| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/20/2003 | US20030213773 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| 11/20/2003 | US20030213770 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure |
| 11/20/2003 | US20030213767 Electrical circuit board and a method for making the same |
| 11/20/2003 | US20030213619 Ground discontinuity improvement in RF device matching |
| 11/20/2003 | US20030213616 Printed wiring board and electronic device using the same |
| 11/20/2003 | US20030213615 Wiring board, fabrication method of wiring board, and semiconductor device |
| 11/20/2003 | US20030213614 A porous receiving layer is permeated with the fine conductive particles and organometallic compounds from the deposited lamination to provide interlayer connections; electroconductivity |
| 11/20/2003 | US20030213553 Smooth copper surface is contacted with an adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer |
| 11/20/2003 | US20030213384 Stencil design for solder paste printing |
| 11/20/2003 | US20030213124 Method for packaging image sensors |
| 11/20/2003 | DE20314985U1 Milling and boring system for parting off circuit board form surrounding frame has rotating tool with suction hood surrounding it to take off dust from milling operation |
| 11/19/2003 | EP1363483A2 Multilayer printed circuit board laminate and process for manufacturing the same |
| 11/19/2003 | EP1363482A1 Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
| 11/19/2003 | EP1363362A1 Processing of wire ends of a flat cable |
| 11/19/2003 | EP1363328A2 Optical module and optical transceiver module |
| 11/19/2003 | EP1363327A2 High speed electronic interconnection using a detachable substrate |
| 11/19/2003 | EP1363325A1 Member for electronic circuit, method for manufacturing the member, and electronic part |
| 11/19/2003 | EP1362501A1 Electronic device and method of manufacturing the same |
| 11/19/2003 | EP1362500A1 An electronic device and a circuit arrangement |
| 11/19/2003 | EP1362005A2 Method for forming microelectronic spring structures on a substrate |
| 11/19/2003 | EP1257693B1 Composite copper foil and manufacturing method thereof |
| 11/19/2003 | EP1169135B1 Method for dispensing viscous liquid |
| 11/19/2003 | CN2587132Y Laminated detecting equipment of multilayer circuit board |
| 11/19/2003 | CN2587131Y Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
| 11/19/2003 | CN2587130Y Roller cleaning mechanism on circuit board cleaning machine |
| 11/19/2003 | CN1457627A Printing plates |
| 11/19/2003 | CN1457300A Use of electronically active primer layers in thermal patterning of meterials |
| 11/19/2003 | CN1457230A Method and program for acquiring printing circuit board positioning error and electronic circuit component installating system |
| 11/19/2003 | CN1457227A Target position producing method by double or above pressed printing circuit boards |
| 11/19/2003 | CN1457225A Method for producing circuit board by laser ethcing |
| 11/19/2003 | CN1457224A Producing method for copper and copper alloy surface organic corrosion resistant and printing circuit board |
| 11/19/2003 | CN1457223A Implanting repairing method for waste multi-linked printed circuit board |
| 11/19/2003 | CN1457089A Printed circuit board throuth-hole making method |
| 11/19/2003 | CN1128488C Installing method of high-density coaxial junction on printed circuit board |
| 11/19/2003 | CN1128469C Method for connecting electronic device with flexible circuit carrier and flexible electronic carrier |
| 11/19/2003 | CN1128467C Method for packaging integrated circuit |
| 11/19/2003 | CN1128452C Resistance wiring board and method for manufacturing same |
| 11/18/2003 | US6650525 Component carrier |
| 11/18/2003 | US6650457 Rearview mirror constructed for efficient assembly |
| 11/18/2003 | US6650087 Vehicle having an electrical connection box and electrical connection box for use in the vehicle |
| 11/18/2003 | US6650080 Actuating mechanism for setting a manipulatable member in at least two degrees of freedom |
| 11/18/2003 | US6650022 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system |
| 11/18/2003 | US6650016 Flip chips |
| 11/18/2003 | US6650012 Semiconductor device |
| 11/18/2003 | US6649930 Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same |
| 11/18/2003 | US6649864 Method of laser drilling |
| 11/18/2003 | US6649861 Method and apparatus for fabrication of miniature structures |
| 11/18/2003 | US6649852 Micro-electro mechanical system |
