003063568A1 Thermally enhanced interposer and method
07/31/2003WO2003063563A1 Circuit board and electronic device
07/31/2003WO2003063562A2 A method of applying an edge electrode pattern to a touch screen
07/31/2003WO2003063238A1 High-frequency module and its manufacturing method
07/31/2003WO2003063237A1 Substrate for high-frequency module and high-frequency module
07/31/2003WO2003062866A2 Flex board interface to an optical module
07/31/2003WO2003062726A1 Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
07/31/2003WO2003062311A2 Material for the production of functional elements comprising at least one foamable area and use of said functional elements for positioning and mounting objects
07/31/2003WO2003062296A1 Phosphorus-containing urethane (meth)acrylate compounds and photosensitive compositions
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