Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2003
07/31/2003WO2003062136A2 Method and system for locally connecting microstructures
07/31/2003WO2003062129A2 Method and apparatus for detecting a liquid spray pattern
07/31/2003WO2003061974A1 Ink jet head and manufacturing method thereof
07/31/2003WO2003061900A1 Depaneling systems
07/31/2003WO2003061897A1 Lead-free solder material
07/31/2003WO2003061896A1 Solder alloy and soldered joint
07/31/2003WO2003061894A1 Solder-bearing components including a solder-bearing electromagnetic shield and method of retaining a solder mass therein
07/31/2003WO2003061892A1 Flux collection method and system
07/31/2003WO2003061851A1 Catalyst solutions useful in activating substrates for subsequent plating
07/31/2003WO2003047806B1 Method of laser milling
07/31/2003WO2003038896A3 Ball grid array with x-ray alignment mark
07/31/2003WO2003025976A3 Embedded inductor for semiconductor device circuit
07/31/2003WO2003003444A3 Method for producing a substrate arrangement
07/31/2003US20030144445 Compositions for making ene-thiol elastomers
07/31/2003US20030144444 Compositions for making ene-thiol elastomers
07/31/2003US20030144443 Compositions for making ene-thiol elastomers
07/31/2003US20030144442 Addition-condensation polymer
07/31/2003US20030144381 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors
07/31/2003US20030143971 Radio transmitting/receiving device
07/31/2003US20030143877 Contact elements
07/31/2003US20030143872 Ball grid array connection device
07/31/2003US20030143833 Wiring circuit substrate and manufacturing method therefor
07/31/2003US20030143486 Photoreactive resin composition and Method of manufacturing circuit board and ceramic multilayer substrate using the resin composition
07/31/2003US20030143419 Structure for interconnecting conductors and connecting method
07/31/2003US20030143411 Surface conductive resin, process for forming the same and wiring board
07/31/2003US20030143104 Solder alloy and soldered bond
07/31/2003US20030143060 Fixing plate , fixing arrangement comprising the fixing plate and the use said fixing plate
07/31/2003US20030142929 Flex board interface to an optical module
07/31/2003US20030141885 Interposer and methods for fabricating same
07/31/2003US20030141602 Lead pin with Au-Ge based brazing material
07/31/2003US20030141600 Apparatus and method of manufacturing printed circuit boards
07/31/2003US20030141596 Wiring board, semiconductor device, and method of manufacturing wiring board
07/31/2003US20030141595 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
07/31/2003US20030141589 Encapsulated high-frequency electrical circuit
07/31/2003US20030141580 Electronic card
07/31/2003US20030141488 Conductive via composition
07/31/2003US20030141428 Supporting device for discrete electric component
07/31/2003US20030141351 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
07/31/2003US20030141348 Method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor
07/31/2003US20030141342 Minute copper balls and a method for their manufacture
07/31/2003US20030141198 Overcoating cathode with acid and alkali resistant protective coating
07/31/2003US20030141194 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
07/31/2003US20030141174 Electronic device switch
07/31/2003US20030141108 Single-sided circuit board and method for maufacturing the same
07/31/2003US20030141107 Apparatus and method for routing electrical signals
07/31/2003US20030141104 Electronic printed-circuit board for electronic devices, especially communications terminals
07/31/2003US20030141103 PCB solder pad geometry including patterns improving solder coverage
07/31/2003US20030141014 Mixture of electroconductive particles and polymer
07/31/2003US20030141007 Apparatus and method for manufacturing ceramic laminate
07/31/2003US20030141006 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
07/31/2003US20030140490 Multi-layer circuit assembly and process for preparing the same
07/31/2003US20030140489 Semiconductor module and producing method therefor
07/31/2003US20030140488 Enhanced design and process for a conductive adhesive
07/31/2003US20030140484 Device for pressure bonding an integrated circuit to a printed circuit board
07/31/2003US20030140473 Dowel pin pulling machine
07/30/2003EP1331707A1 Ball grid array connection device
07/30/2003EP1331622A1 Display module
07/30/2003EP1331287A2 Treating metal surfaces with a modified oxide replacement composition
07/30/2003EP1331094A1 Squeeze unit and cream solder printer
07/30/2003EP1331088A1 Copper foil for high-density ultrafine wiring board
07/30/2003EP1330558A1 Leadfree chemical nickel alloy
07/30/2003EP1330364A1 Use of electronically active primer layers in thermal patterning of materials
07/30/2003EP1330328A1 Method and device for applying material to a workpiece
07/30/2003EP1330327A1 Method for applying solder to a substrate or a chip without using flux
07/30/2003EP0844899B1 Hermetically sealed electrical feedthrough for use with implantable electronic devices
07/30/2003EP0822229B1 Polyimide resin composition
07/30/2003CN1433575A Method and apparatus for encoding information in IC package
07/30/2003CN1433574A 集成电路封装 IC packaging
07/30/2003CN1433532A Photosensitive resin composition
07/30/2003CN1433358A Thermal transfer of microstructured layers
07/30/2003CN1433351A Hardening flux, soldering resist, remicondctor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
07/30/2003CN1433350A Device for processing substrates and method therefor which entails the use of such a device
07/30/2003CN1433256A Printed circuit board and its making process
07/30/2003CN1433255A Installing sheet
07/30/2003CN1433253A Printed circuit board and its making process
07/30/2003CN1433073A Semiconductor device and its making process, circuit board and electronic instrument
07/30/2003CN1433002A 软性印刷电路板 Flexible printed circuit board
07/30/2003CN1432666A Copper electroplating method
07/30/2003CN1432661A Metal layer forming process and laminated metal foil-based product
07/30/2003CN1432639A 洗涤溶剂和涂布器 Washing solvent and applicator
07/30/2003CN1432470A Screen process press
07/30/2003CN1432469A Vacuum printing mechanism
07/30/2003CN1116790C Printed circuit board and electronic element assembly and manufacture thereof
07/30/2003CN1116789C Copper foil for printed circuit board and its manufacture, and stacked body and printed circuit board using the copper foil
07/30/2003CN1116480C Infrared heating paper and its production process
07/30/2003CN1116449C Device for processing printed circuit boards
07/30/2003CN1116164C Method of forming polymer film coating and method for preparing laminated body of polymer layer and metal foil layer
07/29/2003US6600910 Radio frequency transformer and its use
07/29/2003US6600666 Holding device for a cable harness
07/29/2003US6600661 Method and apparatus for supporting a circuit component
07/29/2003US6600658 Electrical junction box
07/29/2003US6600404 Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
07/29/2003US6600233 Integrated circuit package with surface mounted pins on an organic substrate
07/29/2003US6600227 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
07/29/2003US6600224 Thin film attachment to laminate using a dendritic interconnection
07/29/2003US6600214 Electronic component device and method of manufacturing the same
07/29/2003US6600152 Device for treating a substrate having a rotating polygonal mirror with inclined faces and a system of adjacent focusing lenses
07/29/2003US6600137 Heating device and heating method
07/29/2003US6600101 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
07/29/2003US6599951 Antireflective porogens
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