Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/2003
07/10/2003WO2003056664A1 A module with an integrated contact element and an electronic device with such module
07/10/2003WO2003056654A1 Filter circuit apparatus and manufacturing method thereof
07/10/2003WO2003056574A1 Electroconductive composition, electroconductive coating and method for forming electroconductive coating
07/10/2003WO2003055654A1 A method and related apparatus for cutting a product from a sheet material
07/10/2003WO2002057659A3 Mechatronics sensor
07/10/2003US20030131323 Method of schematic-level AMS topology optimization using direct representations
07/10/2003US20030130826 Model for modifying drill data to predict hole locations in a panel structure
07/10/2003US20030130410 A (meth)acrylic copolymers containing hydrolyzable silicon compound; protective coatings resisting to sulfidation of metals, resisting to oxidation, corrosion and chemical, and dielectrics
07/10/2003US20030130146 Aqueous stripping and cleaning composition
07/10/2003US20030129874 Electrical connector with continuous strip contacts
07/10/2003US20030129866 Spring metal structure with passive-conductive coating on tip
07/10/2003US20030129863 Electronic package with thermally conductive standoff
07/10/2003US20030129823 Variable cross-section plated mushroom with stud for bumping
07/10/2003US20030129646 Monolithic structure formed from a plurality of green-sheet layers sintered together.
07/10/2003US20030129542 Contact planarization materials that generate no volatile byproducts or residue during curing
07/10/2003US20030129537 Method of treating photoresists using electrodeless UV lamps
07/10/2003US20030129536 Method of fabricating circuitized structures
07/10/2003US20030129535 Photopolymerizable epoxy resin
07/10/2003US20030129525 Material and method for making an electroconductive pattern
07/10/2003US20030129441 Plated copper alloy material and process for production thereof
07/10/2003US20030129440 Method of metal layer formation and metal foil-based layered product
07/10/2003US20030129383 Liquid thermosetting resin composition, printed wiring boards and process for their production
07/10/2003US20030129371 Circuit board and method of producing the same
07/10/2003US20030129317 Rotary dispenser, with its angled fluid passage, provides a flow conduit which produces a series of overlapping circular spray patterns, which can be controlled to provide a narrow line spry pattern with clearly defined edges; spray coating
07/10/2003US20030129271 Package stack via bottom-leaded plastic (BLP) packaging
07/10/2003US20030129030 Fiber sheets impregnated with lubricant; drilling holes in printed circuits; wear resistance
07/10/2003US20030128907 Method of manufacturing optical waveguide and method of manufacturing OPTO-electric wiring board
07/10/2003US20030128532 Printed circuit board, radio wave receiving converter, and antenna device
07/10/2003US20030128531 Removable visual indication structure for a printed circuit board
07/10/2003US20030128526 Multilayer ceramic electronic component and manufacturing method thereof
07/10/2003US20030128497 Dielectric structure
07/10/2003US20030128496 Dielectric structure
07/10/2003US20030127777 Filling method
07/10/2003US20030127747 Semiconductor device and manufacturing method thereof
07/10/2003US20030127746 Panel stacking of BGA devices to form three-dimensional modules
07/10/2003US20030127743 Interconnect on a substrate
07/10/2003US20030127742 Parallel plane substrate
07/10/2003US20030127737 Semiconductor device
07/10/2003US20030127733 Resin-sealed type semiconductor device
07/10/2003US20030127732 Resin-sealed type semiconductor device
07/10/2003US20030127729 Stacked semiconductor device structure
07/10/2003US20030127728 Concurrent electrical signal wiring optimization for an electronic package
07/10/2003US20030127725 Metal wiring board, semiconductor device, and method for manufacturing the same
07/10/2003US20030127712 Semiconductor device
07/10/2003US20030127632 Mixture of thermoplastic resin binder and metal filler
07/10/2003US20030127501 Apparatus and method of placing solder balls onto a substrate
07/10/2003US20030127500 Method for forming solder connections on a circuitized substrate
07/10/2003US20030127499 Low or no-force bump flattening structure and method
07/10/2003US20030127498 Gas injection type soldering method and apparatus
07/10/2003US20030127495 Method of forming metallic z-interconnects for laminate chip packages and boards
07/10/2003US20030127336 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/10/2003US20030127248 Waterproofing; prevent vibration
07/10/2003US20030127247 Z interconnect structure and method
07/10/2003US20030127245 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same
07/10/2003US20030127187 Stacks of contact sheets; cutting; glass fibers impregnated with epoxy resin
07/10/2003US20030127186 Applying energy to mixture of thermosetting powders
07/10/2003US20030127115 Contacting a printed circuit board or silicon wafer with supercritical 1,1,1,3,3-pentafluoropropane fluid
07/10/2003US20030127002 Multilayer architechture for microcontact printing stamps
07/10/2003US20030126834 Orienting and stacking parts
07/10/2003DE20304703U1 Structure for carrying off heat in a circuit board has a heat-conductive base board with an insulating heat-conductive layer to support contact connection surfaces that never interconnect.
