Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2003
06/05/2003US20030102160 Alternate metallurgy for land grid array connectors
06/05/2003US20030102159 Optimum power and ground bump pad and bump patterns for flip chip packaging
06/05/2003US20030102158 Laminate having plated microvia interconnects and method for forming the same
06/05/2003US20030102157 Circuit interconnect for optoelectronic device for controlled impedance at high frequencies
06/05/2003US20030102156 Ball grid array package
06/05/2003US20030102155 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder
06/05/2003US20030102154 Methods of making anisotropic conductive elements for use in microelectronic packaging
06/05/2003US20030102153 Transfer material method for producing the same and wiring substrate produced by using the same
06/05/2003US20030102152 Electrical circuit board and a method for making the same
06/05/2003US20030102151 Multilayer build-up wiring board
06/05/2003US20030102150 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same
06/05/2003US20030102101 Method and apparatus for forming solder balls
06/05/2003US20030102077 Method for manufacturing a copper-clad laminate
06/05/2003US20030102074 Method for manufacturing a copper-clad laminate
06/05/2003US20030102073 Method for manufacturing a copper-clad laminate
06/05/2003US20030101585 Methods of manufacturing via intersect pad for electronic components
06/05/2003US20030101584 Bump and method of forming bump
06/05/2003US20030101581 Strain relief for substrates having a low coefficient of thermal expansion
06/05/2003US20030101580 Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method
06/05/2003DE10148632C1 Verfahren und Vorrichtung zum galvanotechnischen Behandeln von Werkstücken mit einer Edelmetalle enthaltenden Flüssigkeit Method and apparatus for plating work pieces with a liquid containing precious metals
06/04/2003EP1317170A2 Shielding structure for resonant circuit
06/04/2003EP1316981A1 Vibration sensor made from laminated substrates with conductive ball
06/04/2003EP1316976A1 Dielectric structure for solid capacitor and method for making it
06/04/2003EP1316831A1 Method and device for controlling an optical scanner
06/04/2003EP1316803A2 Lithographic contact elements
06/04/2003EP1315975A2 Method and device for testing printed circuit boards with a parallel tester
06/04/2003EP1315780A2 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
06/04/2003EP1245137B1 Method and device for laser drilling organic materials
06/04/2003EP1244523B1 Device for collectively filling blind cavities
06/04/2003EP1166353A4 Laminate for multi-layer printed circuit
06/04/2003EP1135693B1 Probe card for probing wafers with raised contact elements
06/04/2003EP1135690B1 Lithographic contact elements
06/04/2003EP1116421B1 Method for producing etched circuits
06/04/2003EP1090538B1 Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace
06/04/2003EP0878265B1 Solder, solder paste and soldering method
06/04/2003EP0812258B1 Electrical feedthroughs for ceramic circuit board support substrates
06/04/2003EP0779772B1 Printed wiring board, method of producing the same and electronic devices
06/04/2003EP0463105B2 High capacitance laminates
06/04/2003CN2554893Y High integrated level stack material
06/04/2003CN2554800Y Cell holding device
06/04/2003CN1422511A Fixing plate, fixing arrangement comprising the fixing plate and the use of said fixing plate
06/04/2003CN1422113A Surface mount machine correcting instrument
06/04/2003CN1422109A Weld method of printing base plate and jet-flow welding flux though
06/04/2003CN1422108A Printed circuit board with testing point formed at side
06/04/2003CN1422071A Solid imaging apparatus and producing method thereof
06/04/2003CN1421963A Grid array pin connector
06/04/2003CN1421926A 多重布线板 Multiple wiring board
06/04/2003CN1421925A Semiconductor assembly
06/04/2003CN1421280A Size coating apparatus and size coating method
06/04/2003CN1110821C Flat resistor-capacitor and making method thereof
06/04/2003CN1110771C Carrier structural element
06/04/2003CN1110473C Method for removing contaminants from products
06/04/2003CN1110408C Cladding laminated products for producing printed circuit board and the producing method of the same products
06/03/2003US6574250 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
06/03/2003US6574115 Computer system, electronic circuit board, and card
06/03/2003US6574113 Electronic package with stacked connections and method for making same
06/03/2003US6574108 Selective PCB via location to enhance cooling
06/03/2003US6574090 Printed circuit board capacitor structure and method
06/03/2003US6574089 Monolithic ceramic capacitor
06/03/2003US6574087 Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated
06/03/2003US6573821 System, printed circuit board, charger device, user device, and apparatus
06/03/2003US6573804 Electronic apparatus having a printed circuit board with multi-point grounding
06/03/2003US6573740 Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate
06/03/2003US6573610 Substrate of semiconductor package for flip chip package
06/03/2003US6573609 Microelectronic component with rigid interposer
06/03/2003US6573600 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
06/03/2003US6573597 Cross-over for quasi-coaxial transmission lines fabricated on a substrate
06/03/2003US6573584 Thin film electronic device and circuit board mounting the same
06/03/2003US6573461 Retaining ring interconnect used for 3-D stacking
06/03/2003US6573460 Post in ring interconnect using for 3-D stacking
06/03/2003US6573458 Printed circuit board
06/03/2003US6573122 Wafer level insulation underfill for die attach
06/03/2003US6573121 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
06/03/2003US6573028 Reducing number of fabricating steps
06/03/2003US6572963 Process of forming a pattern on a substrate
06/03/2003US6572962 Particle lock joint
06/03/2003US6572954 Electromechanical component
06/03/2003US6572830 Integrated multilayered microfludic devices and methods for making the same
06/03/2003US6572780 Methods for fabricating flexible circuit structures
06/03/2003US6572756 Aqueous electrolytic medium
06/03/2003US6572742 Apparatus for electrochemical fabrication using a conformable mask
06/03/2003US6572702 High speed electronic assembly system and method
06/03/2003US6572412 Control device and soldering method
06/03/2003US6572397 Structure of a ball grid array IC socket connection with solder ball
06/03/2003US6572389 Contact elements for surface mounting of burn-in socket
06/03/2003US6572278 Opto-electronic device having staked connection between parts to prevent differential thermal expansion
06/03/2003US6572009 Passive and active heat retention device for solder fountain rework
06/03/2003US6572004 Hermetically sealed component assembly package
06/03/2003US6571701 Stirring mechanism for viscous-material printer and method of printing
06/03/2003US6571657 Multiple blade robot adjustment apparatus and associated method
06/03/2003US6571469 Method for manufacturing modular board
06/03/2003US6571467 Thermal curing of insulating layer and reducing oxidized layer on printed circuits
05/2003
05/30/2003WO2003045127A1 Electromagnetic wave shielded light-transmissive material and manufacturing method thereof
05/30/2003WO2003045123A1 Interposer
05/30/2003WO2003045122A1 Method of making an interposer
05/30/2003WO2003045121A1 Multilayered board comprising folded flexible circuits and method of manufacture
05/30/2003WO2003045120A1 Method and apparatus for securing a circuit board to a rigid surface
05/30/2003WO2003044859A1 Multi-chip circuit module and method for producing the same
05/30/2003WO2003044849A2 Integrated void-free process for assembling a solder bumped chip
05/30/2003WO2003044100A1 Method of producing coating composition and coating composition made therefrom
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