Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2003
09/04/2003US20030164540 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
09/04/2003US20030164537 Semiconductor component comprising a surface metallization
09/04/2003US20030164466 For copper surfaces on printed circuit boards, copper surfaces being suitable for the subsequent coating with plating resists, etch resists, solder masks and other dielectric films; copper substrates having roughened surfaces
09/04/2003US20030164457 Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices
09/04/2003US20030164396 Mounting method and device
09/04/2003US20030164395 Solder ball attaching process
09/04/2003US20030164394 Installation device
09/04/2003US20030164303 Forming vias on the package substrate coated with copper film; electroplating to form electrical conductive holes; coating a resisting agent; etching the pattern; removing; electroplating substrate with nickel and gold, and removing the resist
09/04/2003US20030164289 Methods of making and using freestanding reactive multilayer foils
09/04/2003US20030164247 Stacking multiple devices using direct soldering
09/04/2003US20030164244 System for and method of interconnecting high-frequency transmission lines
09/04/2003US20030164204 Solder paste for fabricating bump
09/04/2003US20030164077 Depaneling systems
09/04/2003CA2477766A1 Improved patching methods and apparatus for fabricating memory modules
09/04/2003CA2477763A1 Methods and apparatus for fabricating chip-on-board modules
09/04/2003CA2477754A1 Memory module assembly using partially defective chips
09/03/2003EP1341263A2 Electronic module assembly
09/03/2003EP1341262A2 Binding device for multiple electrical cable
09/03/2003EP1341254A2 System for and method of interconnecting high-frequency transmission lines
09/03/2003EP1341231A2 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
09/03/2003EP1341138A1 Process for producing resonant tag
09/03/2003EP1340416A1 Stamped grid comprising a fastening element
09/03/2003EP1340414A2 A method of forming an opening or cavity in a substrate for receiving an electronic component
09/03/2003EP1340289A2 Board integrated resilient contact elements array and method of fabrication
09/03/2003EP1340255A2 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer
09/03/2003EP1340234A1 System, printed circuit board, charger device, user device, and apparatus
09/03/2003EP1246730B1 Thermal transfer of microstructured layers
09/03/2003EP1230829B1 Apparatus and method for connecting printed circuit boards through soldered lap joints
09/03/2003EP1196798B1 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics
09/03/2003EP1088470A4 Ic stack utilizing flexible circuits with bga contacts
09/03/2003CN1440568A Device and method for forming bump
09/03/2003CN1440466A Acidic treatment liquid and method of treating copper surfaces
09/03/2003CN1440232A Wiring membrane connector and manufacture thereof, multilayer wiring substrate manufacture
09/03/2003CN1440059A Fixer for spheric grid array chip
09/03/2003CN1440057A Circuit board manufacturing method and device
09/03/2003CN1440009A Checking marker and electronic machine
09/03/2003CN1439732A Oxide separators
09/03/2003CN1439731A Oxide separators
09/03/2003CN1439672A Hot-pressed blotter rubber and manufacture thereof
09/03/2003CN1120527C Flat display device
09/03/2003CN1120504C Terminal instrallation structure
09/03/2003CN1120460C Control and signaling device or signaling device with luminous element
09/03/2003CN1120458C Display device, display panel assembly, flexible wiring plate and assembling method thereof
09/03/2003CN1120384C Liquid crystal display panel holder
09/02/2003US6614663 Reducing impedance of power supplying system in a circuit board by connecting two points in one of a power supply pattern and a ground pattern by a resistive member
09/02/2003US6614659 De-mountable, solderless in-line lead module package with interface
09/02/2003US6614341 Thick film circuit with fuse
09/02/2003US6614249 Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate
09/02/2003US6614167 Electron source, image forming apparatus, and manufacture method for electron source
09/02/2003US6614110 Module with bumps for connection and support
09/02/2003US6614003 Method and process of contact to a heat softened solder ball array
09/02/2003US6613988 Circuit board system with raised interconnects of conductive circuit traces
