Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2003
09/10/2003EP1342726A1 Solder precipitating composition and solder precipitation method
09/10/2003EP1342585A1 Method of making an electroluminescent device
09/10/2003EP1342564A1 Multilayered metal laminate and process for producing the same
09/10/2003EP1342525A1 Method and apparatus for applying solder to a substrate
09/10/2003EP1342398A2 Energy pathway arrangements for energy conditioning
09/10/2003EP1342395A2 Multi-layer circuits and methods of manufacture thereof
09/10/2003EP1342394A2 Liquid crystalline polymer bond plies and circuits formed therefrom
09/10/2003EP1342294A1 I-channel surface-mount connector
09/10/2003EP1342292A1 Circuit module with universal connectivity
09/10/2003EP1342284A1 Process for securing a microwave module to a support
09/10/2003EP1342252A2 Multi-layer and user-configurable micro-printed circuit board
09/10/2003EP1094915B1 Method for encapsulating solder metal powders and solder metal powders produced according to this method
09/10/2003CN2572717Y Printed circuit board with antenna connector
09/10/2003CN2572586Y Heat conductor for electric connector
09/10/2003CN1442031A Structure for interconnecting conductors and connecting method
09/10/2003CN1442030A Method and apparatus for providing substrate with viscous medium and use of jetting means for correction of application errors
09/10/2003CN1441626A Electroluminescence sheet
09/10/2003CN1441613A High frequency module
09/10/2003CN1441550A Electronic device and its producing method
09/10/2003CN1441492A Electronic element and its producing method
09/10/2003CN1441487A Wiring base board and its producing method, electronic parts and electronic instrument
09/10/2003CN1441486A Wiring base board and method for producing belt type wiring base board
09/10/2003CN1441473A Adhesive for electronic element device
09/10/2003CN1441470A Wiring base board and its producing method, semiconductor device and electronic machine
09/10/2003CN1441448A Electrode connection method and surface processing distribution panel and adhesive film used thereof
09/10/2003CN1441242A Non-destructive detecting method for solidification level of solidified article of solidified adhesive composition and method for producing electronic device
09/10/2003CN1441088A Electrochemical catalyst electrode resulting in high endurance of the combination between coating and metal base
09/10/2003CN1440854A Separated out type soldering tin composition and soldering separating out method
09/10/2003CN1121062C Method for installing semiconductor element on substrate
09/10/2003CN1120858C Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards
09/09/2003US6618842 Prototype development system and method
09/09/2003US6618629 Communications interface for assembly-line monitoring and control
09/09/2003US6618402 Device for generating a plurality of laser beams
09/09/2003US6618272 Electric component connecting structure
09/09/2003US6618268 Apparatus for delivering power to high performance electronic assemblies
09/09/2003US6618257 Wide data path stacking system and method
09/09/2003US6618238 Parallel plate buried capacitor
09/09/2003US6617946 Microwave package
09/09/2003US6617863 Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
09/09/2003US6617786 Electronic device encapsulated directly on a substrate
09/09/2003US6617695 Semiconductor device and semiconductor module using the same
09/09/2003US6617676 Method for making a contactless chip card
09/09/2003US6617673 Memory card
09/09/2003US6617541 Laser etching method
09/09/2003US6617529 Circuit board and electronic equipment using the same
09/09/2003US6617528 Electronic package with stacked connections and method for making same
09/09/2003US6617527 Printed circuit board having a pair of grooves extending the entire length
09/09/2003US6617526 UHF ground interconnects
09/09/2003US6617522 Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
09/09/2003US6617521 Circuit board and display device using the same and electronic equipment
09/09/2003US6617520 Circuit board
09/09/2003US6617519 Flexible printed circuit board and manufacturing method
09/09/2003US6617510 Stress relief bend useful in an integrated circuit redistribution patch
09/09/2003US6617399 Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
09/09/2003US6617236 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
09/09/2003US6617195 Method of reflowing organic packages using no-clean flux
09/09/2003US6616984 Cocuring agent is preferable 2-allyphenyl glycidyl ether, 2,2'-diallybisphenol A diglycidyl ether, or mixtures thereof.