| 11/18/2003 | US6649833 Negative volume expansion lead-free electrical connection |
| 11/18/2003 | US6649831 I-channel surface-mount connector with extended flanges |
| 11/18/2003 | US6649516 Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions |
| 11/18/2003 | US6649506 Method of fabricating vias in solder pads of a ball grid array (BGA) substrate |
| 11/18/2003 | US6649448 Method of manufacturing a semiconductor device having flexible wiring substrate |
| 11/18/2003 | US6649444 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 11/18/2003 | US6649327 Applying electroconductive polymer; masking; exposure to radiation; etching |
| 11/18/2003 | US6649325 Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation |
| 11/18/2003 | US6649274 Organic adhesive interface thereby facilitating peeling of the carrier foil |
| 11/18/2003 | US6649038 Electroplating method |
| 11/18/2003 | US6648679 Method and apparatus for optical component mounting |
| 11/18/2003 | US6648663 Locking assembly for securing semiconductor device to carrier substrate |
| 11/18/2003 | US6648655 Land grid array socket with supporting members |
| 11/18/2003 | US6648654 Electrical connector |
| 11/18/2003 | US6648652 Signal transmission connector and cable employing same |
| 11/18/2003 | US6648478 Vehicle mirror system with vehicle heading sensor assembly |
| 11/18/2003 | US6648216 Process and apparatus for flow soldering |
| 11/18/2003 | US6648211 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 11/18/2003 | US6648210 Tombstoning susceptibility and reflow peak temperature reduction; printed circuit boards; mixing with a SnBi alloy powder, which is lower melting to produce a Cu, Ag, Sb, Sn, Bi alloy |
| 11/18/2003 | US6648208 Method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor |
| 11/18/2003 | US6648204 Alignment weight for floating pin field design |
| 11/18/2003 | US6647868 Position adjustment in laser-assisted pressing |
| 11/18/2003 | US6647845 Sheet retainer for punching ceramic green sheet and punching apparatus |
| 11/18/2003 | US6647621 Electrical resistance reduction method for thermosetting conductive epoxy contacts in integrated lead suspensions |
| 11/18/2003 | US6647620 Method of making center bond flip chip semiconductor carrier |
| 11/18/2003 | US6647619 Positioning arrangement and method |
| 11/18/2003 | US6647603 Process for manufacturing electronic device packages |
| 11/13/2003 | WO2003094588A1 A method for attaching a shield can to a pcb and a shield can therefor |
| 11/13/2003 | WO2003094587A1 Improvements relating to heatsinks |
| 11/13/2003 | WO2003094586A1 Circuit board with smd component and cooling body |
| 11/13/2003 | WO2003094585A1 Cooled power switching device |
| 11/13/2003 | WO2003094584A1 Method for creating a trench structure in a polymer substrate |
| 11/13/2003 | WO2003094582A2 A system and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 11/13/2003 | WO2003094256A2 Barrier coatings and methods of making same |
| 11/13/2003 | WO2003094203A2 Direct-connect signaling system |
| 11/13/2003 | WO2003093012A1 Printing screens, frames therefor and printing screen units |
| 11/13/2003 | WO2003047045A8 Plug |
| 11/13/2003 | WO2003039974A3 Package enclosing multiple packaged chips |
| 11/13/2003 | WO2003011607B1 Method for placing indicia on substrates |
| 11/13/2003 | WO2002095091A3 Direct electrolytic metallization of non-conducting substrates |
| 11/13/2003 | US20030212978 Apparatus and method for selecting a printed circuit board |
| 11/13/2003 | US20030211797 Multilayer dielectrics and electroconductive yarns with cavities between; circuit carrier |
| 11/13/2003 | US20030211769 Locking assembly for securing semiconductor device to carrier substrate |
| 11/13/2003 | US20030211761 Low cost integrated out-of-plane micro-device structures and method of making |
| 11/13/2003 | US20030211759 Adapter for surface mount devices to through hole applications |
| 11/13/2003 | US20030211677 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
| 11/13/2003 | US20030211653 Apparatus for providing mechanical support to a column grid array package |
| 11/13/2003 | US20030211426 Method of treating photoresists using electrodeless UV lamps |
| 11/13/2003 | US20030211425 Aqueous acid solubility; crosslinking |
| 11/13/2003 | US20030211406 Process for thick film circuit patterning |
| 11/13/2003 | US20030211328 Blend of epoxy resin, curing agent, phosphate and aluminum hydroxide |
| 11/13/2003 | US20030211302 High foaming ratio, thickness |