Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2003
08/26/2003US6610417 Nickel coated copper as electrodes for embedded passive devices
08/26/2003US6610406 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
08/26/2003US6610365 Selective electroplating by etching in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and a sulfide solution; decorative or protective function; electronic packaging
08/26/2003US6610192 Reducing overplating in a copper layer of an integrated circuit device using at least one leveling agent, a reaction product of an amine with an epihalohydrin
08/26/2003US6609915 Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
08/26/2003US6609914 High speed and density circular connector for board-to-board interconnection systems
08/26/2003US6609652 Ball bumping substrates, particuarly wafers
08/26/2003US6609651 Method of soldering a leaded circuit component
08/26/2003US6609458 Screen printing apparatus and method of the same
08/26/2003US6609297 Method of manufacturing multilayer printed wiring board
08/26/2003US6609296 Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
08/26/2003US6609294 Method of bulk fabricating printed wiring board laminates
08/21/2003WO2003069967A1 Circuit substrate production method
08/21/2003WO2003069966A1 Method for the production of a semi-finished product for a printed board, semi-finished product, and printed board
08/21/2003WO2003069965A1 Device and method for transporting flat workpieces in conveyorized processing lines
08/21/2003WO2003069862A1 Electromagnetic bus coupling
08/21/2003WO2003069734A1 Intermediate board
08/21/2003WO2003069723A1 Signal repeating device
08/21/2003WO2003069695A2 Multilayer package for a semiconductor device
08/21/2003WO2003069666A1 Process for manufacturing copper foil on a metal carrier substrate
08/21/2003WO2003069636A1 Etching solution for forming an embedded resistor
08/21/2003WO2003069023A1 Method for repairing fine pattern and apparatus for repairing fine pattern
08/21/2003WO2003068521A1 Method of tampoprinting an electrical leading circuit
08/21/2003WO2003068447A1 Solder paste formulations, methods of production and uses thereof
08/21/2003WO2003068446A1 Method for determining the precision of processing machines
08/21/2003WO2003058677A3 System for the production of electric and integrated circuits
08/21/2003WO2003047037A3 Fabrication of a high resolution biological molecule detection device with aluminum electrical conductors
08/21/2003WO2003046988A3 Electronic assembly
08/21/2003WO2003043747A3 Manufacture having double sided features in a metal-containing web formed by etching
08/21/2003WO2003032084A3 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
08/21/2003WO2003003455A3 Using the wave soldering process to attach motherboard chipset heat sinks
08/21/2003WO2002061945A3 Method and device for equalisation of an oscillator for assembly on a circuit board
08/21/2003WO2002023566A9 A lead-less surface mount reed relay
08/21/2003US20030158350 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin
08/21/2003US20030157861 Method of manufacturing plasma display device
08/21/2003US20030157844 Electronic device having integrated connector
08/21/2003US20030157810 Semiconductor device and method of manufacturing the same
08/21/2003US20030157761 Method for forming bumps, semiconductor device, and solder paste
08/21/2003US20030157749 Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device
08/21/2003US20030157437 Semiconductor module substrate sheet, semiconductor module substrate sheet fabricating method and semiconductor module
08/21/2003US20030157311 Mesoporous films having reduced dielectric constants
08/21/2003US20030157307 Circuit board and method for manufacturing the same
08/21/2003US20030157264 Bath and method of electroless plating of silver on metal surfaces
08/21/2003US20030157250 Hyrdrothermal treatment of nanostructured films
08/21/2003US20030156969 Coupling electroconductive pads
08/21/2003US20030156443 High capacity memory module with built-in performance enhancing features
08/21/2003US20030156402 Method for making a build-up package of a semiconductor die and structure formed from the same
08/21/2003US20030156400 Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
08/21/2003US20030156398 Processor and power supply circuit
08/21/2003US20030156396 Interposer to couple a microelectronic device package to a circuit board
08/21/2003US20030156395 Electronic component and method of manufacturing same
08/21/2003US20030156394 System for reducing apparent height of a board system
08/21/2003US20030156391 Wiring board and soldering method therefor
08/21/2003US20030156368 In-rush current controller
08/21/2003US20030156152 Cleaning nozzle
08/21/2003US20030155987 Interference signal decoupling using a board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
08/21/2003US20030155908 Test mark and electronic device incorporating the same
08/21/2003US20030155656 Anisotropically conductive film
08/21/2003US20030155653 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
08/21/2003US20030155652 Semiconductor device and its manufacturing method
08/21/2003US20030155640 Integrated circuit package
08/21/2003US20030155638 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
08/21/2003US20030155455 Mixture of fine inrganic compound in thermosetting resin; heating, pressurization, curing
08/21/2003US20030155249 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
08/21/2003US20030155248 Electroless deposition using organometallic polymer and organosilicon polymer; forming copper film
08/21/2003US20030155151 Electrical contacts for flexible displays
08/21/2003US20030155143 Electromagnetic wave absorption material and an associated device
08/21/2003US20030155064 Method for manufacturing laminated ceramic electronic component
08/21/2003US20030154868 Screen printing apparatus
08/21/2003US20030154599 Method for reducing apparent height of a board system
08/21/2003US20030154592 Method to embed thick film components
08/20/2003EP1337136A2 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
08/20/2003EP1337135A2 High frequency unit
08/20/2003EP1337134A2 Terminal structure having large peel strength of land portion and ball
08/20/2003EP1337007A1 Intermediate board
08/20/2003EP1336647A2 Fixing adhesive sheet for flexible printed circuit board and method for mounting electronic parts in flexible printed circuit board
08/20/2003EP1336329A1 Arrangement consisting of a circuit carrier and a printed circuit board, or a printed circuit board assembly
08/20/2003EP1336247A1 Electronic device, semiconductor device comprising such a device and method of manufacturing such a device
08/20/2003EP1336226A1 Holding element for holding a carrier board
08/20/2003EP1336202A2 Device for protecting an electric and/or electronic component arranged on a carrier substrate against electrostatic discharges
08/20/2003EP1336189A1 Device, set and method for carrying a gas or a liquid to a surface through a tube
08/20/2003EP1335831A1 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
08/20/2003EP1236273B1 High voltage hybrid circuit
08/20/2003EP0938597B1 Method for anisotropic etching of structures in conducting materials
08/20/2003EP0843621B1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
08/20/2003CN2567916Y Interlayer disposition structure of multi-layer circuit board
08/20/2003CN1437838A Self-aligned coaxial via capacitors
08/20/2003CN1437713A A method for individualised marking of circuit boards
08/20/2003CN1437661A Conditioning of through holes and glass
08/20/2003CN1437628A Impregnated glass fiber strands and products including the same
08/20/2003CN1437438A Method for producing double-side distributing board
08/20/2003CN1437437A Copper-cladding method in circuit board design
08/20/2003CN1437436A Circuit board design method
08/20/2003CN1437285A Electric contact method for constituting two metal structure
08/20/2003CN1437232A Chip package structure and its making process
08/20/2003CN1437210A Terminal structure for high frequency signal transmitting parts
08/20/2003CN1436662A Extrusion head for lamination press
08/20/2003CN1436643A Die for punching & laminating simultaneously
08/20/2003CN1119073C Printed circuit board for large current
08/20/2003CN1118904C Method of mounting electric socket on substrate
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