Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2003
05/27/2003US6569513 Prepreg and process for manufacturing same
05/27/2003US6569512 Solvent dissolves resin at conductive adhesive/electrode interface; resulting higher density of conductive filler leads to lower resistance; resin flow forms fillet around electrode increasing strength
05/27/2003US6569491 Dielectric coating for a circuit board which is adherent to electroless copper; an epoxy dielectric including a solubilized polybutadiene or polyisoprene agent for promoting adhesion
05/27/2003US6569367 Method for manufacturing electronic component
05/27/2003US6569278 Powder metal polymer organic sheet punching for substrate conductors
05/27/2003US6569262 Lead-free solder powder material, lead-free solder paste and a method for preparing same
05/27/2003US6569252 Immersing object in solvent consisting of dipropylene glycol alkyl ether and tripropylene glycol alkyl ether, rinsing
05/27/2003US6569248 Apparatus for selectively applying solder mask
05/27/2003US6568944 Circuit board with increased edge connection capacity
05/27/2003US6568612 Recycling circuit board and plastics by crushing, magnetic sorting, eddy current sorting, and specific gravity sorting
05/27/2003US6568600 Chip card equipped with a loop antenna, and associated micromodule
05/27/2003US6568073 Process for the fabrication of wiring board for electrical tests
05/22/2003WO2003043394A1 Method and device for through-hole plating of substrates and printed circuit boards
05/22/2003WO2003043393A1 Circuit board and its manufacturing method
05/22/2003WO2003043392A1 Method and assembly for producing a printed circuit board
05/22/2003WO2003043391A1 Multilayer flexible fr4 circuit
05/22/2003WO2003043062A1 Method of forming a patterned metal layer
05/22/2003WO2003043035A1 Method of producing a multilayer microelectronic substrate
05/22/2003WO2003041956A1 Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type
05/22/2003WO2003019651A3 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
05/22/2003WO2002054839A3 Layered circuit boards and methods of production thereof
05/22/2003US20030096541 Bus bar structure
05/22/2003US20030096520 Press-fit bus bar distributing power
05/22/2003US20030096519 Microspring with conductive coating deposited on tip after release
05/22/2003US20030096514 Pin grid array integrated circuit connecting device
05/22/2003US20030096513 Pin-grid-array electrical connector
05/22/2003US20030096512 Electrical interconnect device incorporating anisotropically conductive elastomer and flexible circuit
05/22/2003US20030096493 Perimeter anchored thick film pad
05/22/2003US20030096453 Integrated void-free process for assembling a solder bumped chip
05/22/2003US20030096113 Electrophoretic displays using nanoparticles
05/22/2003US20030096089 Substrate for accommodating passive component
05/22/2003US20030096085 Greensheet carriers and processing thereof
05/22/2003US20030096082 Copper alloy foil
05/22/2003US20030096081 Integrated microfluidic, optical and electronic devices and method for manufacturing
05/22/2003US20030095888 Containing Sn, Ag and Bi, with respective concentrations set such that it has a melting temperature lower than the heat-resistant temperature of a work to be soldered.
05/22/2003US20030095759 Optical device package for flip-chip mounting
05/22/2003US20030095392 Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims
05/22/2003US20030095389 Multilayered board comprising folded flexible circuits and method of manufacture
05/22/2003US20030095388 Using a multiple cure system adhesive, such as a B-stage epoxy.