07/09/2003EP1326306A2 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member
07/09/2003EP1326305A1 A module with an integrated contact element and an electronic device with such module
07/09/2003EP1326275A2 Power electronic module
07/09/2003EP1326260A1 Material for making a conductive pattern
07/09/2003EP1326137A1 Photosensitive insulating paste and thick-film multi-layer circuit substrate
07/09/2003EP1326079A2 Probe card
07/09/2003EP1325946A2 Coating composition for the protection of packaging and interconnecting boards
07/09/2003EP1325673A1 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board
07/09/2003EP1325545A2 Electronic transformer/inductor devices and methods for making same
07/09/2003EP1325538A1 Method for connecting flat film cables
07/09/2003EP1325533A1 Self-aligned transition between a transmission line and a module
07/09/2003EP1325517A2 Method for assembling components and antennae in radio frequency identification devices
07/09/2003EP1325505A2 A lead-less surface mount reed relay
07/09/2003EP1325175A1 Electrolyte and method for depositing tin-copper alloy layers
07/09/2003EP1324881A1 Hot lamination of a dry photoresist film onto a board for printed circuit
07/09/2003EP1324880A1 Circuit protective composites
07/09/2003EP1324867A1 Multi-layered structures and methods for manufacturing the multi-layered structures
07/09/2003EP1324851A1 Polymer collar for solder bumps
07/09/2003EP1324850A2 Method for ablating points of contact (debumping)
07/09/2003EP1192841B1 Intelligent power module
07/09/2003EP0957664B1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
07/09/2003EP0831980B1 Material-irradiation device and process for operation of material-irradiation devices
07/09/2003CN2559482Y Rotary device of crystal plate screen printing machine
07/09/2003CN1429470A Method for shielding at least upper part of radiocommunication module, and corresponding radiocommunication module
07/09/2003CN1429469A Method of repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by method
07/09/2003CN1429284A Elastic contact element
07/09/2003CN1429282A Cathode for electrochemical regeneration of permanganate etching solutions
07/09/2003CN1429139A Componet of printed circuit board
07/09/2003CN1429065A Method for making multi-layer circuit board with internal inserted passive component
07/09/2003CN1429064A Structure of high-density multi-layer circuit board and its manufacture method
07/09/2003CN1429063A Multilayer printed wiring board and mfg. method, electronic equipment
07/09/2003CN1429062A Method and device for mfg. printed circuit board
07/09/2003CN1429061A Testing device of tin wave contact time and its method
07/09/2003CN1429060A Printed wiring board, printed circuit board and electronic equipment
07/09/2003CN1428829A Method for mfg. semiconductor assembly
07/09/2003CN1428827A Polishing method for base copper-layer
07/09/2003CN1428800A Semiconductor device package and its mfg. method, and semiconductor
07/09/2003CN1428656A Exposure method and device for forming pattern on printing wiring board
07/09/2003CN1428653A Photoresisting agent composition
07/09/2003CN1428470A Length-measuring staying device for weft
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