09/09/2003US6616976 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer
09/09/2003US6616966 Method of making lithographic contact springs
09/09/2003US6616880 Method for encasing array packages
09/09/2003US6616864 Z-axis electrical contact for microelectronic devices
09/09/2003US6616796 Press-bonding a thermotropic liquid crystal polymer film to a metal sheet between hot rolls while in a tense or non-tense state; and heating the laminate to not lower than the melting point of the polymer film.
09/09/2003US6616717 Containing an oxidizer for oxidizing the metal, a metal complexing compound, and a polymer to bond with silanol surface groups on the silica to inhibit its removal during removal of the layer of metal by the polishing.
09/09/2003US6616461 Assembly for mounting a bridge rectifier to a printed wiring board
09/09/2003US6616041 Part marking method applicable to industrial parts
09/09/2003US6615715 Screen printing apparatus, screen printing method, and paste storage container for screen printing apparatus
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/09/2003US6615481 Utilizes laser machining to provide high resolution, dense coil wire patterns on both sides of a ceramic vane substrate. A firing operation is first performed that eutectically bonds the copper to the ceramic.
09/04/2003WO2003073812A1 Method of fabricating a high-layer-count backplane
09/04/2003WO2003073811A1 Solder interconnections for flat circuits
09/04/2003WO2003073810A1 Method for boring holes in a substrate, especially an electrical circuit substrate, by means of a laser beam
09/04/2003WO2003073808A1 Passive transmission line equalization using circuit-board thru-holes
09/04/2003WO2003073807A1 Wired transmission path
09/04/2003WO2003073805A2 Improved patching methods and apparatus for fabricating memory modules
09/04/2003WO2003073596A1 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive
09/04/2003WO2003073506A2 A modular integrated circuit chip carrier
09/04/2003WO2003073473A2 High frequency device packages and methods
09/04/2003WO2003073357A1 Methods and apparatus for fabricating chip-on-board modules
09/04/2003WO2003073356A1 Memory module assembly using partially defective chips
09/04/2003WO2003073168A1 Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards
09/04/2003WO2003072855A1 Methods and devices for the electrolytic metallisation of perforated walls and structures
09/04/2003WO2003072851A1 Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board
09/04/2003WO2003072527A1 Method for metallizing titanate-based ceramics
09/04/2003WO2003072325A1 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body
09/04/2003WO2003072299A1 Workpiece clamp that moves independently of the spindle
09/04/2003WO2003006708A3 Drill bit for printed circuit board fabrication and method for treatment thereof
09/04/2003WO2002080263A3 Flip chip interconnection using no-clean flux
09/04/2003WO2002055904A3 Method for assembling mechatronics sensor
09/04/2003US20030167453 Intelligent milling path creation for panelization abstract
09/04/2003US20030166487 Normally liquid, omega-hydrofluoroalkyl ether compounds (and selected mixtures thereof) have a saturated perfluoroaliphatic chain of carbon atoms interrupted by one or more ether oxygen atoms. The compounds can be prepared, by decarboxylation of
09/04/2003US20030166331 Bump fabrication process
09/04/2003US20030166330 Bump fabrication process
09/04/2003US20030166312 Methods for assembly and packaging of flip chip configured dice with interposer
09/04/2003US20030165781 Pattern forming method and display device manufactured using same
09/04/2003US20030165771 Blends of curable epoxy resins, polyepoxides, novolacs and photoinintiators, used to from films having high glass transition temperature and good flexibility used in printed circuits
09/04/2003US20030165633 Plating method of metal film on the surface of polymer
09/04/2003US20030165623 Copper deposition using copper formate complexes
09/04/2003US20030165303 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC ( low-temperature co-fired ceramic ) technology
09/04/2003US20030165051 Modular integrated circuit chip carrier
09/04/2003US20030164919 Displaying substrate and liquid crystal display device having the same
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