05/22/2003US20030095342 Optical magnification adjustment system and projection exposure device
05/22/2003US20030095339 Projection aligner
05/22/2003US20030095019 Tabless surface mount coaxial dielectric resonator
05/22/2003US20030094961 Apparatus for scan testing printed circuit boards
05/22/2003US20030094707 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
05/22/2003US20030094706 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
05/22/2003US20030094700 Light signal processing system
05/22/2003US20030094697 Circuit substrate and its manufacturing method
05/22/2003US20030094692 Replaceable integrated circuit device
05/22/2003US20030094685 Semiconductor device and module of the same
05/22/2003US20030094666 Interposer
05/22/2003US20030094665 Solid-state imaging apparatus and manufacturing method thereof
05/22/2003US20030094442 Plasma enhanced circuit component attach method and device
05/22/2003US20030094376 Comprises disodium bis(3-sulfopropyl)disulfide; for use on printed wiring board or semiconductor wafer
05/22/2003US20030094307 Multilayer ceramic substrate and method for manufacturing the same
05/22/2003US20030094306 Method and apparatus for supporting a circuit component having solder column interconnects using external support
05/22/2003US20030094305 Pressure-welded structure of flexible circuit boards
05/22/2003US20030094242 Punch die for punching and laminating simultaneously
05/22/2003US20030094232 Method for producing prepreg, preprig, metal-clad laminate and printed wiring board
05/22/2003US20030093899 Copper-clad laminated sheet
05/22/2003US20030093898 Solder resist opening to define a combination pin one indicator and fiducial
05/22/2003US20030093897 Method and apparatus for shock and vibration isolation of a circuit component
05/22/2003DE20304842U1 Magnetic, inductive, or optical sensor for automating technique
05/22/2003DE19928576C2 Oberflächenmontierbares LED-Bauelement mit verbesserter Wärmeabfuhr Surface mount LED device with improved heat dissipation
05/21/2003EP1313357A1 Multi-piece substrate and method of manufacturing the substrate
05/21/2003EP1313356A1 Low impedance/high density connectivity of surface mount components on a printed wiring board
05/21/2003EP1313179A2 Press-fit bus bar for distributing power
05/21/2003EP1313173A2 Pin-grid-array electrical connector
05/21/2003EP1313144A2 Passive devices and modules for transceiver
05/21/2003EP1313143A2 Perimeter anchored thick film pad
05/21/2003EP1313139A1 Device and method for forming bump
05/21/2003EP1313109A2 Surface mount resistor
05/21/2003EP1312930A2 Apparatus for scan testing printed circuit boards
05/21/2003EP1311644A1 Process for improving polymer to metal adhesion
05/21/2003EP1311616A2 Polyarylether-polyetherimide compositions
05/21/2003EP1311586A1 Polyimides for high-frequency applications
05/21/2003EP1201007B1 Antenna for contactless cards, hybrid cards and electronic labels
05/21/2003EP1198624A4 Process for electroplating a work piece coated with an electrically conducting polymer
05/21/2003EP1197130B1 Circuitry with integrated passive components and method for producing same
05/21/2003EP1159467B1 Process for the recovery of tin, tin alloys or lead alloys from printed circuit boards
05/21/2003EP1129050B1 Paste for screenprinting electric structures onto carrier substrates
05/21/2003EP1010108B1 Method and apparatus for channel-routing of an electronic device
05/21/2003EP0996521B1 Apparatus and method for making uniformly sized and shaped spheres
05/21/2003EP0968630B1 Dual track stenciling system with solder gathering head
05/21/2003EP0913075B1 Rectifier set for high voltage device
05/21/2003EP0819055B1 A laminate for sealing capsules
05/21/2003EP0688860B1 Process for producing clean article
05/21/2003CN1419803A Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
05/21/2003CN1419699A System, printed circuit board, charger device, user device, and apparatus
05/21/2003CN1419663A Abbe error correction system and method
05/21/2003CN1419402A Circuit element assembling method
05/21/2003CN1419401A Welding pad for printed icrcuit board and forming method thereof
05/21/2003CN1419287A Device for shielding transmission line to ground or power supply
05/21/2003CN1419273A Process for making multiplayer wire distributed board having film capacitor
05/21/2003CN1418941A Detergent
05/21/2003CN1418921A Process for producing thermo-hardened resin varnish
05/21/2003CN1109484C Method and machine for wave soldering or tinning
05/21/2003CN1109121C Super-thin stainless steel foil
05/21/2003CN1109086C Reactino-type flame-retarding adhesive for flexible PCB and its preparing process
05/21/2003CN1108910C Rubber for thermal pressed cushion and production thereof, and manufacture of thermal pressed cushions and printed circuit boards
05/21/2003CN1108895C Method and apparatus for processing circuit board by laser
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