09/02/2003US6613987 First resin and said second resin have different plasma etching rates
09/02/2003US6613986 Multilayer build-up wiring board
09/02/2003US6613979 Electrical circuit suspension system
09/02/2003US6613663 Method for forming barrier layers for solder bumps
09/02/2003US6613662 Method for making projected contact structures for engaging bumped semiconductor devices
09/02/2003US6613599 Electro-optical device, method of manufacturing electro-optical device, liquid crystal device, method of manufacturing liquid crystal device and electronic apparatus
09/02/2003US6613495 Negative photoimageable mixture of a triazine or oxadiazole type acid generator, a reactive oligomer with crosslinking groups and a resin binder
09/02/2003US6613450 Metal/ceramic bonding article
09/02/2003US6613413 Porous power and ground planes for reduced PCB delamination and better reliability
09/02/2003US6613399 Production processes of printed substrate, electron-emitting element, electron source and image-forming apparatus
09/02/2003US6613267 Method for manufacturing a holder
09/02/2003US6613239 Method for making an electrical circuit board
09/02/2003US6613214 Apparatus for depositing a metal film, comprising a holder that positions the substrate so seed layer contacts an electrolyte solution, and electric contact which contacts second side or edge of substrate; uniform current density
09/02/2003US6613184 Stable interfaces between electrically conductive adhesives and metals
09/02/2003US6613123 A powder mixture including a first constituent having a first melting point(lower than second), first mean particle size includes a metal or metal alloy powder, second constituent includes a metal powder having second melting point and
09/02/2003US6612851 Electrical connector assembly for printed circuit boards
09/02/2003US6612525 Electro-optical component holder
09/02/2003US6612475 Tape shifting means
09/02/2003US6612232 Squeegee head that prevents degradation of solder paste
09/02/2003US6612231 Squeegee for screen printing, and squeegee device equipped with the squeegee
09/02/2003US6612202 Mechatronics sensor
09/02/2003US6612028 Method for manufacturing a built-up circuit board
09/02/2003US6612027 Method for forming metal contacts on a substrate
09/02/2003US6612025 Method for creating a connection within a multilayer circuit board assembly
09/02/2003US6612023 Method for registering a component lead with a U-shaped metalized pad
09/02/2003US6612022 Printed circuit board including removable auxiliary area with test points
09/01/2003CA2420580A1 Method and system for fabricating electronics
09/01/2003CA2374338A1 Fabrication method for large area mechanically flexible circuits and displays
08/2003
08/28/2003WO2003071843A1 Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method
08/28/2003WO2003071842A1 Method of mounting a semiconductor die on a substrate without using a solder mask
08/28/2003WO2003071603A1 Module part
08/28/2003WO2003071378A2 High capacity memory module with built-in performance enhancing features
08/28/2003WO2003071009A1 Method and device for electrically contacting a flat product in electrolytic installations
08/28/2003WO2003071008A2 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2003071007A1 Methods of and apparatus for making high aspect ratio microelectromechanical structures
08/28/2003WO2003070994A2 Lead-free tin-silver-copper alloy solder composition
08/28/2003WO2003070850A1 Two-pack type adhesive
08/28/2003WO2003070847A1 Process for producing electrical apparatus
08/28/2003WO2003070800A1 Curable resin and curable resin composition containing the same
08/28/2003WO2003070524A1 Method for creating a conductor track on a carrier component and corresponding carrier component
08/28/2003WO2003070424A1 Spindle with axially acting collet-opening device
08/28/2003WO2003070423A1 Workpiece clamp with two alternately applicable compression rings
08/28/2003WO2003070381A1 Ultra-small diameter fluid jet device
08/28/2003WO2003038897A3 Electronic unit, circuit design for the same, and production method
08/28/2003WO2003031372A3 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substrate.
08/28/2003WO2003030257A3 Soldered heat sink anchor and method of use
08/28/2003WO2003024171A3 Method of treating photoresists using electrodeless uv lamps
08/28/2003WO2002035672A3 Securing electrical conductors
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