| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/29/2003 | US6599833 Method and article for filling apertures in a high performance electronic substrate |
| 07/29/2003 | US6599777 Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance |
| 07/29/2003 | US6599776 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 07/29/2003 | US6599773 Electronic part and method of fabricating thereof |
| 07/29/2003 | US6599681 Electromagnetic filter for display screens |
| 07/29/2003 | US6599643 Conntacting surface with a medium comprising at least one silicate and having a basic pH and wherein medium is substantially free of chromates, introducing a current to medium using surface as cathode; recovering the substrate |
| 07/29/2003 | US6599617 Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof |
| 07/29/2003 | US6599587 Silver, gold, copper, palladium, nickel or platinum complexed with one or two imidazolylidene compounds and optionally abetadiketone; photopatterning without a resist |
| 07/29/2003 | US6599583 Applying ink containing magnetic particles to walls of hole and subjecting to energy field |
| 07/29/2003 | US6599582 Pattern formation method and substrate manufacturing apparatus |
| 07/29/2003 | US6599563 Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals |
| 07/29/2003 | US6599562 Rigid-printed wiring board and production method of the rigid-printed wiring board |
| 07/29/2003 | US6599561 Impregnating woven fabric with resin and curing; inexpensive; mechanical stability |
| 07/29/2003 | US6599438 Process for ashing organic materials from substrates |
| 07/29/2003 | US6599372 Water insoluble resin dispersed in water, activating agent is organic acid or halogen compound; resin is pentaerythritol ester of hydrogenated rosin; printed circuit board |
| 07/29/2003 | US6599365 Apparatus for improving stencil/screen print quality |
| 07/29/2003 | US6599135 Vehicle power distributor and method of connecting control circuit board to vehicle power distributor |
| 07/29/2003 | US6598780 Method of connecting circuit boards |
| 07/29/2003 | US6598779 Electronic component mounting method |
| 07/29/2003 | US6598520 Hot pressing apparatus |
| 07/29/2003 | US6598505 Punch actuator monitoring system and method |
| 07/29/2003 | US6598292 Method of manufacturing a circuit board using a porous sheet composed of cellulose |
| 07/29/2003 | US6598291 Via connector and method of making same |
| 07/29/2003 | CA2217591C Wireless test fixture |
| 07/24/2003 | WO2003061357A1 System to form a layering of electronically-interactive material |
| 07/24/2003 | WO2003061356A1 Embossing die for fabricating high density interconnects and method for its fabrication |
| 07/24/2003 | WO2003060988A1 Adhesive sheet stamping device, adhesive sheet stamping method, part mounter, and display panel manufacturing method |
| 07/24/2003 | WO2003060987A1 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| 07/24/2003 | WO2003060985A1 Semiconductor package device and method |
| 07/24/2003 | WO2003060960A2 High density area array solder microjoining interconnect structure and fabrication method |
| 07/24/2003 | WO2003060954A1 Etched hole-fill stand-off |
| 07/24/2003 | WO2003060200A1 Electrode for metal plating and plating device |
| 07/24/2003 | WO2003060045A1 Aqueous stripping and cleaning composition |
| 07/24/2003 | WO2003059983A1 Diode-laser curing of liquid epoxide encapsulants |
| 07/24/2003 | WO2003059975A1 Photosensitive resin composition and printed wiring boards |
| 07/24/2003 | WO2003059568A1 Method for laser machining a workpiece with laser spot enlargement |
| 07/24/2003 | WO2003059564A1 Soldering method and solder alloy for additional supply |
| 07/24/2003 | WO2003059535A1 Cleaning roller device with vertical movement mechanism |
| 07/24/2003 | WO2003059101A1 Method and device for integrating electronics in textiles |
| 07/24/2003 | WO2003021672A3 An electronic package having a thermal stretching layer |
| 07/24/2003 | WO2002099848A3 Formation of printed circuit board structures using piezo microdeposition |
| 07/24/2003 | WO2002047163A3 Semiconductor device having a ball grid array and method therefor |
| 07/24/2003 | US20030139073 Portable electronic apparatus having external connector fixed at internal circuit board |
| 07/24/2003 | US20030139072 Portable electronic apparatus having external connector fixed at internal circuit board |
| 07/24/2003 | US20030139071 Thermally enhanced interposer and method |
| 07/24/2003 | US20030139032 Metal post manufacturing method |
| 07/24/2003 | US20030139030 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 07/24/2003 | US20030138992 Multilayered circuit substrate, semiconductor device and method of producing same |
| 07/24/2003 | US20030138733 Comprises acrylic acid-acrylonitrile-butadiene terpolymer binder; for protective/passivative coatings, defect repair in ceramic and thin film products within printed circuits; solvent-free |
| 07/24/2003 | US20030138610 Printed circuit board incorporating enchanced conductive ink |
