Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2003
06/11/2003CN1423674A Flame retardant epoxy molding compositions
06/11/2003CN1423596A Thermal mass transfer donor element with light-to-heat conversion layer
06/11/2003CN1423517A Printed circuit board with built-in resistor and its making method
06/11/2003CN1423325A 半导体装置 Semiconductor device
06/11/2003CN1423288A Method for making ceramic laminate product, laminate electronic element and making method
06/11/2003CN1423286A Surface contact type sandwich circuit protection device and making method thereof
06/11/2003CN1422981A Method for producing copper-resin composite material
06/11/2003CN1422924A Binding-aid composition, multilayer printed circuit making method and rotary coating copper surface
06/11/2003CN1422741A Method for forming resin composite material
06/11/2003CN1422723A 焊锡膏 Paste
06/11/2003CN1422721A Method for producing metal-ceramic composite lining and solder material used for same
06/10/2003US6577503 Vertical surface mount apparatus with thermal carrier
06/10/2003US6577225 Array resistor network
06/10/2003US6577016 Semiconductor device having adhesive inflow preventing means
06/10/2003US6577003 Semiconductor chip carrier affording a high-density external interface
06/10/2003US6577002 180 degree bump placement layout for an integrated circuit power grid
06/10/2003US6576999 Mounting structure for an electronic component having an external terminal electrode
06/10/2003US6576992 Chip scale stacking system and method
06/10/2003US6576971 Chip type electronic part
06/10/2003US6576869 Method and apparatus for drilling microvia holes in electrical circuit interconnection packages
06/10/2003US6576864 Method of laser welding
06/10/2003US6576861 Method and apparatus for fine feature spray deposition
06/10/2003US6576847 Clamp to secure carrier to device for electromagnetic coupler
06/10/2003US6576839 Bond-ply structure for interconnection of circuit layer pairs with conductive inks
06/10/2003US6576681 Antireflective porogens
06/10/2003US6576549 Fabrication of a metalized blind via
06/10/2003US6576541 Method and structure for producing bumps on an IC package substrate
06/10/2003US6576540 Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads
06/10/2003US6576539 Semiconductor chip assembly with interlocked conductive trace
06/10/2003US6576505 Method for transferring and stacking of semiconductor devices
06/10/2003US6576500 Method of plasma-processing a board, chip attachment to the board and resin encapsulation of the chip
06/10/2003US6576499 Electronic device assembly and a method of connecting electronic devices constituting the same
06/10/2003US6576497 Chip-type electronic component
06/10/2003US6576493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
06/10/2003US6576485 Contact structure and production method thereof and probe contact assembly using same
06/10/2003US6576451 (meth)acrylate endcapped polyether reaction product with a diisocyanate; use in bioremediation of dioxins, bisphenol a and in denitrification of sewage
06/10/2003US6576409 Photosensitive resin composition and method for formation of resist pattern by use thereof
06/10/2003US6576402 Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures
06/10/2003US6576334 Bonding materials
06/10/2003US6576148 Non-homogeneous laminate material for suspension with electrostatic discharge shunting
06/10/2003US6576111 Process for the copper plating of substrates
06/10/2003US6576081 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A
06/10/2003US6575762 Connection of coaxial cable to a circuit board
06/10/2003US6575611 Support, especially for taillights of motor vehicles, as well as method for fastening electronic components, preferably leds, to such a support
06/10/2003US6575352 Apparatus and method for soldering electronic components to printed circuit boards
06/10/2003US6575351 Work/head positioning apparatus for ball mount apparatus
06/10/2003US6574863 Thin core substrate for fabricating a build-up circuit board
06/10/2003US6574862 Method for coupling PCB sheet
06/10/2003US6574861 System and method for solder ball rework
06/10/2003US6574860 Forming printed circuits from pastes for protective coatings
06/10/2003US6574859 Interconnection process for module assembly and rework
06/05/2003WO2003047328A2 Method and devices for qualifying substrate-processing production processes
06/05/2003WO2003047325A1 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/05/2003WO2003047324A1 Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board
06/05/2003WO2003047323A1 Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer
06/05/2003WO2003047045A1 Plug
06/05/2003WO2003047037A2 Fabrication of a high resolution biological molecule detection device with aluminum electrical conductors
06/05/2003WO2003046988A2 Electronic assembly
06/05/2003WO2003046981A1 Module structure and module comprising it
06/05/2003WO2003046728A1 Caching dynamic web documents
06/05/2003WO2003046098A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
06/05/2003WO2003045667A1 Abrasion resistant electrode and device
06/05/2003WO2003024172A3 A method of etching copper on cards
06/05/2003WO2003023388A8 Sensor substrate and method of fabricating same
06/05/2003WO2003007375A3 Single package containing multiple integrated circuit devices
06/05/2003WO2002097860A3 Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
06/05/2003US20030104715 Signal-transmitting device
06/05/2003US20030104713 Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
06/05/2003US20030104687 Temporary chip attach structure with thin films
06/05/2003US20030104184 Multiple wiring board
06/05/2003US20030104183 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus
06/05/2003US20030104182 Method for manufacturing a printed circuit board substrate
06/05/2003US20030104120 Immersion deposition of indium or tin on a copper surface; annealing; optional oxidation
06/05/2003US20030103535 Guide member and method for mounting light emitter to circuit board
06/05/2003US20030103341 Shielding structure for resonant circuit
06/05/2003US20030103338 Electronic package having multiple-zone interconnects and methods of manufacture
06/05/2003US20030103337 Frame support for a printed board assembly
06/05/2003US20030103317 Multiple terminal SMT BGA-style wound capacitor
06/05/2003US20030103108 Method of laser milling
06/05/2003US20030103107 Method of laser milling using constant tool path algorithm
06/05/2003US20030103027 Tape carrier package
06/05/2003US20030102574 Semiconductor device
06/05/2003US20030102566 Stereolithographic method for applying materials to electronic component substrates and resulting structures
06/05/2003US20030102560 Wafer level package and method for manufacturing the same
06/05/2003US20030102559 Semiconductor substrate with contact pads; testing device
06/05/2003US20030102553 Member for electronic circuit, method for manufacturing the member, and electronic part
06/05/2003US20030102547 Semiconductor device and production method thereof
06/05/2003US20030102536 Device for shielding transmission lines from ground or power supply
06/05/2003US20030102535 Semiconductor device having a ball grid array and method therefor
06/05/2003US20030102466 Anisotropic conductive adhesive film
06/05/2003US20030102427 Controller for optical scanner
06/05/2003US20030102424 Two-dimensional image detector, active-matrix substrate, and display device
06/05/2003US20030102357 Micro soldered connection
06/05/2003US20030102297 System and method for mounting electronic components onto flexible substrates
06/05/2003US20030102284 Method for fabricating micro-structures with various surface properties in multi-layer body by plasma etching
06/05/2003US20030102227 Electrolysis, oxidation of copper layer
06/05/2003US20030102226 Electrolytic cells; bath mixture containing alcohols; stability
06/05/2003US20030102224 Multilayer laminated structure
06/05/2003US20030102223 Electrolysis; forming multilayer substrates; controlling current density
06/05/2003US20030102161 Structure and method for replacing an electrical net
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