Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2003
06/24/2003CA2222602C Electronic modules manufacturing
06/24/2003CA2130354C Method of cleaning epoxy articles
06/19/2003WO2003050919A1 Method for producing contact terminal with textured surface and use thereof
06/19/2003WO2003050909A1 Circuit board device and its manufacturing method
06/19/2003WO2003050827A1 Electrical devices and process for making such devices
06/19/2003WO2003050824A1 Material for making a conductive pattern
06/19/2003WO2003050726A1 Parallel electronic design automation: shared simultaneous editing
06/19/2003WO2003050618A1 Method for manufacturing wiring board
06/19/2003WO2003032087A3 Aqueous developable photoimageable thick film compositions
06/19/2003WO2003020527A3 Screen printing process
06/19/2003US20030114574 Heat processing a thermosetting resin, an aromatic polysulfone resin and an organic solvent
06/19/2003US20030114041 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member
06/19/2003US20030114033 Connector, electronic equipment and control method for electronic equipment
06/19/2003US20030114029 Contact for ball grid array connector
06/19/2003US20030114028 Solder-bearing lead
06/19/2003US20030114027 Simplified board connector
06/19/2003US20030114026 Fluted signal pin, cap, membrane, and stanchion for a ball grid array
06/19/2003US20030114024 Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon
06/19/2003US20030114023 Electrical connection device
06/19/2003US20030114022 Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner
06/19/2003US20030113955 Method for fabricating semiconductor package and semiconductor package
06/19/2003US20030113951 Method for manufacturing multi-layer package substrates
06/19/2003US20030113669 Method of fabricating passive device on printed circuit board
06/19/2003US20030113554 Glass ceramic laminate becoming relatively high in bending strength after fired
06/19/2003US20030113523 Silanated copper foils, method of making, and use thereof
06/19/2003US20030113522 Circuit board and production method therefor
06/19/2003US20030113521 Metal layer laminated on a synthetic polyimide film obtained by immersing a partially imidized or dried poly(amide acid) film; dielectrics for printed circuits
06/19/2003US20030113510 Multi-layers with vias in filled holes
06/19/2003US20030113452 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
06/19/2003US20030113008 Process and device for generating test patterns when applying solder paste by a screen process on printed circuit boards
06/19/2003US20030112994 Electroacoustic transducer
06/19/2003US20030112658 Low temperature systems for use with magnetoresistive circuit components
06/19/2003US20030112627 Flexible sign illumination apparatus, system and method
06/19/2003US20030112616 Layered circuit boards and methods of production thereof
06/19/2003US20030112615 Method and apparatus for adding inductance to printed circuits
06/19/2003US20030112612 Combination device of the IC connection device and the main board
06/19/2003US20030112607 Method and apparatus for connecting circuit boards for a sensor assembly
06/19/2003US20030112323 Laser drawing apparatus and laser drawing method
06/19/2003US20030112298 Lattice array-structured piezoelectric actuator and method for producing the same
06/19/2003US20030112202 Method for producing a tag or a chip card, device for implementing said method and tag or chip card produced according to said method
06/19/2003US20030112110 Embedded inductor for semiconductor device circuit
06/19/2003US20030112091 High speed, controlled impedance air dielectric circuit modules for electronic backplane systems
06/19/2003US20030111766 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
06/19/2003US20030111727 Semiconductor integrated circuit device and printed wired board for mounting the same
06/19/2003US20030111718 Vertically mountable and alignable semiconductor device assembly
06/19/2003US20030111519 Fluxing compositions
06/19/2003US20030111518 Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board
06/19/2003US20030111517 Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board
06/19/2003US20030111508 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
06/19/2003US20030111449 Method for soldering surface mount components to a substrate using a laser
06/19/2003US20030111351 Surface treatment method of copper foil with silane coupling agent
06/19/2003US20030111262 Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
06/19/2003US20030111260 Heat-shrinkable retainer for PCB double-sided assembly
06/19/2003US20030111259 Epoxy washer for retention of inverted SMT components
06/19/2003US20030111258 Epoxy washer for retention of inverted SMT components
06/19/2003US20030110978 Independently dispersed metal ultrafine particles-containing liquid dispersion
06/19/2003US20030110784 Display apparatus for refrigerator
06/19/2003US20030110630 Insulating material, method for producing insulating material, method for manufacturing multilayer cicuit board
06/19/2003US20030110629 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
06/19/2003US20030110627 Substrate for receiving a circuit configuration and method for producing the substrate
06/19/2003US20030110626 Method of locating conductive spheres utilizing screen and hopper of solder balls
06/19/2003US20030110624 Solder resist opening to define a combination pin one indicator and fiducial
06/19/2003US20030110622 Semiconductor device and method for producing the same, and anisotropic conductive circuit board
06/19/2003US20030110621 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
06/18/2003EP1320288A2 Printing wiring board device and method of manufacture thereof
06/18/2003EP1320287A1 Electrical connecting element and semi-finished product
06/18/2003EP1320286A2 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
06/18/2003EP1320112A1 Relay device and relay device mounting structure
06/18/2003EP1319974A2 Aligner
06/18/2003EP1319734A1 Plating method
06/18/2003EP1319326A1 Hermetically sealed component assembly package
06/18/2003EP1319198A1 Machine for the treatment of printing plates
06/18/2003EP1319119A1 Connecting device for routing control and power signals to an internal combustion engine valve actuators
06/18/2003EP1232039B1 Composition for preventing creeping of a flux for soldering and use thereof
06/18/2003EP1097619B1 Integrated circuit module having springy contacts of at least two different types for reduced stress
06/18/2003EP0813750B1 Process for making a z-axis adhesive and establishing electrical interconnection therewith
06/18/2003CN2556891Y Wire connecting element for improved piezoelectric piece
06/18/2003CN1425269A Flanged terminal pins for DC/DC converters
06/18/2003CN1425268A Electronic supports and methods and apparatus for forming apertures in electronic supports
06/18/2003CN1425209A RF ID foil or film antennas
06/18/2003CN1425192A Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
06/18/2003CN1425161A System for generating printed board three-dimensional shape data
06/18/2003CN1425138A Electrical test of interconnection of conductors on substrate
06/18/2003CN1425080A Electro-plating apparatus and method of electro-plating
06/18/2003CN1425034A Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition resin film, metal foil with insulating. material, insulating film with metal
06/18/2003CN1424838A Electroacustic transducer
06/18/2003CN1424756A Metal wiring substrate, semiconductor device and manufacture thereof
06/18/2003CN1424733A Dielectric structure
06/18/2003CN1424732A Dielectric structure
06/18/2003CN1112088C Method for manufacture of certain equipment containing printed-circuit board
06/18/2003CN1112086C Perimeter matrix ball grid array circuit package and package method with populated center
06/18/2003CN1111875C Flat resistor and capacitor and making method thereof
06/18/2003CN1111758C Photosensitive resin composition and photosensitive element using resin composition
06/18/2003CN1111742C Method of cleaning probe tips of probe cards and apparatus for impelementing method
06/18/2003CN1111574C Conducting resin composition for filling small hole, and double-face and multi-layer board made of same and producing method thereof
06/17/2003US6581202 System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture
06/17/2003US6580961 Circuit production method
06/17/2003US6580620 Matrix type printed circuit board for semiconductor packages
06/17/2003US6580613 Solder-free PCB assembly
06/17/2003US6580595 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
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