| 07/24/2003 | US20030138571 Electrons produced by oxidation of reducing agent are supplied to the electrode to form the desired metal only on the surface of the electrode, there by forming electroless plating film |
| 07/24/2003 | US20030138555 Thermal transfer of microstructured layers |
| 07/24/2003 | US20030138553 Circuit board producing method and circuit board producing device |
| 07/24/2003 | US20030137839 Lamp on sheet and manufacturing method thereof |
| 07/24/2003 | US20030137818 Base for an electronic component |
| 07/24/2003 | US20030137815 Printed wiring board and method of manufacturing the same |
| 07/24/2003 | US20030137813 Circuit-constituting unit and method of producing the same |
| 07/24/2003 | US20030137809 Module and surface-mounted module |
| 07/24/2003 | US20030137808 Electronic module having canopy-type carriers |
| 07/24/2003 | US20030137477 Glass substrate printed wiring board printhead for electric paper |
| 07/24/2003 | US20030137062 Use of nitrides for flip-chip encapsulation |
| 07/24/2003 | US20030137060 Two-stage transfer molding method to encapsulate MMC module |
| 07/24/2003 | US20030137058 High density area array solder microjoining interconnect structure and fabrication method |
| 07/24/2003 | US20030137057 Multilayer thin film wirings formed on front and back surfaces of metal/alloy, then cut to expose inner electrode pads on which chips are mounted |
| 07/24/2003 | US20030137056 Circuit substrate and method for fabricating the same |
| 07/24/2003 | US20030137048 Stacking system and method |
| 07/24/2003 | US20030137046 Semiconductor device, method of fabricating the same, and printing mask |
| 07/24/2003 | US20030137036 Semiconductor package device and method |
| 07/24/2003 | US20030137035 For ball grid arrays; cleanliness is determined by color variation; improved adhesion of bonding wires and encapsulants |
| 07/24/2003 | US20030136818 Solder-bearing components and method of retaining a solder mass therein |
| 07/24/2003 | US20030136814 High density raised stud microjoining system and methods of fabricating the same |
| 07/24/2003 | US20030136813 Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same |
| 07/24/2003 | US20030136812 Solder-bearing electromagnetic shield |
| 07/24/2003 | US20030136656 Switch assembly employing an external customizing printed circuit board |
| 07/24/2003 | US20030136581 Apparatus and method for repairing electronic packages |
| 07/24/2003 | US20030136579 Electronic assembly and a method of constructing an electronic assembly |
| 07/24/2003 | US20030136578 Flexible wiring boards for double-side connection |
| 07/24/2003 | US20030136577 Circuit board and method for fabricating the same, and electronic device |
| 07/24/2003 | US20030136576 Printed circuit support having integrated connections and process for manufacturing such a support |
| 07/24/2003 | US20030136575 Cover for electronic components and method of using same during component assembly |
| 07/24/2003 | US20030136503 RFID label technique |
| 07/24/2003 | US20030136222 High-speed fabrication of highly uniform ultra-small metallic microspheres |
| 07/24/2003 | US20030136020 Flux collection method and system |
| 07/24/2003 | US20030136019 Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation |
| 07/24/2003 | US20030135998 Plastic deformable substrate using embossing tool; forming recesses, electroconductive strips |
| 07/24/2003 | US20030135997 Conductive material and method for filling via-hole |
| 07/24/2003 | US20030135996 Electronic device and a method of manufacturing the same |
| 07/24/2003 | US20030135994 Printed circuit board and manufacturing method therefor |
| 07/24/2003 | US20030135981 Electrical slip ring platter multilayer printed circuit board and method for making same |
| 07/24/2003 | DE10215463C1 Continuous plant for electrolytic metallization of printed circuit boards, includes precautions reducing electrical potential between adjacent workpieces |
| 07/24/2003 | DE10206660C1 Flat material transport device in wet chemical treatment plant e.g. for circuit boards or conductor foils, uses cooperating transport rollers with offset rounded peripheral beads |
| 07/24/2003 | DE10152128C1 Electrical connection device for spaced electrode regions has contact pins projecting from bridge-shaped conductor structure |
| 07/24/2003 | CA2471759A1 System to form a layering of electronically-interactive material |
| 07/24/2003 | CA2469520A1 Method for laser machining a workpiece with laser spot enlargement |
| 07/23/2003 | EP1330148A2 Electrical apparatus |
| 07/23/2003 | EP1330146A2 Via filling method |
| 07/23/2003 | EP1329990A1 Method of mounting terminal and terminal mounting structure |
| 07/23/2003 | EP1329925A2 Mounting structure of fuse connection terminals on board |
| 07/23/2003 | EP1329911A1 Conductive fine particles, method for plating fine particles, and substrate structural body |
| 07/23/2003 | EP1329488A1 Ink-jet ink and process for producing the same |