| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/23/2003 | EP1329144A1 Module support for electrical/electronic components |
| 07/23/2003 | EP1329143A2 Carrier-based electronic module |
| 07/23/2003 | EP1329141A2 Fine featured moldings of liquid crystalline polymers |
| 07/23/2003 | EP1329002A2 Surface mount connector lead |
| 07/23/2003 | EP1328899A1 Method for producing a transponder coil |
| 07/23/2003 | EP1328605A1 Hydrophobic composition and use on a substrate for preventing ice formation and corrosion |
| 07/23/2003 | EP1328373A2 Method and materials for printing particle-enhanced electrical contacts |
| 07/23/2003 | EP1268643A4 Screen printable flame retardant coating |
| 07/23/2003 | EP1012858B1 Through-hole interconnect device with isolated wire-leads and component barriers |
| 07/23/2003 | EP0644227B1 Solid surface modifying method and apparatus |
| 07/23/2003 | CN2562540Y Drying rack of circuit board |
| 07/23/2003 | CN2562378Y Battery seats |
| 07/23/2003 | CN1432211A Appts. and method for reducing electromigration |
| 07/23/2003 | CN1432195A Semiconductor component comprising surface metallization |
| 07/23/2003 | CN1432182A Method for producing tag or chip card device for implementing said method and tag or chip carp produced according to said method |
| 07/23/2003 | CN1432141A Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board |
| 07/23/2003 | CN1432072A Method for producing three-dimensional, selectively metallized parts and three-dimensional, selectively metallied part |
| 07/23/2003 | CN1431939A Process for improving adhesion of polymeric materials to metal surfaces |
| 07/23/2003 | CN1431860A Method for installing electronic components in electronic device |
| 07/23/2003 | CN1431859A Silk screen printing method and silk-screen printing equipment |
| 07/23/2003 | CN1431858A Printed circuit board with built-in passive device, its mfg. method and used substrate |
| 07/23/2003 | CN1431857A Printed circuit board, radio wave receiving converter and antenna device |
| 07/23/2003 | CN1431667A Mfg. method of laminated ceramic electronic parts |
| 07/23/2003 | CN1115740C Microwave oscilator and its mfg. method |
| 07/23/2003 | CN1115654C Resonant tag and method and appts. of mfg. same |
| 07/23/2003 | CN1115210C Method for separating metal material from waste printed circuit board and method of separating electronic component |
| 07/23/2003 | CN1115189C Method of separating organic solutions when preparing printed circcuit board |
| 07/23/2003 | CA2417025A1 Switch assembly employing an external customizing printed circuit board |
| 07/22/2003 | US6598208 Design and assisting system and method using electromagnetic position |
| 07/22/2003 | US6597757 Marking apparatus used in a process for producing multi-layered printed circuit board |
| 07/22/2003 | US6597597 Low temperature attaching process for MRAM components |
| 07/22/2003 | US6597585 Power semiconductor module |
| 07/22/2003 | US6597583 Multilayer circuit board having a capacitor and process for manufacturing same |
| 07/22/2003 | US6597444 Determination of flux coverage |
| 07/22/2003 | US6597432 Board-stage for an aligner |
| 07/22/2003 | US6597416 Display panel with supporting member having recess for elastic connector |
| 07/22/2003 | US6597277 Termination resistor in printed circuit board |
| 07/22/2003 | US6597069 Flip chip metallization |
| 07/22/2003 | US6597061 Card manufacturing technique and resulting card |
| 07/22/2003 | US6597058 Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| 07/22/2003 | US6596968 Method of producing through-hole in aromatic polyimide film |
| 07/22/2003 | US6596964 Method of attaching a component to a connection support by welding without the addition of material |
| 07/22/2003 | US6596948 Processor and power supply circuit |
| 07/22/2003 | US6596947 Low melting metal coating; pressing, heating, and softening films to adhere; connecting with ultrasonic wave |
| 07/22/2003 | US6596937 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 07/22/2003 | US6596634 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument |
| 07/22/2003 | US6596621 Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate |
| 07/22/2003 | US6596620 BGA substrate via structure |
| 07/22/2003 | US6596618 Increased solder-bump height for improved flip-chip bonding and reliability |
| 07/22/2003 | US6596566 Conformal-coated pick and place compatible devices |
| 07/22/2003 | US6596469 Using a heat sensitive coating of a polymer where aqueous developer solubility of the composition is not increased by incident UV radiation but is increased by delivery of heat |
| 07/22/2003 | US6596406 Wiring board prepreg and manufacturing method thereof |
| 07/22/2003 | US6596405 Antireflective porogens |
| 07/22/2003 | US6596391 Very ultra thin conductor layers for printed wiring boards |
