Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2003
09/16/2003US6621162 High frequency circuit apparatus
09/16/2003US6621157 Method and device for encapsulating an electronic component in particular a semiconductor chip
09/16/2003US6621055 Thermally controlled circuit using planar resistive elements
09/16/2003US6621012 Insertion of electrical component within a via of a printed circuit board
09/16/2003US6621011 Electronic chip component
09/16/2003US6621010 Substrate comprising laminate body with ceramic green sheets, breaking grooves arranged in main surface in grid pattern, multilayer ceramic elements constructed in blocks sectioned by grooves, fracture preventing member crossing grooves
09/16/2003US6621007 Electrical conductor
09/16/2003US6620731 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
09/16/2003US6620722 Bumping process
09/16/2003US6620650 Chip package and method for manufacturing the same
09/16/2003US6620574 Method of treating photoresists using electrodeless UV lamps
09/16/2003US6620513 Base sheet for flexible printed circuit board
09/16/2003US6620456 Forming a dielectric layer by thermal decomposition of a metallo-organic material
09/16/2003US6620345 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
09/16/2003US6620001 Connector for a circuit board
09/16/2003US6619999 Solderless connector for opto-electric module
09/16/2003US6619973 Chip socket assembly and chip file assembly for semiconductor chips
09/16/2003US6619967 Connecting structure of electrical component to electrical junction box
09/16/2003US6619787 Limiting unwanted ink penetration of flexible circuits of fluid ejection devices
09/16/2003US6619786 Tab circuit for ink jet printer cartridges
09/16/2003US6619542 Stamping apparatus having replaceable dies
09/16/2003US6619538 Nickel plating process having controlled hydrogen concentration
09/16/2003US6619531 Temperature control method of solder bumps in reflow furnace, and reflow furnace
09/16/2003US6619301 Ultrasonic processing device and electronic parts fabrication method using the same
09/16/2003US6619198 Method and apparatus for dispensing material in a printer
09/16/2003US6618941 Incorporated into a compressible dielectric material, which forms a compressible pad-on-pad connector between two conducting elements; palladium
09/16/2003US6618940 Fine pitch circuitization with filled plated through holes
09/16/2003US6618939 Resonates with a radio wave transmitted at a particular frequency;stamping out a metal foil having a thermal adhesion adhesive
09/16/2003US6618938 Interposer for semiconductor package assembly
09/16/2003US6618933 Resistance to heat and humidity, producing virtually no voluminal expansion even under the conditions of high temperature and high humidity
09/16/2003CA2293956C Circuit board side interconnect
09/12/2003WO2003075626A1 Heat dissipating device for dissipating heat generated by an electrical component
09/12/2003WO2003075625A2 Certification method for manufacturing process
09/12/2003WO2003075623A2 Digital application of protective soldermask to printed circuit boards
09/12/2003WO2003075409A1 Anisotropic conductive film and method for producing the same
09/12/2003WO2003075340A2 Method for obtaining metal to metal contact between a metal surface and a bonding pad.
