Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2003
10/23/2003US20030196987 Ultra fine patterning process for multi-layer substrate
10/23/2003US20030196904 System and method for electrolytic plating
10/23/2003US20030196901 Chemically depositing metals into high aspect ratio structures on substrate; semiconductors
10/23/2003US20030196833 Multilayer printed circuit board and method of manufacturing multilayer printed circuit board
10/23/2003US20030196832 Reconfigurable multilayer printed circuit board
10/23/2003US20030196831 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
10/23/2003US20030196830 Embedded electrical traces
10/23/2003US20030196828 Flat cable and modular rotary anvil to make same
10/23/2003US20030196826 Method of reforming reformable members of an electronic package and the resultant electronic package
10/23/2003US20030196751 Systems and methods for bonding a heat sink to a printed circuit assembly
10/23/2003US20030196749 Porous power and ground planes for reduced PCB delamination and better reliability
10/23/2003US20030196748 Process of fabricating a precision microcontact printing stamp
10/23/2003US20030196551 Filtration of flux contaminants
10/23/2003US20030196512 High-speed fabrication of highly uniform metallic microspheres
10/23/2003US20030196323 Methods for modifying a vertical surface mount package
10/23/2003CA2505014A1 Hermetic encapsulation of organic electro-optical elements
10/23/2003CA2485022A1 Method for connecting substrates and composite element
10/23/2003CA2480854A1 Method for producing a product having a structured surface
10/23/2003CA2480797A1 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003CA2480737A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003CA2480691A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003CA2479823A1 Method for the production of structured layers on substrates
10/22/2003EP1355522A2 Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus
10/22/2003EP1355521A2 Printed circuit board and restoration thereof
10/22/2003EP1355520A2 Partition plate for laminating multilayer stacks and method for joining of copperfoils with partition plates
10/22/2003EP1355519A2 An improved method to embed thick film components
10/22/2003EP1355518A1 Flexible printed wiring board
10/22/2003EP1355381A2 Substrate, connecting structure and electronic equipment
10/22/2003EP1355353A2 Compact circuit carrier package
10/22/2003EP1355324A1 Conductive powder and conductive composition
10/22/2003EP1355187A1 Process for connection of a printed circuit board to a liquid crystal display
10/22/2003EP1354982A1 Method for enhancing the solderability of a surface
10/22/2003EP1354937A1 Cleaning solvent and dispenser
10/22/2003EP1354503A1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
10/22/2003EP1354502A2 High frequency printed circuit board via
10/22/2003EP1354385A2 Securing electrical conductors
10/22/2003EP1354351A2 Direct build-up layer on an encapsulated die package
10/22/2003EP1354326A1 Flexible strip cable
10/22/2003EP1354237A2 Fat conductor
10/22/2003EP1354077A1 Method for the continuous deposition of a nickel-containing coating on a metallic film
10/22/2003EP1353804A2 Ink-jet printer having carriage and flexible circuit movably connected, method and apparatus
10/22/2003EP1353773A1 Method of laser milling
10/22/2003EP1201108B1 A circuit singulation system and method
10/22/2003EP1119437B1 Device for treating a substrate with laser radiation
10/22/2003EP0792517B1 Electrical contact structures from flexible wire
10/22/2003CN2582333Y Adjustable type and frame-shaped fixture for circuit board
10/22/2003CN2582332Y Fixture for preventing pin components of circuit boad from being floating and inclined
10/22/2003CN1451097A Testing device for printed boards
10/22/2003CN1451031A Method for roughening copper surfaces for bonding to substrates
10/22/2003CN1450954A Freestanding reactive multilayer foils
10/22/2003CN1450939A Cleaning processes using hydrofluorocarbon and/or hydrochlorofluorocarbon compounds
10/22/2003CN1450851A Positioning method for support pin of printed circuit board
10/22/2003CN1450849A Insulation material for printed circuit board and method for making printed circuit board by same
10/22/2003CN1450729A Multi-layer substrate and satellite transmission receiver
10/22/2003CN1450612A Method for forming convex point on back side of single side flexible sustrate
10/22/2003CN1450574A Electronic device with extenal terminals and mfg method thereof
10/22/2003CN1449914A Screen printing method
10/22/2003CN1125582C Method and apparatus for recovering solder materials
10/22/2003CN1125508C Printed board, mfg method therefor and structure for connecting conductor elements to printed board
10/22/2003CN1125384C Mutli-tool positioning system
10/22/2003CN1125002C Method for reducing shrinkage during firing of ceramic bodies
10/22/2003CN1124922C Injection molding encapsulation for an electronic device directly onto a substrate
10/21/2003US6636679 Fiber optic cable saddle
10/21/2003US6636416 Electronic assembly with laterally connected capacitors and manufacturing method
10/21/2003US6636409 Surge protection device including a thermal fuse spring, a fuse trace and a voltage clamping device
10/21/2003US6636406 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
10/21/2003US6636143 Resistor and method of manufacturing the same
10/21/2003US6636108 Filter circuit and electronic device using the same
10/21/2003US6635955 Molded electronic component
10/21/2003US6635829 Circuit board having side attach pad traces through buried conductive material
10/21/2003US6635827 Flat cable covering and flat cable using same
10/21/2003US6635824 Junction connector for wire harnesses
10/21/2003US6635585 Method for forming patterned polyimide layer
10/21/2003US6635553 Microelectronic assemblies with multiple leads
10/21/2003US6635513 Pre-curved spring bolster plate
10/21/2003US6635511 Integrated ball grid array-pin grid array-flex circuit interposing probe assembly
10/21/2003US6635410 Metallizing method for dielectrics
10/21/2003US6635403 Lithography apparatus, lithography method and method of manufacturing master print for transfer
10/21/2003US6635308 Perforated support plate with insertion of support structure
10/21/2003US6635184 Method for pattern-etching alumina layers and products
10/21/2003US6635157 Electro-chemical deposition system
10/21/2003US6635123 Immersing in benzotriazole and zinc salt; oxidation resistance protective coatings for printed circuits; solderabilty, wettability, adhesion
10/21/2003US6634893 Electrical connector having retention contact tails and non-retention contact tails for retaining to a PCB prior to soldering as well as reducing force of inserting the contact tails to the PCB
10/21/2003US6634890 Spring-loaded heat sink assembly for a circuit assembly
10/21/2003US6634545 Solder ball delivery and reflow method
10/21/2003US6634543 Method of forming metallic z-interconnects for laminate chip packages and boards
10/21/2003US6634290 Mask-printing apparatus and method including inspection of printed material and re-printing step
10/21/2003US6634100 Interposer and methods for fabricating same
10/21/2003US6634099 Soldermask opening to prevent delamination
10/21/2003US6634098 Methods for assembling, modifying and manufacturing a vertical surface mount package
10/21/2003US6634092 Apparatus for replacing parts connected to circuit board
10/21/2003US6634086 Method for connecting a head interconnect circuit with alignment finger to a printed circuit
10/16/2003WO2003086038A1 Multi-layer integrated circuit package
10/16/2003WO2003086037A1 Method of manufacturing an electronic device
10/16/2003WO2003086036A1 Printed circuit board with a coil recessed in a void
10/16/2003WO2003086035A1 Circuit board device for information apparatus, multilayered module board, and navigator
10/16/2003WO2003086034A1 Electrically insulating body, and electronic device
10/16/2003WO2003085731A1 Semiconductor device and method of manufacturing same
10/16/2003WO2003085728A1 Carrier, method of manufacturing a carrier and an electronic device
10/16/2003WO2003085703A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof
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