| 07/22/2003 | US6596384 Selectively roughening conductors for high frequency printed wiring boards |
| 07/22/2003 | US6596382 Multilayered board and method for fabricating the same |
| 07/22/2003 | US6596381 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
| 07/22/2003 | US6596346 Activating the surface of polysiloxane or polycarbosilane stamp by oxygen plasma or photoactive crosslinker, reacting activated surface with a hydrophilic polymer |
| 07/22/2003 | US6596200 Electronic material composition, electronic parts and use of electronic material composition |
| 07/22/2003 | US6596184 Non-homogeneous laminate materials for suspensions with conductor support blocks |
| 07/22/2003 | US6596094 Solder alloy particle scattered or mixed in the flux including Sn and Zn; metal particle scattered or mixed in the flux and including an element in the IB group |
| 07/22/2003 | US6595788 Electrical connector with continuous strip contacts |
| 07/22/2003 | US6595787 Low cost integrated out-of-plane micro-device structures and method of making |
| 07/22/2003 | US6595786 Electrical connecting structure of mounted part, computer apparatus, and electronic equipment |
| 07/22/2003 | US6595785 Bump contact force concentration system and method |
| 07/22/2003 | US6595784 Interposer member having apertures for relieving stress and increasing contact compliancy |
| 07/22/2003 | US6595408 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
| 07/22/2003 | US6595405 Connection structure and method for connecting printed circuit and metal terminal, and reinforcing structure and method for reinforcing junction therebetween |
| 07/22/2003 | US6595404 Method of producing electronic part with bumps and method of producing electronic part |
| 07/22/2003 | US6595136 Method for displacing an article during screening |
| 07/22/2003 | US6595134 Device to produce electronic circuits |
| 07/22/2003 | US6594893 Method of making surface laminar circuit board |
| 07/22/2003 | US6594892 Process for the production of composite ceramic printed wiring board |
| 07/22/2003 | US6594891 Process for forming multi-layer electronic structures |
| 07/17/2003 | WO2003059032A1 Shaped solder pad |
| 07/17/2003 | WO2003059028A2 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
| 07/17/2003 | WO2003059027A1 System for producing electrical and integrated circuits |
| 07/17/2003 | WO2003059026A1 System for the manufacture of electric and integrated circuits |
| 07/17/2003 | WO2003058752A1 Grouped element transmission channel link with power delivery aspects |
| 07/17/2003 | WO2003058751A1 Grouped element transmission channel link termination assemblies |
| 07/17/2003 | WO2003058750A1 Grouped element transmission channel link |
| 07/17/2003 | WO2003058719A1 Monolithic interconnection interface for the stacking of electronic components and the production method thereof |
| 07/17/2003 | WO2003058704A1 Method for producing a protection for chip edges and system for the protection of chip edges |
| 07/17/2003 | WO2003058677A2 System for the production of electric and integrated circuits |
| 07/17/2003 | WO2003057647A1 Methods of roughening a ceramic surface |
| 07/17/2003 | WO2003057493A1 Stencil wiping blade assembly with solder paste deflector |
| 07/17/2003 | WO2003057393A1 Lubricant sheet and method of forming the same |
| 07/17/2003 | WO2002055762A3 Electrochemical co-deposition of metals for electronic device manufacture |
| 07/17/2003 | WO2002050949A9 Integrated dual function circuitry and antenna system |
| 07/17/2003 | WO2002039463A3 Methods and system for attaching substrates using solder structures |
| 07/17/2003 | US20030135296 Communications interface for assembly-line monitoring and control |
| 07/17/2003 | US20030134768 Cleaning solvent and dispenser |
| 07/17/2003 | US20030134767 A liquid cleaning solvent is formulated from a terpene hydrocarbon present in a concentration of about 50 percent to about 80 percent of the cleaning solvent and tetrahydrofuran compatible with the terpene hydrocarbon present in a |
| 07/17/2003 | US20030134540 Apparatus and methods for ensuring alignment of connectors to a printed circuit board |
| 07/17/2003 | US20030134530 Terminal leg on connector for soldering purpose |
| 07/17/2003 | US20030134528 Method of mounting terminal and terminal mounting structure |
| 07/17/2003 | US20030134095 Method of applying an edge electrode pattern to a touch screen |
| 07/17/2003 | US20030134050 Mixing workpieces with first conductive media in first plating solution, each workpiece comprising a substrate and an electrode provided thereon, and forming first plating films on electrodes by electroless plating |
| 07/17/2003 | US20030133302 Led lamp apparatus |
| 07/17/2003 | US20030133279 High-frequency wiring board |