09/12/2003WO2003075337A1 Fluxless assembly of chip size semiconductor packages
09/12/2003WO2003075095A1 Photosensitive resin compositions
09/12/2003WO2003074768A1 Conveyorized horizontal processing line and method of wet-processing a workpiece
09/12/2003WO2003074601A2 Printing of organic conductive polymers containing additives
09/12/2003WO2003074268A1 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
09/12/2003WO2003074224A1 Laser machining method
09/12/2003WO2003074222A1 Operating method and trolley for a laser machining system
09/12/2003WO2003035281A3 Ultrasonic printed circuit board transducer
09/12/2003WO2002101828A3 Method for melting down solder material that is applied to connection points
09/11/2003WO2003075393A1 High frequency module
09/11/2003US20030171477 Process for producing novel silicone polymer, silicone polymer produced by the same process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board
09/11/2003US20030171242 Cold cleaning compositions of the microemulsions type
09/11/2003US20030171028 Method and apparatus for optical component mounting
09/11/2003US20030171026 Electrical device
09/11/2003US20030171015 Electrical connector
09/11/2003US20030171014 Electrical connector and circuit board securing structure
09/11/2003US20030171012 Electrical connector
09/11/2003US20030170972 Dynamic solder attach
09/11/2003US20030170568 UV curable powder suitable for use as a photoresist
09/11/2003US20030170454 Outermost layer containing a polyanion and an intrinsically conductive polymer
09/11/2003US20030170450 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
09/11/2003US20030170444 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
09/11/2003US20030170434 Circuit board and method for manufacturing the same
09/11/2003US20030170432 Ceramic electronic device and method of production of same
09/11/2003US20030170431 Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them
09/11/2003US20030170387 Collective method for flush filling of through holes in a substrate
09/11/2003US20030169583 Shielding structure suitable for use with transmitter-receivers
09/11/2003US20030169575 High frequency module
09/11/2003US20030169571 Module and method of manufacturing the module
09/11/2003US20030169556 Ceramic electronic device, paste coating method, and paste coating apparatus
09/11/2003US20030169121 Method and apparatus to attenuate power plane noise on a printed circuit board using high ESR capacitors
09/11/2003US20030169039 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
09/11/2003US20030169038 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
09/11/2003US20030168967 EL sheet
09/11/2003US20030168739 Array structure of solder balls able to control collapse
09/11/2003US20030168733 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
09/11/2003US20030168728 Mounting structure of a semiconductor device
09/11/2003US20030168727 Multi-layer board
09/11/2003US20030168612 Process for precise arrangement of micro-bodies
09/11/2003US20030168583 Photo-detecting device, photo-emitting device and optical wireless communication device
09/11/2003US20030168512 Optical reader having position responsive decode launch circuit
09/11/2003US20030168499 Soldering method and solder joint member
09/11/2003US20030168495 Method of improving the quality of soldered connections
09/11/2003US20030168435 Method and apparatus for laser processing
09/11/2003US20030168434 System and method for forming holes in substrates containing glass
09/11/2003US20030168346 Introducing the semiconductor substrate into the dry area of processing system; moving semiconductor substrate into wet area; processing semiconductor substrate in an electrochemical processing cell; removing unwanted deposits on substrate
09/11/2003US20030168344 Uniform metal deposition across the substrate
09/11/2003US20030168342 For decoupling and power dampening applications to reduce signal and power noise and/or reduce power overshoot and droop in electronic devices
09/11/2003US20030168340 Process and apparatus for electroplating microscopic features uniformly across a large substrate
09/11/2003US20030168256 Package module for an IC device and method of forming the same
09/11/2003US20030168255 Multi-layer printed circuit board and a BGA semiconductor package using the multi-layer printed circuit board
09/11/2003US20030168250 High frequency device packages and methods
09/11/2003US20030168249 Wiring board and method for producing the same
09/11/2003US20030168177 Device and method for core buildup using a separator
09/11/2003US20030168158 Method of film laminating
09/11/2003US20030168150 Method and constrain layer for reducing shrinkage during sintering low-temperature ceramic
09/11/2003US20030168130 Lead-free solder powder material, lead-free solder paste and a method for preparing same
09/11/2003US20030168128 Methods and compositions for oxide production on copper
09/11/2003US20030168006 Method and apparatus for applying viscous or paste material onto a substrate
09/11/2003US20030167941 Solder paste stenciling apparatus for minimizing residue of solder paste
09/11/2003US20030167634 Method of producing electronic parts, and member for production thereof
09/11/2003US20030167629 Multilayer integrated substrate and manufacturing method for multilayer ceramic element
09/11/2003DE20208531U1 Passive electronic element as multilayer structure of molten glass layers with conductive track has recess(es) for functional ceramic body
09/10/2003EP1342816A2 Tin plating method
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